Jedec Releases Plans for Memory Module Standards
ARLINGTON, VA – Jedec has announced upcoming standards for advanced memory modules designed to power the next generation of high-performance computing and AI applications.
The standards for DDR5 multiplexed rank dual inline memory modules (MRDIMM) and a next-generation compression-attached memory module (CAMM) for LPDDR6 are set to change the industry with unparalleled bandwidth and memory capacity.
DDR5 MRDIMMs offer an innovative, efficient new module design to enhance data transfer rates and overall system performance. Multiplexing permits multiple data signals to be combined and transmitted over a single channel, effectively increasing bandwidth without the need for additional physical connections and providing a seamless bandwidth upgrade to enable applications to exceed DDR5 RDIMM data rates. Other planned features include:
- Platform compatibility with RDIMM for flexible end-user bandwidth configuration
- Utilization of standard DDR5 DIMM components including DRAM, DIMM Form Factor & Pinout, SPD, PMIC, and TS for ease of adoption
- Efficient I/O scaling using RCD/DB logic process capability
- Leverage existing LRDIMM ecosystem for design and test infrastructure
- Support for multi-generational scaling to DDR5-EOL.
The Jedec MRDIMM standard is set to deliver up to twice the peak bandwidth of native DRAM, enabling applications to surpass current data rates and achieve new levels of performance. It maintains the same capacity, reliability, availability, serviceability (RAS) features as Jedec RDIMM. The committee aims to double the bandwidth to 12.8Gbps and increase the pin speed. MRDIMM is envisioned to support more than two ranks and is being designed to utilize standard DDR5 DIMM components ensuring compatibility with conventional RDIMM systems.
Plans are underway for a tall MRDIMM form factor to offer higher bandwidth and capacity without changes to the DRAM package. This taller form factor will enable twice the number of DRAM single-die packages to be mounted on the DIMM without the need for 3DS packaging.
As a follow-on to Jedec’s JESD318 CAMM2 memory module standard, JC-45 is developing a next-generation CAMM module for LPDDR6 targeting a maximum speed greater than 14.4 GT/s. As planned, the module will also offer a 24-bit subchannel, a 48-bit channel and a connector array.
Both projects are in development in Jedec’s JC-45 Committee for DRAM Modules. Jedec standards are subject to change during and after the development process.
Renesas Completes $5.9B Altium Acquisition
TOKYO – Renesas in August announced the successful completion of its $5.9 billion acquisition of Altium, which was first announced in February.
The combination sets the foundation for Renesas and Altium to create a common electronics system design and lifecycle management platform, Renesas said in a release. The platform will integrate and standardize various electronics design data and functions and enhance component lifecycle management, delivered in digital iterations.
“This is a historical milestone for both Renesas and Altium as we take another important step forward in bringing enhanced user experience for electronics system designers,” said Hidetoshi Shibata, CEO, Renesas. “The integrated and open electronics system design and lifecycle management platform we aim to build together will make electronics accessible to broader market, for any enterprises regardless of their size or industry. I want to reaffirm that our commitment to upholding data security and compliance of the Altium customers will continue to be our top priority.”
With the transaction now closed, Altium is now a wholly owned subsidiary of Renesas. Altium CEO Aram Mirkazemi has assumed the role of senior vice president and head of Renesas’ Software & Digitalization. He concurrently serves as CEO of Altium.
“This is a pivotal moment for Altium and marks the beginning of an exciting future with Renesas,” Mirkazemi said. “With Renesas’ support and expertise, we are looking forward to accelerating the cloud-enablement of all industry processes associated with electronics design and development. This will make electronics accessible to a broader market and lay the foundation for software-defined products.”
SIA Report Provides Recommendations for Domestic Semiconductor Growth
WASHINGTON – A new report from SIA and the Boston Consulting Group identifies five primary factors that impact investment decisions for semiconductor companies. “Attracting Chips Investment: Industry Recommendations for Policymakers” also lays out actionable recommendations for governments seeking to grow their domestic semiconductor industry.
