Ansys-Synopsys Deal Gets Nod from European Commission, UK Watchdog

SUNNYVALE, CA – Synopsys’ $35 billion takeover of Ansys received approval from the European Commission in January after the companies agreed to concessions to reduce competition concerns.

The commission expressed concern that the merger would reduce competition in the region’s optics software, photonics software and register-transfer-level power consumption analysis software industries.

To alleviate those concerns, the commission said both companies agreed to divest Synopsys’ optics and photonics software and Ansys’ PowerArtist software.

“The commitments fully address the competition concerns by ensuring that there will be sufficient competition and choice in the global markets for the supply of optics, photonics and register-transfer level power consumption analysis software,” the commission said.

It added that the acquisition can move forward only after the EU also approves the buyers of the divested parts in a separate procedure.

The UK Competition and Markets Authority, which expressed similar competition concerns, also provisionally accepted the deal under the condition of the planned divestitures.

Synopsys said it expects the transaction to close in the first half of 2025.

Imagineering Announces Merger with Accutrace

ELK GROVE VILLAGE, IL – Imagineering in January announced a merger with Accutrace, a fellow PCB fabricator and assembler based in Santa Clara, CA. Terms of the deal were not disclosed.

The newly merged company will operate under the larger brand Imagineering, Inc.

The merger reflects the shared values and complementary expertise of both organizations, Imagineering said in a release, and positions the fabricator and assembler to offer a broader range of services while continuing to increase its service standards.

“This is an exciting milestone for both Imagineering and Accutrace,” said Khurrum Dhanji, CEO, Imagineering. “By joining forces, we are building a stronger organization with enhanced capabilities, ensuring we continue to provide the highest level of service and innovative solutions our clients have come to expect.”

Siemens Launches Startup Support Program

MUNICH – Siemens has announced the launch of Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups by providing venture-related services and reducing the cost of access to the company’s software and hardware.

“Startups are essential to making our customers more competitive, sustainable and resilient. By collaborating with startups, Siemens helps bring breakthrough ideas to industries faster, empowering customers to address global challenges more effectively with cutting-edge technologies, tools and solutions,” said Peter Koerte, chief technology officer and chief strategy officer, Siemens.

The new program will help onboard startup companies to the Siemens Xcelerator marketplace, providing access to a global go-to-market channel and the Siemens Xcelerator ecosystem. Siemens will also collaborate with leading startups through venture clienting, giving the company access to new capabilities and services and providing startups with early revenue needed for growth. It will also provide startups – whether focused on product or software development – with packaged access to essential software tools from Siemens Xcelerator.

As part of its ongoing strategic collaboration with AWS, Siemens will also link the Siemens for Startups program with AWS’s Startup program, underscoring both companies’ commitment to fostering entrepreneurship and driving digital transformation in the industrial sector, Siemens said.

“Collaborating with Siemens allows us to extend the capabilities of our AWS Startup program to a new generation of innovators in the engineering and manufacturing space,” said Jon Jones, vice president and global head startups at AWS. “By providing startups with advanced software, generative AI and cloud services, AWS and Siemens are enabling them to bring their ideas to life more quickly and boost entire industries with cutting-edge solutions.”

Integrating Siemens’ comprehensive suite of industrial software – including design, simulation and manufacturing solutions from the Siemens Xcelerator portfolio – into AWS’s scalable cloud infrastructure and startup program will enable startups to access the tools and resources they need to seize market opportunities. For technical and go-to-market support, qualifying startups will receive AWS credits, business development resources and access to the AWS Activate program.

Altium Acquires SCM Platform Developer

SAN DIEGO – Altium in late January announced the acquisition of Milwaukee, WI-based Part Analytics, an AI-powered supply chain management platform.

The acquisition will introduce a component and parts management application into Altium’s cloud-based collaboration platform, Altium 365, allowing the company to support new groups of customers in supply chain and procurement, including Electronics Supply Chain and Category Managers, the company said in a release.

“Altium’s acquisition of Part Analytics represents a further step forward toward our vision of a fully connected electronics value chain and Electronics Lifecycle Management system for enterprise organizations,” said Aram Mirkazemi, president of Altium. “Part Analytics will play an important role in our transformative pursuit of the electronics industry.”

Part Analytics’ platform allows manufacturers to make fully informed decisions for large-scale component planning and procurement, particularly at the enterprise level. Incorporating its capabilities into Altium’s electronics creation ecosystem will support Altium’s Enterprise-level solution by adding an advanced fulfillment function to its current sourcing capabilities, the company said.

“By joining Altium, Part Analytics’ electronics supply management platform will become part of a vast, connected electronics creation ecosystem in which customers can more efficiently execute design, sourcing, component acquisition, and lifecycle management through a single platform,” said Jithendra Palasagaram, founder and CEO, Part Analytics.

Compeq Opens Thai PCB Plant

BANGKOK – Compeq opened a new PCB manufacturing facility in Thailand in December, representing an investment of more than THB10.4 billion ($306 million).

Production lines at the new factory in the Asia Industrial Estate in Samut Prakan province are already operational, the company said.

The Taiwanese PCB manufacturer received approval for the investment from the Thailand Board of Investment (BOI) in December 2023, and built the 17.9-hectare facility over the past year. The new factory will focus on manufacturing multilayer PCBs, with around 600 workers employed during its first phase and an expansion to more than 1,500 next year.

