Nippon Denkai to Close Last Remaining US Copper Foil Plant

AUGUSTA, GA – Nippon Denkai has decided to close and liquidate its copper foil manufacturing plant here, the last such factory in the United States.

Denkai America Inc., the US-based subsidiary of the Japanese company, will close just two years after its parent company heralded the site as the future of foil production, with tens of millions of dollars in investments planned and hundreds of new jobs expected.

The company cited financial problems stemming from semiconductor shortages, decreased exports of domestically manufactured batteries, lower demand for smartphones, and other factors for the decision. The continued losses, coupled with loan payments coming due and dried-up sources of new capital, have rendered the company insolvent.

Denkai America announced in 2022 the planned investment of some $150 million in the plant to make copper foil. It took combined losses in the 2023 and 2024 fiscal years of about $23 million tied to the plant.

For its fiscal year ending March 2025, decreased sales and a rapid increase of copper prices, plus an impairment loss related to the Augusta plant, led to first-half consolidated ordinary losses of approximately 1.5 billion yen ($9.9 million) and a consolidated net loss of approximately 5 billion yen ($33 million).

In addition to the deterioration of its performance in and after the fiscal year ended March 2023, the company’s cash flow gradually deteriorated as a result of proceeding with the reconstruction of manufacturing facilities in the American subsidiary’s previous plant in Camden, SC, and investments in foil manufacturing facilities in the Augusta plant.

Attempts to find additional funding have stalled, Denkai said in a statement.

In November, the company filed a petition for commencement of civil rehabilitation proceedings. Under the supervision of the Tokyo District Court, Nippon Denkai will continue its business while seeking a buyer. Sumitomo Mitsui Banking is providing up to 2 billion yen as DIP financing for the company’s future fund-raising, and Nippon Denkai is being delisted from the Tokyo Stock Exchange.

EU Set to Approve Synopsys-Ansys Deal; UK Watchdog Raises Concerns

BRUSSELS – Synopsys’ $35 billion acquisition of Ansys is reportedly set to win conditional EU antitrust approval after the company pledged to address competition concerns, while the UK debates permitting the deal to go through.

Reuters reported that the European Commission, which acts as the EU’s antitrust enforcer, is set to approve the deal after Synopsys offered to sell its optical design tool maker Optical Solutions Group and Ansys PowerArtist.

The company is expected to offer the same remedies to the UK’s Competition and Markets Authority, which also raised concerns about the potential for reduced competition in the semiconductor chip design and light simulation markets, Reuters reported.

Synopsys and Ansys announced a $35 billion merger in January, with the goal of combining Synopsys’ semiconductor electronic design automation with Ansys’ broad simulation and analysis portfolio to create a design leader.

The CMA said its concerns about the merger include the reduction of choice among customers who use the two companies’ products, which could lead to a loss of innovation, lower quality software and/or higher prices which may then be passed onto UK businesses and consumers.

The CMA’s investigation, which examined the impact of the merger across a range of semiconductor chip design and other software markets, looked at the extent to which Synopsys and Ansys currently compete or may do so in the future. The CMA found that while the companies’ products are largely complementary, the deal could reduce competition in the supply of three software areas where Synopsys and Ansys have strong market positions and compete closely.

The CMA said its concerns relate to global register transfer level power consumption analysis, which is used to check how much power a chip consumes and requires to function, as well as global optics software and photonics software, which are used to design and model light-related products.

“Synopsys and Ansys are important suppliers of semiconductor chip design and light simulation software, and we’re concerned that this deal could reduce innovation and lead to higher prices for these products in the UK,” said Naomi Burgoyne, senior director of mergers at the CMA. “Millions of businesses and consumers in the UK use products that rely on these companies’ software every day, whether that’s consumer electronic devices, medical equipment, modern vehicles or even AI.”

The companies now have the opportunity to offer solutions to address the CMA concerns, otherwise the deal will be referred to a more in-depth investigation.

DBG Technology to Acquire All Circuits

MEUNG-SUR-LOIRE, FRANCE – All Circuits, one of France’s largest EMS providers, is set to be acquired by China’s DBG Technology at the beginning of 2025.

With the acquisition, All Circuits will add China to its manufacturing footprint, as well as India and Vietnam, which, alongside Mexico, are seen as winners in the move to reduce dependency on China as the factory of the world, the company said.

DBG, which also has a facility in Bangladesh, will gain additional capacity in France, Tunisia and Mexico.