Among the factors:
- Investment and operational costs. Semiconductor development, in both design and manufacturing, is expensive. In evaluating site options, companies thoroughly analyze site-specific costs, including land, utilities, equipment, materials, labor, and taxes. Government support programs that are simple, flexible, and offset construction and equipment costs are attractive to semiconductor investors.
- Semiconductor companies require access to a large technical workforce. They seek countries where the education system and public-private partnerships coalesce to generate a rich talent pipeline—from technicians and skilled trades to Ph.D-level engineers and scientists. Governments that adopt comprehensive workforce development and labor policies to build an industry-ready talent pipeline will be well-placed to draw investment from the semiconductor industry and other strategic technology sectors.
- Safe, reliable, and cost-efficient water, utilities, communications, and transportation infrastructure are critical for semiconductor operations. Small interruptions in operations can incur significant costs. Governments should invest in electricity grids that are able to maintain day-to-day stability, provide a portion of energy from green sources, and ensure communications and transportation networks are sufficient to support semiconductor industry needs.
- Regulatory and trade environment. Semiconductor supply chains are concentrated in countries with market-friendly trade policies, and regulatory frameworks that respect intellectual property rights and trade compliance. Policymakers can facilitate semiconductor investments by implementing policies that minimize trade and permitting costs, streamline administrative processes, and facilitate the movement of semiconductor products and data.
- Integrated ecosystems. Semiconductor companies thrive on vibrant ecosystems that cluster suppliers, customers, R&D partners, educational partners, and innovative talent.
Governments seeking to present their countries as a destination for semiconductor companies to invest must move quickly and deliberately to take advantage of this window of opportunity, mindful that other governments are competing for such investments, the report says.
The policy recommendations, if followed, can position countries to attract chip ecosystem investments that complement industry operations in the United States, and drive greater security, resilience, and diversification in global semiconductor supply chains, the report concludes.
Long Young to Build 2 Thai Factories
KUNSHAN, CHINA – Long Young Electronic has announced plans to invest CNY200 million ($28 million) to build two new factories in Thailand.
The Chinese supplier of electromagnetic interference shielding materials said it will spend up to CNY120 million ($16.8 million) on a composite copper foil plant and CNY80 million ($11.2 million) on an EMI shielding materials plant in Thailand’s northern Chachoengsao province.
The company said the composite copper foil plant will take four years to construct and is designed to produce various types of products, targeting printed circuit board makers in Southeast Asia and other markets. The other factory will be built in three years with a production capacity of 62,400 sq. m. of conductive tape and 352 million EMI shielding and related materials a year.
To pay for the new facilities, Long Young said it will terminate a plan to build a new EMI shielding material plant and expand the capacity of an existing one in China and will suspend construction of a product research and development center.
Benchmark Expands Romanian Facility
TEMPE, AZ – Benchmark Electronics has opened an expansion at its Brasov, Romania, facility that more than doubles its manufacturing capacity in the region.
The EMS company said the expansion is intended to support customer-driven demand for access to high-technology manufacturing solutions, localized and global supply chains, and a customer-focused team committed to optimizing delivery, quality, cost, and manufacturing and engineering services. Key market sectors serviced include complex industrials, medical and semiconductor capital equipment.
“Benchmark Brasov, alongside Benchmark Almelo, serves as the heart and soul of our European operations and we are excited to expand our manufacturing footprint, add capacity to better serve our current customers, and support the high interest by new customers who are looking to regionalize their manufacturing in Europe,” said Jeff Benck, president and CEO, Benchmark. “The new space will offer our manufacturing and engineering teams ample room to expand our operations in eastern Europe while also bringing more high-paying jobs to the Brasov community.”
The expansion of Brasov is part of a broader company strategy to increase manufacturing capacity around the world by leveraging its current facilities and leadership as more customers look to diversify their manufacturing strategy and have products built closer to end-market consumption, the company said, and the new space not only provides new manufacturing space, but also improves system integration and workflow on the floor.
“It is an honor to welcome our partners, suppliers and the local community for the unveiling of our expanded Brasov facility,” said Herman Bartelink, vice president of European operations, Benchmark. “We’re looking forward to adding new capabilities and bringing more business and jobs to the region. This expansion has been a long time coming and I am very proud of the work of our European team in reaching this milestone.”