Fraunhofer IAP, Notion Systems Partner to Advance EHD Printing

POTSDAM, GERMANY – The Fraunhofer Institute for Applied Polymer Research IAP (Fraunhofer IAP) and Notion Systems announced a strategic partnership to further develop electrohydrodynamic printing for display technologies and new applications.

As part of the collaboration, the two partners aim to expand the possibilities of EHD printing in the field of new display technologies and to open new applications. By combining Notion Systems’ expertise in inkjet printing technology and Fraunhofer IAP’s extensive research expertise in polymer research and nanotechnology, innovative solutions to produce high-precision and functional materials are to be developed, Fraunhofer IAP said in a release.

EHD printing is a new technology that utilizes electric fields to precisely transfer inks or other liquids onto substrates. In contrast to conventional printing methods, EHD printing enables the creation of fine droplets, resulting in higher resolution and accuracy. This technology is particularly useful for applications in electronics, biomedicine and materials science, as it enables the production of microstructures.

Initial joint projects will focus on developing new printing materials and optimizing printing processes in OLED/QLED printing. The aim is to improve the technology for industrial display applications and open new markets.

“We are convinced that EHD printing will shape the future of printing technologies and are very pleased to have the Fraunhofer IAP with its extensive research expertise at our side to further develop this technology,” said Michael Doran, CEO, Notion Systems.

“In order to transfer this groundbreaking printing technology from the research sector into new industrial fields of application, it is crucial to have a trustworthy industrial partner at our side,” said Armin Wedel, division director of Functional Polymer Systems at Fraunhofer IAP. “We are therefore all the more pleased to be working with Notion Systems. Together, we are convinced that we can significantly advance the research and development of EHD printing.”

Neways Completes Acquisition of Microsystems Firm Sencio

SON, NETHERLANDS – Neways in January announced the successful completion of its acquisition of Sencio, a Dutch developer of advanced packaging for smart sensing and actuation applications.

Sencio will operate under the brand Neways Advanced Microsystems at its current facilities in Nijmegen, the Netherlands.

“Over the past years Neways has invested significantly in its technology position, that allows us to act as innovation partner for the most demanding customers in the industry,” said Neways CEO Hans Büthker. “Through the acquisition of Sencio we further strengthen our market position in microelectronics and are able to offer a broader suite of integrated services to both Neways’ and Sencio’s customers. We welcome the Sencio team and are looking forward to our joint journey forwards.”

“I am excited to become part of the Neways team and continue offering our technology with a large part of the dedicated and specialized Sencio team,” said Oliver Maiwald, CEO, Sencio. “Joining forces with Neways enables us to offer a complete suite of advanced microelectronics services to a broad set of customers that can benefit from advanced packaging for smart sensing and actuation applications.”

Tata Electronics Acquires Controlling Stake in Pegatron India

CHENNAI, INDIA – Tata Electronics has acquired a 60% controlling stake in Pegatron’s India unit as it looks to expand its iPhone manufacturing capabilities in the country, the company announced on Jan. 24.

The move comes after Tata acquired Wistron’s assembly business in India in 2024, which included a plant in the country’s Karnataka state and made the company the first from India to produce iPhones.

The deal with Pegatron includes its iPhone assembly facility in Chennai, and after the acquisition, and Tata will focus on integrating the two companies’ teams while rebranding Pegatron’s operations to reflect its new ownership structure, the company said in a statement.

“The acquisition of a majority stake in Pegatron Technology India Private Limited fits into Tata Electronics’ strategy of growing our manufacturing footprint,” said Tata Electronics CEO and managing director Randhir Thakur. “We look forward to a new era of AI, digital and technology-led manufacturing as we bring up these new facilities and expand our operations in India.”

18 Semiconductor Fabs to Start Construction in 2025, SEMI Reports

MILPITAS, CA – The semiconductor industry is expected to start 18 new fab construction projects in 2025, according to SEMI’s latest quarterly World Fab Forecast report. The new projects include three 200mm and fifteen 300mm facilities, most of which are expected to begin operations from 2026 to 2027.

In 2025, the Americas and Japan will be the leading regions, each with four projects. China and the Europe & Middle East region each have three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025.

“The semiconductor industry has reached a pivotal juncture, with investments driving both leading-edge and mainstream technologies to meet evolving global demands,” said Ajit Manocha, SEMI president and CEO. “Generative AI and high-performance computing are fueling advancements in the leading-edge logic and memory segments, while mainstream nodes continue to underpin critical applications in automotive, IoT and power electronics. The construction of 18 new semiconductor fabs set to begin in 2025 demonstrates the industry’s commitment to support innovation and significant economic growth.”

The 4Q 2024 edition of the World Fab Forecast report covers 2023 to 2025 and shows that the global semiconductor industry plans to begin operating 97 new high-volume fabs. This includes 48 projects in 2024 and 32 projects set to launch in 2025, with wafer sizes ranging from 300mm to 50mm.

Semiconductor capacity is projected to further accelerate, with a 6.6% yearly growth rate forecast to total 33.6 million wafers per month (200mm equivalent) for 2025. This expansion will be primarily driven by leading-edge logic technologies in high-performance computing (HPC) applications and the increasing penetration of generative AI in edge devices.