“We’re excited to have manufacturing in China for our customers that are selling products in China, as well as having a solid footprint elsewhere in Asia where demand is strong,” said Bruno Racault, president, All Circuits. “This along with our own sites in Europe, North Africa and North America will deliver outstanding global manufacturing choices to our current and future customers.”

The acquisition discussions could result in the signing of a final agreement this spring, All Circuits said in a release. This agreement would create a combined production capacity of more than 150 SMT lines, design offices, and complementary sector specializations (primarily in telecommunications for DBG Technology and automotive for All Circuits).

Under the integration, All Circuits’ current management team would retain operational control of the company, which would continue to operate independently under its current name.

“This proposed partnership represents a major milestone in our company’s history, offering solutions across international markets to produce closer to our clients’ needs while maintaining and strengthening our position in Europe,” said Racault. “It will enhance our ability to innovate and serve our customers with the same level of excellence and commitment in an ever-evolving global context. All Circuits would like to express its gratitude to IEE S.A. and its shareholder for their strategic cooperation over the past 10 years, which has significantly contributed to the company’s rapid growth. All Circuits will continue to serve IEE S.A. as one of its key customers in the global electronics manufacturing sector.”

AI-Based Design Startup Raises $6.8M in Seed Funding

MONTREAL – Cadstrom, an AI startup that aims to allow electronic design with minimal respins, announced that it has raised $6.8 million in seed funding.

Founded in 2023 by Margot Blouin and Scott Bright, Cadstrom builds AI tools enabling electrical engineers to create devices that work correctly on their first attempt. Its proprietary Sigma Engine uses a first-principles understanding of physics, electronics and generative AI to identify mistakes while automatically validating complex designs – cutting development costs, accelerating GTM timeline and shortening design cycles up to 66% by eliminating respins, the company said.

“We founded Cadstrom to address the reality that most electronics designs require several time-consuming revisions, and the problem is getting worse as electronics, AI, and connectivity becomes increasingly ubiquitous. Our vision is one where every engineer can achieve robust designs on their first build and get to market faster,” said Blouin. “This funding represents a critical milestone for our team, and we’re excited to put the capital to work to further develop our automated verification tools that detect and address the most common issues that electrical engineers face.”

The round was led by Bison Ventures and included participation from Innovation Endeavors and AI2 Incubator, which previously invested $650,000 in a pre-seed round.

“Cadstrom’s approach is bringing unprecedented progress to the Testing, Inspection, and Certification market,” said Tom Biegala, founding partner, Bison Ventures. “[Blouin and Scott Bright] built the product they desperately needed as hardware engineers: By improving one of the most tedious parts of PCB development, Cadstrom helps engineers be more productive and bring validated hardware to market at remarkable speeds. This is in stark contrast to tools seeking to replace engineers with ineffective AI.”

Cofactr Raises $17M in Series A Funding

NEW YORK – Cofactr, a provider of a supply chain and logistics management platform for hardware manufacturers, has raised $17.2 million in a series A investment round.

Bain Capital led the Series A round, with existing investors Y Combinator, Floating Point Ventures, Broom Technologies and DNX Ventures also participating. The company said it will use the funding to grow its go-to-market efforts and its suite of supply-chain risk management and process tools. It also plans to introduce additional product categories, with multiple applications slated to launch each year.

Cofactr’s platform integrates procurement automation, supply chain data intelligence and logistics infrastructure to streamline the manufacturing process for hardware teams, allowing them to source, quote, procure, manage, kit and ship electronic components through the same platform.

“Traditional supply chain management has left serious gaps for innovative companies navigating the electronics and mechanical spaces. We’re filling them by creating a seamless link between product lifecycle management (PLM), enterprise resource planning and manufacturing execution systems (MES),” said Matthew Haber, CEO and cofounder of Cofactr.

“For these companies, it’s not agility or rigor – it’s both. We’re giving oversight departments the control visibility, and processes they require while giving product engineers the tools they need to get products to market fast,” added Phillip Gulley, the company’s chief strategy officer and cofounder.

Cofactr said its platform is currently used by more than 50 customers, including the robotics division of the world’s largest e-commerce marketplace, the hardware division of the world’s largest social media company and the world’s leading self-driving car manufacturer.

“In mission-critical industries such as aerospace, defense, automotive and robotics, electronic components represent 70% of the bill of materials, yet existing procurement and supply chain software is generic and not built for the speed and requirements of electronics,” said Ajay Agarwal, partner at Bain Capital Ventures. “Cofactr is the first modern AI solution for end-to-end electronics procurement and logistics that meets the needs of engineers, procurement teams and suppliers.”

