PCD&F
Hirose DF53 Series Connector
DF53 Series connector is part of the SignalBee connector platform. Features a height of 1.45mm and a depth of 3.55mm, and is said to be the industry’s smallest 0.6mm crimp connector. Supports up to 1.3A max when using two positions for power and is commonly used to bring power to wearable battery connections. Features a unique lance design and combines a miniature footprint with high lance strength to prevent cable disconnect during wiring. Also includes a double lock design, friction and contact, to ensure high retention force. Box-shaped contact design is said to ensure contact stability from above and below, and box-shaped contact on the cable side also prevents deformation when handling the cable assembly. Comes in a 14-position version and permits checking of mating conditions.
Hirose Electric
Keystone PCB Edge Connectors
Compact SMT PCB edge connectors feature a horizontal orientation, for parallel board-to-board or board-to-component power or signal transfer. Provide a low-profile connection with a small footprint, supporting high-density, high-current PCB packages on power and aluminum backplanes, and are compatible with PCB soldering applications, including reflow. Are manufactured from phosphor bronze with gold plate and come in various styles: male (pin), cat. #6100 (bulk) or cat. #6100TR (tape and reel) and female (socket) cat. #6102 (bulk) or cat. #6102TR (tape-and-reel). Female sockets are equipped with side guides for additional reinforcement to minimize PCB movement when installed.
Keystone Electronics
Kyocera AVX SpiCAT SpiSCAP Simulation Software
SpiCAT SpiSCAP online engineering simulation software evaluates and selects SCC and SCM Series supercapacitors for power challenges in industrial, energy, automotive, transportation, telecommunications, commercial building and consumer electronics applications. Identifies unique characteristics of a variety of Kyocera AVX components, including multilayer ceramic capacitors (MLCCs), polymer, tantalum, and niobium capacitors, multilayer varistors (MLVs), negative-temperature-coefficient (NTC) thermistors, and supercapacitors. Considers initial and end-of-life capacitance values, initial and final voltage, current/power/resistance modes, power (W) and duration time.
Kyocera AVX
Kyocera AVX Thin-Film Band-Pass Filters
BP1206 and BP2816 series thin-film band-pass filters are said to deliver repeatable and reliable RF performance for high-frequency wireless applications for telecommunications, military, aerospace, medical and consumer electronics. Enable quick, easy adjustment of RF parameters and feature ruggedly constructed compact, low-profile cases equipped with lead-free, solder-coated-nickel land grid array (LGA) terminations, and are compatible with automated assembly processes, including reflow, wave and vapor phase soldering. Exhibit 8W continuous power handling and 50Ω characteristic impedance, are rated for operating temperatures extending from -40° to +85°C, and support various frequency bands extending from 240-6100MHz
Kyocera AVX
Pasternack Angled RF Connectors
Angled PCB connectors are for RF designs for military and test-and-measurement applications. Come in 1.85mm, 2.4mm and 2.92mm versions and feature angled design to increase flexibility, particularly for prototyping and testing. Comply with industry-standard interfaces and support frequencies from DC to 67GHz.
Pasternack
SV Microwave Angled Solderless Connectors
Solderless PCB compression mount connectors attain edge launch-like performance anywhere on the board. Range includes 1.85mm to 2.92mm female solderless PCB compression mount connectors. Solderless design is said to deliver fast installation and enable reusability and replaceability.
Amphenol SV Microwave
Vishay TSM3 SMD Trimmers
TSM3 multi-turn, surface-mount cermet trimmers are designed for space-constrained industrial, consumer and telecom applications in harsh environments. Feature a 3mm x 4mm x 4mm footprint with a temperature range of -65° to +150°C and IP67 sealing. Permit fine-tuning of 10Ω to 2MΩ resistance range and provide a faster setting-to-time ratio than single-turn trimmers. Offer a 0.125W power rating at +70°C and come in top and side adjustment styles. Support automated PCB assembly and setting processes and are fully sealed to withstand standard board wash processing.
Vishay Intertechnology
Würth Vibration-Resistant Capacitors
Aluminum Electrolyte and Aluminum Hybrid Polymer capacitors now come in vibration-resistant versions in their SMT variants. Can withstand acceleration up to 30g (294m/s²). Are tested under conditions that go beyond the requirements of IEC 60384-4, which requires components to remain securely attached to the PCB for 12 hrs. (4 hrs. per axis) under vibration in the frequency range between 10Hz and 2kHz with an amplitude of 0.75mm. Can be processed on standard SMT production lines.