Kimball Sells AT&M Unit to Averna
JASPER, IN – Kimball Electronics has completed the sale of its automation, test and measurement business to Averna, and said it plans to focus on its core EMS business.
The sale to Averna Technologies closed on Jul. 31, with proceeds from the transaction being used for support of organic growth, debt reduction and share repurchases, Kimball said in a release. Financial terms of the sale were not disclosed.
Kimball entered the automation, test, and measurement industry with the acquisition of Global Equipment Services in 2018, and in May 2024 announced that the unit was for sale. The AT&M business provides advanced testing and inspection solutions for manufacturers in the industrial, medical, consumer electronics, and semiconductor sectors.
“While we have made significant strides enhancing our capabilities in AT since the acquisition of GES, we determined that it is not a good strategic fit for Kimball and that focusing on core EMS operations aligns best with strategic priorities and longer-term growth opportunities for the company,” said CEO Richard Phillips. “AT will be well-positioned under new ownership with expertise in testing and measurement, broad industry knowledge, and established client relationships. We thank the team for their contributions and wish them success moving forward.”
“The addition of the GES team, and its footprint in Silicon Valley and Asia, is a perfect fit for Averna,” said Francois Rainville, CEO, Averna. “This will further strengthen our position as one of the worldwide leaders focused in automation, test and measurement. Now with 1,200 professionals spanning across the Americas, Europe and Asia, we can better partner with our global customers in all aspects of their product test requirements, wherever they are. We welcome our new teammates and are looking forward to this new chapter in Averna’s story.”
Meiko to Open Vietnam PCB Factory in 2025, Partners with Aoshikang
AYASE, JAPAN – Meiko Electronics is planning to begin production at its $100 million PCB factory in Vietnam in the second quarter of 2025.
According to project’s latest report, the company aims to finish construction of the factory by the third quarter of this year, install equipment during the end of the year and early 2025, recruit and train staff during the first quarter and enter official operation in the second quarter.
When finished, the factory will have an annual production capacity of 80,000 sq. m. The company also plans to build a second factory on the site, upping its total investment to $500 million. The factories will produce PCBs for peripheral devices, computers, electronic home appliances, audio-visual equipment, solar cells, microprocessor chips and controllers.
Meiko also announced a strategic business alliance with Aoshikang Technology to boost PCB production capacity in the ASEAN region.
Through the partnership, Meiko will invest $20 million for a 14.9% stake in ASK’s subsidiary, Jiaruian, to manage a new production subsidiary in Thailand. Meiko said the collaboration aims to meet increasing demand and will have a negligible impact on its current fiscal year business results.
Bain Capital to Acquire Italian PCB Maker Somacis
LONDON – Private investment firm Bain Capital has announced the acquisition of a controlling stake in Somacis, an Italian PCB manufacturer, from Chequers Capital.
Chequers will reinvest into the company alongside the management team, led by CEO Giovanni Tridenti. Other terms of the deal were not disclosed.
Somacis was founded in 1972 and specializes in high-mix/low-volume, and mission-critical PCBs. The company serves various high-performance markets such as aerospace & defense, MedTech, and data centers/AI, among others, and operates across the full value chain, offering R&D prototyping, ramp-up and end-to-end production. The company has a global footprint composed of five facilities in Europe, North America and Asia.
“Given its strength in the market, Somacis is well-positioned to benefit from sustainable long-term reshoring tailwinds which increase the demand for PCBs manufactured in the US and EU,” said Ivano Sessa, partner and co-head of European Industrials, Bain Capital. “We are pleased to back one of the leaders in its field.”
“I would like to thank Chequers for their valuable partnership and outstanding work over the past years and am pleased that they will remain invested alongside our fully committed management team as we are joined by Bain Capital,” said Tridenti. “We are excited for Bain Capital to bring its expertise in international development and operational capabilities to further enhance our global reach and help us fulfil our long-term ambitions, which are underpinned by a mix of organic and inorganic strategic growth initiatives, and on the strengthening of the value-add proposition to our customers.”
“Over the past years, we have worked alongside the Somacis management team to strengthen the company’s operations and positioning and to make strategic acquisitions,” said Philippe Guérin, managing partner, Chequers Capital. “We are very pleased to reinvest alongside Bain Capital and such an excellent management team with the goal to become the number one global player in our segment.”