GreenSource Plans UHDI PCB Facility in NH

CHARLESTOWN, NH – GreenSource Fabrication has received additional funding for its planned 98,000 sq. ft. UHDI PCB manufacturing facility here.

The New Hampshire Business Finance Authority (NHBFA) board unanimously approved a bond of up to $50 million to support the project, with the approval also involving the US Department of Defense as a funding partner, the New Hampshire Business Review reported.

GreenSource, a subsidiary of Whelen Engineering, launched in 2019 and previously received a $46.2 million grant from the DoD to enhance its capabilities in defense-sector UHDI PCB manufacturing.

The company said the funds will be allocated toward advanced manufacturing equipment for the new facility to boost production quality, support national security initiatives and diversify its client base.

With the expansion, GreenSource plans to retain 142 existing jobs and create an additional 50-100 jobs. In addition, Whelen and GreenSource will collaborate with New Hampshire high schools and colleges to recruit talent and provide internships and full-time opportunities.

“This facility represents a monumental investment in the future of American manufacturing,” said Ashish Jain, CEO of GreenSource Fabrication. “Our partnership with the NHBFA and the DoD underscores our shared vision for innovation, security and sustainability.”

Ventec Chooses Thailand for PCB Material Manufacturing Facility

SUZHOU, CHINA – Ventec has selected Thailand as the location for a $17 million PCB material manufacturing facility.

The company said the new facility will be built on 8.4 acres in the Hi-Tech Industrial Estate north of Bangkok in Ayutthaya Province, reinforcing its commitment to global supply chain resiliency by expanding its manufacturing footprint beyond China and Taiwan, as well as customer proximity in the developing Southeast Asia PCB manufacturing hub.

Ventec announced in June 2023 that it would establish a manufacturing base in Southeast Asia to diversify geographical risk and enhance support for growing customer demand. Construction is scheduled to commence in the second quarter of 2025, and full production will start in the first quarter of 2026. The facility will offer cutting-edge production capabilities across two phases, achieving a capacity of 150,000 sheets per month in the first phase, the company said.

Ventec said it selected Thailand for its new manufacturing facility due to several factors, including the diversification of geographical risk by expanding beyond existing hubs in China and Taiwan and the country’s emergence as a leading PCB manufacturing hub outside China.

Additionally, Thailand offers a robust logistics infrastructure with reliable international shipping routes, which ensures fast delivery times, and the country’s strong support for the electronics manufacturing sector provides a favorable environment for efficiency and cost-effectiveness, benefiting customers across all regions, the company said.

“Now is the right time to invest in establishing an additional manufacturing presence in Thailand to support the expanding Southeast Asian electronics industry, which is experiencing significant growth across consumer, industrial, and automotive sectors,” said CEO Jason Chung. “This new factory will enhance our supply chain security promise to our global PCB and OEM customer base as we plan to manufacture the complete portfolio of advanced high-reliability and high-performance materials.”

“The addition of our Thailand factory strategically positions Ventec to better serve our customers worldwide,” said Mark Goodwin, COO, EMEA & Americas. “Thailand’s robust logistics infrastructure enables faster shipping times, and exceptional supply chain reliability. As Thailand strengthens its position as a leading PCB manufacturing hub, we can deliver unrivaled value to our customers by ensuring their supply chains remain agile and competitive, whilst also addressing the geopolitical and geographical diversity of manufacturing footprint requirements of some key customers and market sectors. The new facility underscores Ventec’s leadership in delivering high-reliability and high-performance PCB materials for applications in automotive, aerospace, communications, and more.”

OKI Improves Heat Dissipation with Stepped Copper Coin Insertion

TOKYO – OKI Circuit Technology has developed multilayer PCB technology with stepped copper coin insertion, which reportedly achieves 55 times better heat dissipation than conventional PCBs.

The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB, and OKI said it is working to develop mass-production technologies with the aim of PCBs with the new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.

In 2015, OKI developed proprietary design and mass production technologies for multilayer PCBs based on copper coin insertion. This innovation embeds cylindrical copper coins with high thermal conductivity into PCB through-holes and bonds them to heat-generating electronic components to dissipate heat to the substrate’s underside.