Würth Elektronik
Würth Redcube Press-Fit Connectors
Redcube Press-Fit for Automotive range of threaded connections is optimized for automotive applications . Can carry currents of up to 250A and are manufactured according to particularly stringent quality standards. Use press-fit technology to ensure even contact between pin and copper layer, especially on PCBs with very thick coatings, and offer greater reliability and stability than soldering. Enable a gas-tight and extremely strong mechanical connection, with a contact resistance of less than 200µΩ. Available in three variants: WE-PFIFUA with internal thread (Full Plain Automotive), WE-PFEFUA with external thread (Automotive), WE-PFICFA with internal thread (Circumference Automotive), and come in thread sizes M3, M4, M5, M6 and M8.
Würth Elektronik
CA
Apollo Seiko EF 3040A Selective Soldering Machine
EF 3040A selective soldering machine combines features such as live teaching, Gerber data teaching, and a 6.5kg solder pot capacity for ultimate flexibility. Features a patented direct drive motor and impeller that minimizes sludge, dross and dust while ensuring easy maintenance, plus advanced options such as auto flux detection sensors, nitrogen purity checks and MES system compatibility for smart factory integration. Also comes in inline model that includes an edge belt conveyor unit for smooth PCB handling and an array of customizable nozzle options. Features remote assistance and diagnostics capabilities to ensure maximum uptime, while advanced teaching methods provide flexibility for various production requirements.
Apollo Seiko
Asys SynapticaOS MOM Software
SynapticaOS manufacturing operations management (MOM) integrates MES functions with advanced production and material flow optimization to minimize downtime, enhance efficiency, and deliver real-time monitoring with seamless machine integration through an intuitive interface.
Asys Group
ECD M-VP Vapor Phase Soldering Barrier
M-VP rugged vapor phase reflow soldering barrier is designed for use with any ECD six-channel MOLE thermal profiler. Is suitable for use in batch and inline vapor phase reflow soldering equipment, with or without vacuum. Is compatible with high-temperature environment (up to 260°C) of condensation reflow, is impervious to vapor and moisture and resistant to damage or deformation during vacuum stages. Features an operator-friendly design and is compatible with other electronics assembly processes, including traditional wave and convection reflow soldering, PCB cleaning, and formic acid no-flux reflow.
ECD
Henkel Loctite AA 3952 and SI 5057 Adhesives
Loctite AA 3952 and Loctite SI 5057 light cure adhesives are designed to bond TPE substrates and overcome the limitations of traditional assembly methods. Key benefits are high performance under heat and humidity aging conditions and regulatory compliance to meet EU MDR 2017 standards regarding CMR and endocrine substances, as well as ISO 10993 compliance for biocompatibility, ensuring safety in medical device applications.
Henkel
MacDermid Alpha HiTech CF31-4026 Edgebond
Alpha HiTech CF31-4026 reworkable edgebond is for high-reliability applications in automotive electronics and high-performance computing. Permits component removal at lower temperatures, starting from 185°C, enabling rework and reducing material waste. Features high Tg and low CTE for thermal cycling durability; reworkable design; strong adhesion to PCBs; slump resistance.
MacDermid Alpha Electronics Solutions
Master Bond EP53TC Epoxy
EP53TC two-component epoxy is for bonding, sealing, coating and small potting applications. Is formulated with a specialty filler with a particle size ranging from 5 to 30µm. It is a flowable system with a mixed viscosity of 45,000-65,000cps at room temperature. Filler size and its relatively flowable viscosity enable the filling of small voids, for heat dissipation. Meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm. Thermal resistance is 10-15 x 10-6 K•m2/W and thermal conductivity is 2.3-2.6W/(m•K). Exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater than 1,000,000 psi, and a Shore D hardness of 85-95. Service temperature range is from -100º to +300ºF (-73º to +149ºC). A moderate heat cure is required to achieve optimal properties. Recommended cure schedule is 2 hr. at 80ºC followed by a post-cure of 90-120 min. at 125ºC. Comes in various packaging options, including ounce kits, quarter-pint kits, half-pint kits, pint kits and quart kits.
Master Bond
Mek PowerSpector JSAz 550 AOI
Mek PowerSpector JSAz 550 desktop AOI system features a completely redesigned chassis, including upgraded motors, drives, and spindles. While the optics and software remain consistent with MEK’s other desktop models, the new chassis design ensures it meets the demands of inspecting larger PCBs with efficiency and precision.