SEMI Publishes Recommendations on Outbound Investments
BRUSSELS – SEMI has published recommendations to advance the European semiconductor industry in response to the European Economic Security Strategy.
The European Commission has outlined the nonbinding roadmap to monitor outward investment transactions with the goal of preventing technology and knowledge leakage in four critical technology areas tied to advanced semiconductor technologies.
The SEMI Europe Recommendations on Outbound Investments outline the association’s position and strongly encourage all policymakers involved to carefully consider the following key recommendations:
- Ensure that European semiconductor companies are as free as possible in their investment decisions to avoid losing their agility and relevance across global markets.
- Adopt a pragmatic risk-based approach to comprehensively assess which outbound transactions related to advanced semiconductor technologies could result in technology leakage for dual-use purposes.
- Provide further clarification on how any potential measures would affect intra-company investments and relations with non-EU subsidiaries, given the international exposure of semiconductor companies.
- Develop an approach to outbound investments that effectively contributes to greater economic security through close consultations between European institutions, member states, and all relevant industry stakeholders.
- Maximize the synergies and positive feedback effects that the semiconductor supply chain has in increasing competition, cross-border investments and transnational collaboration.
The recommendations emphasize the need for the European Commission to adopt a positive approach to economic security that recognizes the crucial role of cross-border investments for the functioning and prosperity of the European semiconductor industry, to guarantee its companies have a high level of agility and market access at the global level.
“Within our industrial ecosystem, outbound investments are regarded by the vast majority of SEMI members as essential to scale production, expand capabilities, access emerging markets, and engage in innovative partnerships,” said Laith Altimime, president of SEMI Europe.
SEMI will continue to engage with relevant stakeholders to contribute to the political debate and encourage a legislative framework that can enhance economic security across industrial supply chains while preserving Europe’s technological competitiveness.
ECIA Guide Advises Approved Channel Buying
ATLANTA – An Electronics Component Industry Association (ECIA) committee in August released an advisory to use only the authorized channel to procure electronic components. With the double threat of a steep rise in bad actors with new tools to sell fake components, combined with more frequent supply chain disruptions, it is an especially critical time to be vigilant, the trade group’s Global Industry Practices Committee (GIPC) said.
The GIPC Guideline, “The Risks of Buying Components Outside the Authorized Channel,” is available from the trade group’s website.
“These guidelines spell out the specific risks taken when going outside the safety of the authorized channel to buy electronic components,” explained Don Elario, ECIA Vice President of Industry Practices. “We urge customers to seriously consider the consequences that can occur when a counterfeit component infiltrates their BOM: catastrophic failure, brand damage, liability, and so on. Our document contrasts those risks with the assurances that come from the authentic chain of custody from the component manufacturer through the authorized channel.”
Bank Exits Welsh Electronics Manufacturer After Funding Buyout
TREDEGAR, UK – The Development Bank of Wales has exited Camtronics six years after funding a management buyout of the contract electronics manufacturer.
In 2018, the Development Bank’s Wales Management Succession Fund Investment Fund invested £450,000 ($584,000) in the company to enable managing director Paul Macleur, alongside colleagues Chris Gulliford and Linda Sterry, to lead a management buyout from Photonstar, who had purchased the company in 2011.
The Development Bank also introduced non-executive director Mark Pulman to the company at the time, and since the buyout, Camtronics’ turnover has doubled to £4 million ($5.2 million).
“As we embark on the next stage of our growth, the time was right to reflect on how the support of the Development Bank has enabled us to build a strong foundation for the future,” said Macleur. “We have enjoyed the benefit of having an excellent working relationship with the team who have stood by us throughout, offering guidance and significant support in addition to funding. Together with Mark, they have helped with our strategic planning and long-term value creation which means that we are now in a position to buy them out. As the sole owners of the business, we are now well-placed to move forward and continue to grow our industry-leading services.”
Camtronics offers a full range of electronics manufacturing services and has 38 employees. Services include SMT assembly, AOI, through-hole assembly, box build, programming and testing.