The use of copper coins that transfer heat to the underside of the PCB achieves high heat dissipation efficiency in cases where it is not possible to mount heat-dissipating devices directly to electronic components due to the device’s dimensional constraints or where heat-dissipating devices cannot be mounted to certain functional surfaces (e.g., image sensors or light-emitting components). This time, OKI said it has made further progress with this technology and succeeded in developing the stepped copper coin that achieves approximately twice the heat dissipation efficiency.

The newly developed stepped copper coin features a larger heat-dissipating area relative to the bonding surface with the heat-generating electronic component to improve heat conduction efficiency. Additionally, aiming for an optimal heat dissipation structure to suit the shape of each electronic component, a rectangular type featuring a rectangular component installation surface and rectangular heat-dissipating surface has been developed, in addition to the conventional circular type, to increase the contact area and heat-dissipating area for rectangular electronic components to improve heat dissipation efficiency.

Both types can be customized to obtain an optimal heat dissipation structure for the given shapes of the mounted component, the PCB itself and the substrate thickness, OKI said.

Meiko Plans $300M PCB Fab Expansion in Hanoi

HANOI – Meiko Electronics reportedly plans to invest $300 million to build a new PCB fabrication facility here.

The new investment by Meiko will build its fourth PCB plant in the city and will raise its total investment in the area to $800 million, The Investor reported.

The new construction is scheduled to be completed in March 2027, with operation beginning the following month. The project, located in Thach That-Quoc Oai Industrial Park, now employs 3,770 people and is set to increase the workforce to 4,170 with the expansion.

With the expansion, the company’s PCB fabrication in Hanoi will reach an annual capacity of 2.16 million sq. m. of plated through-hole PCBs, 540,000 sq. m. of flex PCBs, and 2.2 billion electronics manufacturing service (EMS) items.

Icape Group Acquires UK PCB Distributor, Minority Stake in Green PCB Developer

FONTENAY-AUX-ROSES, FRANCE – Icape Group has announced the acquisition of 100% of the capital of ALR Services, a British PCB distributor.

With the acquisition, Icape expands its business in the UK while integrating a local structure renowned for its expertise and commitment to continuous improvement, the company said, while ALR Services now has access to a greater range of services and the full purchasing power of Icape.

“We are delighted to integrate ALR Services, which gives us a footprint in the United Kingdom, a highly competitive market for PCB distribution players,” said Icape Group CEO Yann Duigou. “As with all Icape Group acquisitions, we identified strong synergies and concrete cross-selling opportunities between our two organizations, which should translate into increased post-integration revenue. In addition, ALR Services’ local teams serve a portfolio of 300 active customers, not addressed by the Icape Group, to whom they will now be able to offer the full range of services offered by our global platform.”

With a portfolio of 300 EMS and OEM customers in the defense and automotive industries, ALR Services expects to achieve revenue of £2.5 million ($3.2 million) in 2024.

Icape will also acquire a minority shareholding in Jiva Materials, a UK-based developer of what it calls the world’s first fully biodegradable PCB substrate.

Soluboard, Jiva’s PCB material, is designed to dissolve in water at end-of-life, paving the way for easier recycling and significantly reducing the environmental impact of electronic products.

Icape’s PCB factory in Malmö, Sweden, will be one of the key fabrication facilities in Europe for the development of the Soluboard PCB moving forward.

“This collaboration marks a major milestone for Jiva,” said Steve Driver, CEO of Jiva Materials. “We’ve earned the trust of prominent brands in the electronics industry, and now, with Icape as a partner, we are ready to accelerate the industrialization of Soluboard with PCB manufacturing facilities in Europe.”

“As a global company based in France, we are thrilled to see our partnership with Jiva unfold in Europe,” said Duigou. “Icape is committed to retaining technological expertise in Europe, and this collaboration will not only enhance our sustainability focus but also solidify our leadership in eco-friendly technology.”

Gentex Announces Acquisition of Voxx International

ZEELAND, MI – Automotive electronics manufacturer Gentex has announced the acquisition of all remaining shares of Voxx International for around $120 million.

Gentex previously held around 30% of Voxx’s shares and agreed to acquire the rest of the company’s shares at $7.50 per share in an all-cash transaction. The acquisition of Voxx will result in an increase in annual revenue of $350 million to $400 million, Gentex said in a release.

Voxx produces automotive and consumer electronics, supplying in-vehicle entertainment and security systems to the automotive industry and consumer audio systems under the Klipsch, Onkyo and Integra brands.