MEK
Nordson Asymtek Select Coat SL-1040 Cleaning Station
Asymtek Select Coat SL-1040 ultrasonic cleaning station is designed to keep nozzles and needles clean and prevent clogging in conformal coating systems. Uses a noninvasive process to remove material build-up adhering to nozzles and needle tips during conformal coating operations and induces cavitation bubbles using high-frequency pressure waves to agitate solvent and, without brushing, reach where other cleaning methods cannot touch, improving production efficiency with less clogging and downtime and more application consistency. Programmable through Asymtek EasyCoat 6 software, and can be set up to run before the coater starts, at the beginning of a coating program or periodically as the user defines. Is integrated with the coater’s self-leveling solvent system to automatically maintain correct solvent level.
Nordson Electronics Solutions
Parmi Xceed II AOI System
Xceed II AOI system features an enhanced platform designed to improve inspection speed and quality. Incorporates TRSC-II sensor to deliver 2-D/3-D data quality and offers five different resolution settings, from high precision (4µm, 6µm, 7µm) for detailed inspection to high-speed settings (10µm, 14µm) for faster throughput. Is optimized for die inspection, including system in package (SiP), bare die, IPD, die attach, underfill fillet and Cu Clip on die. Enhances 2-D die inspection through advanced coaxial lighting, enabling more types of defect detection on the die’s top surface, including text, polarity, cracks, contamination, chipping and epoxy issues.
Parmi USA
Saki 3Si/3Di-EX SPI and AOI
3Si/3Di-EX Series of 3-D SPI and AOI systems introduce a modular hardware design said to permit seamless optical unit upgrades. Features unified SPI and AOI inspection program data to eliminate redundant setup and programming tasks and simplified and automated program creation to minimize operator workload and enhance productivity. 3Di-EX AOI series also includes hybrid AI-powered re-evaluation to improve efficiency and reduce operator workload even further and AI-powered optical character recognition to ensure stable character inspection despite variations in print quality and position, boost productivity and eliminate the need for specialized skills. Also includes advanced machine-to-machine connectivity and full Smart Factory integration.
Saki Corp.
Siborg Calibration Boards for LCR-Meter Smart Tweezers
Proprietary Short and Open Calibration Boards reduce measurement offsets for LCR-Reader line of smart test tweezers. Reduce measurement offsets to below 0.01pF for capacitance and 1nH for inductance. Are specialized dummy PCBs with holes positioned at various distances to represent different component sizes (e.g., 0201, 0402, etc.), and when tweezer-meter’s test leads are placed in the corresponding holes for a given component size, display the actual offset capacitance.
Siborg Systems
Thermaltronics TMT-1000S Soldering Station
TMT-1000S soldering station features a 50W RF power output delivering soldering performance equivalent to over 100W in standard systems. Instantaneous power regulation responds to thermal demands of each solder joint, preventing overheating or underheating, and features rapid RF induction heating to ensure precise temperature control with no overshoot and maintain a range of ±1.1°C (±2°F). Ready to use out of the box, with no calibration or additional operator training required, and includes a tip that automatically powers down when the handpiece is placed in the workstand, saving energy and prolonging tip life. Also features ESD safety compliance and certifications to CE and TuV standards to provide exceptional safety and reliability.
Thermaltronics
Yamaha Robotics Surface-Mounter Options
Three new hardware-based performance options for high-speed mounters enhance productivity, quality control and flexibility for handling special products such as large LED boards. Come on all new Yamaha mounters, and are designed for easy fitting to simplify upgrading equipment already in the field.
New features include nozzle-tip force measurement for early detection of issues such as blockages. Accurately tracking any changes in force allows timely nozzle maintenance, such as cleaning, to ensure optimal end-of-line production yield. Implemented with a module fitted at the mounter’s feeder interface, the system provides an easy menu-driven setup and measures the component-placement force to within 0.1N resolution. The nozzle tip force measurement option is available now and compatible with Yamaha YRM mounters.
Also new, LCR verification measures the inductance, capacitance, or resistance value of components in SMD-chip packages to verify the correct part type and tolerance before placement. Detects issues such as feeder errors, reel errors or defective components before placement, to maximize first-pass yield and avoid rework. Can be fitted to Yamaha YRM mounters and legacy YSM machines, with reportedly no special software or hardware modifications required.
Large board option lets YRM mounters handle boards up to 1.5m long and 510mm wide, for populating challenging assemblies such as extra-large LED-lighting boards. Increases maximum board size by more than 30% compared to standard YRM mounters. Accepts boards up to 10mm thick and weighing up to 10kg.
Can be implemented individually or together to boost surface-mount production performance and extend the advantages of the Yamaha’s YRP printers, YRM-D dispensers, YRM mounters, and YRi-V inspection systems.
Yamaha Robotics SMT Section