Gentex said the transaction will give it full access to Voxx’s biometric technology, which will provide further product applications into the automotive, aerospace and medical markets, as well as provide its expertise in high-volume manufacturing to Voxx’s audio electronics team to help its expansion in the consumer and connected home space.

Sero Acquires European EMS EPSa

ROHRBACH, GERMANY – Sero EMS has announced the acquisition of EPSa-Elektronik & Präzisionsbau Saalfeld, a German EMS provider, and EPSa Děčín, its Czech subsidiary. Financial terms were not disclosed.

With the addition of EPSa’s facilities and personnel in Germany and Czechia, Sero strengthens its development capabilities, enhancing its expertise in software and hardware development, mechanical engineering, rapid prototyping and high-mix, low-volume production, the company said in a release. EPSa’s specialized skill set will enhance Sero’s ability to better serve complex customer needs and offer tailored solutions with a focus on MedTech equipment and high-end industrial applications.

“EPSa is a fantastic addition to the Sero EMS family,” said Jan-Frederik Kalee, CEO, Sero EMS Group. “Their technical capabilities and commitment to quality align perfectly with our strategic goals. Together, we are positioned to offer enhanced, end-to-end solutions that meet the growing complexity of customer demands across industries.”

“We as EPSa are excited about the synergies and high cultural fit with the group,” said Ali Sahin, managing director, EPSa. “It will allow us to develop more differentiating value-add services toward existing and new customers. Taking over the responsibility for the group CTO role is an honor and motivation emphasizing the strong level of integration between the group companies. Looking forward to joining and growing a superior SERO EMS Group team.”

Eagle Electronics Building OH Manufacturing Facility

SOLON, OH – Eagle Electronics has raised $14 million to build a new manufacturing facility here in partnership with CO-AX Technology.

The EMS provider and producer of cellular modules said it plans to use the funding, led by the OHIO Fund with participation from Asymmetric Capital Partners, to build an advanced electronics manufacturing plant, leveraging cutting-edge surface-mount technology manufacturing equipment.

“This is a major moment for Eagle and our vision of onshoring and securing America’s critical technologies,” said TJ Dembinski, co-founder and CEO of Eagle Electronics. “Our goal is to set a new standard for electronics manufacturing in the US, combining the most advanced automated manufacturing and testing technology with rigorous hardware and software cybersecurity testing throughout the supply chain. This offering will allow Eagle to onshore critical knowledge and essential technologies, all while continuing to cement the United States’ leadership in the chip industry.”

The new operation is also expected to create numerous jobs in Ohio, further establishing the state as a key player in the US semiconductor industry.

“Eagle is further proof that Ohio is becoming one of the world’s leading semiconductor manufacturing hubs,” said Ohio Lt. Gov. Jon Husted. “With the addition of Eagle, we’re bringing more jobs in this sector to Northeast Ohio, reinforcing our commitment to the ‘Made in Ohio’ strategy.”

Eagle said it is already seeing demand for American-made cellular modules, with Boston-based Cherish contracting with Eagle to source components for its health and safety monitoring products manufactured in the communities where its customers live.

“Our customers trust us to invite our products into their homes to monitor the health and safety of loved ones,” said Cherish CEO Sumit Nagpal. “Our work with Eagle helps deepen this trust with, in this case, cellular modules manufactured in the USA. This is good for us, our customers, and the communities we serve.”

“Our partnership with Cherish Health demonstrates the market’s confidence in our ability to deliver high-quality, state-of-the-art cellular modules,” added Mark Kvamme, Eagle’s cofounder and chairman. “We look forward to expanding our customer base as we ramp production and continue to innovate in the cellular module and electronics manufacturing spaces.”

SEMI Publishes Recommendations for EU Semiconductor Policies

BRUSSELS, BELGIUM – SEMI has published recommendations for the European Union to bolster its semiconductor ecosystem, urging new commissioners to implement legislation to advance the semiconductor sector given its role as a key driver of technological advancement, economic growth and ensuring Europe’s future competitiveness on the global stage.

“In light of multiple technological disruptions such as AI and autonomous vehicles poised to drive industry growth over the years ahead, SEMI Europe presents its recommendations for a successful long-term strategy for the European semiconductor industry,” said Laith Altimime, president of SEMI Europe. “The European Chips Act has generated strong momentum, and our recommendations highlight urgent actions to continue the progress made. Policymakers must build on this momentum by strengthening the legislative framework and advancing toward a ‘Chips Act 2.0.’”

SEMI Europe’s key recommendations for policymakers to consider include:

• Strengthening the semiconductor ecosystem by optimizing funding across the EU, member states, and private sectors to achieve the EU’s goal of a 20% global market share by 2030, advancing toward a comprehensive “European Chips Act 2.0”
• Enhancing economic security by aligning protective measures with proactive initiatives to improve global competitiveness, streamlining export controls, reinforcing intellectual property protection, and reducing administrative burden
• Integrating semiconductors in the EU’s Green Deal by developing a policy framework that balances innovation and sustainability
• Ensuring responsible and sustainable use of essential chemicals, while supporting research for alternatives and maintaining the competitiveness of the European semiconductor supply chain
• Addressing the increasing talent gap by fostering collaboration between industry and education, and reforming immigration legislation to attract skilled talent globally
• Aligning funding with industry needs through the next Multi-Annual Financial Framework while fast-tracking the Chips for Europe Initiative and Important Projects of Common European Interest (IPCEI).

The SEMI Europe recommendations underscore the importance of the European Commission in prioritizing strategic investments and establishing robust policy frameworks that promote collaboration across sectors, advance sustainable innovation, and cultivate a skilled workforce, thereby ensuring Europe’s competitive standing within the global semiconductor industry.

“SEMI Europe is committed to engaging with stakeholders to advocate for a comprehensive ‘Chips Act 2.0’ initiative that will address gaps in the current framework,” said Altimime. “This initiative will help solidify Europe’s position in the global semiconductor sector, boost competitiveness, and enhance security.”

Wistron Set to Open Vietnam Manufacturing Plant

HA NAM PROVINCE, VIETNAM – Wistron reportedly plans to begin operations in January at its new $24.5 million manufacturing plant here.

The manufacturer’s Victory II facility, which was scheduled to have equipment installed by the end of December, will employ 530 staff once completed, and will have an annual production capacity of 3 million LCD panels, 5.9 million notebooks, 375,000 desktop computers, 1.2 million VoIP phones, 300,000 motherboards and additional products, The Investor reported.

The company previously invested $363.9 million in its Victory I facility, also located in Ha Nam Province, with operations beginning in December 2021 to manufacture notebooks, motherboards, desktop computers, and camera modules.

The construction of the second phase of Victory I is currently underway, with completion planned for April. After the expansion, the facility will employ 14,470, with an annual output of 4 million notebooks, 6 million LCD panels, 1.5 million docking stations, 1 million motherboards, 2 million desktop computers, 375,000 webcams and other products, according to The Investor.

Delta, Cal-Comp Sign MoU to Advance EMS Automation

BANGKOK – Delta Electronics and Cal-Comp Electronics are partnering to advance the EMS industry by combining Delta’s automation expertise with Cal-Comp’s manufacturing capabilities.

The memorandum of understanding between the companies reflects a shared commitment to advancing efficiency, innovation, and sustainability in the EMS industry, while formalizing previous successful projects between Delta and Cal-Comp, the companies said in a release.

The partnership will permit the combination of Cal-Comp’s CCET 4.0+ platform, AI solutions, and data center run-through manufacturing process with Delta’s DIAEAP-IMM solution, which will bolster parameter consistency, optimize mold flow and significantly reduce production errors.

“Cal-Comp and Delta have both been deeply root in Thailand for more than 35 years and both have done well and succeed in its professional field,” said Cal-Comp COO Khongsit Choukitcharoen. “Over the years, Cal-Comp has been developing internally to enhance its automated smart manufacturing process and digital management in aiming to maintain its competitiveness among the competitors in the EMS industry. Delta has great achievements in energy conservation and carbon reduction, automobiles products, and AI-enabled solutions in recent years. Therefore, we are exciting to enter a strategic collaboration with Delta to explore and to enhance the capabilities in smarter and greener manufacturing processes and to further drive the development of electronics industry in Thailand to the next milestone.”

“We are excited to formalize our relationship with Cal-Comp through this MOU, which represents a significant step forward in advancing smart manufacturing and Industry 4.0+ practices within the EMS industry,” said Victor Cheng, CEO, Delta Electronics. “By integrating Delta’s cutting-edge automation and AI-enabled solutions into Cal-Comp’s manufacturing processes, we aim to enhance operational efficiency, optimize production workflows, and drive sustainable innovation. The MOU allows for collaboration between Delta and Cal-Comp, focusing on supporting smarter and greener factory operations.”