PCD&F
Asahi Kasei Sunfort TA Series Dry-Film Photoresist
Sunfort TA series dry-film photoresist enables high-resolution circuit patterning using conventional stepper exposure and laser direct imaging (LDI) systems. Offers ultra-fine patterning capabilities, permitting 1.0µm resist width and 4µm pitch design through LDI exposure. Supports semiadditive processing (SAP) to create 3µm-wide conductive traces, overcoming historical limitations of dry-film photoresists in redistribution layer (RDL) formation. Is for large-areas, high-density multilayer interposers required in high-performance chip packages.
Asahi Kasei
Eulex XG Series Ceramic Capacitor
XG series ceramic capacitor is said to deliver 10 times the capacitance of traditional solutions with Class 1 dielectric stability and high Q factors. Features ultra-low ESR and ESL. Enables broader bandwidths and reduced signal loss for RF and microwave applications. Single-layer construction with embedded top electrode reportedly minimizes parasitics. Come in compact formats for surface-mount or embedded use.
Quantic Eulex
Kyocera AVX Chip Antennas
Chip antenna series includes 1001312 linearly polarized ceramic antenna, which comes in a 2.0 x 1.2 x 0.55mm SMT package that weighs 0.003g. Supports 2.0–2.485GHz band in addition to a configuration for 6.0–8.5GHz for ultra-wideband (UWB) applications.
The 9005868 2.4GHz corner chip antenna is designed for corner placement, for applications with small PCBs. Omnidirectional radiation pattern. Comes in 1.0 x 0.58 x 0.35mm SMT package and weighs 0.0009g. Operating temperature range is -55° to +125°C. The 9001978 2.4GHz linearly polarized chip antenna SMT package measures 1.00 x 0.55 x 0.40mm and weighs less than 0.001g. Supports 2.0–2.485GHz band protocols, in addition to configurations for 6.0–8.5GHz for UWB and 2.4/5.0GHz dual-band Wi-Fi applications.
Each supports Wi-Fi, Bluetooth, Zigbee and Matter protocols. RoHS-compliant and packaged on tape-and-reel.
Kyocera AVX
Siemens Pads Pro Essentials PCB CAD
Siemens Digital Industries Software Pads Pro Essentials incorporates features of its higher-end Xpedition technology in a streamlined, cloud-connected design environment.
Introduces integrated, co-branded front-end powered by Celus, for designs using intelligent functional blocks with AI-assisted schematic and BoM generation. Tailored for independent engineers and startups, it includes schematic capture and place and route capabilities.
Siemens Digital Industries
Siemens Xpedition Standard PCB Design Tool
Siemens Xpedition Standard AI-enhanced PCB design platform combines cloud collaboration, AI automation and professional-grade toolsets tailored for small and mid-sized electronics teams.
Adds design reuse, variant management, advanced routing automation, native 3-D layout and deeper collaboration across mechanical, manufacturing and supply-chain stakeholders. Token-based options provide on-demand access to more advanced capabilities such as fully integrated pre- and post-layout signal integrity analysis powered by Hyperlynx software for PCB analysis and rigid-flex design without requiring a full tier upgrade.
Siemens Digital Industries
Tuurny PCB Repair Assistant
AI-powered repair assistant combines computer vision with a custom large language model to detect faults on PCBs and assess repair options. Processes standard images and video to deliver step-by-step repair instructions, enabling high-accuracy repairs even for less experienced users. Real-time visual feedback and technician interactivity allow dynamic troubleshooting and training.
Tuurny
Vishay AC03-CS Safety Resistors
AC03-CS wirewound safety resistors now come in WSZ lead form. Designed for inrush current limiting, pre-charge, discharge and snubber functions. Supports applications in automotive electronics, industrial drives and consumer appliances. Operates from -40° to +200°C, withstands 4kV surge pulses and eliminates need for fuses. AEC-Q200 qualified, RoHS-compliant and halogen-free.
Vishay Intertechnology
Zuken CR-8000 2025 ECAD
CR-8000 2025 printed circuit board design software features updates to Design Gateway and Design Force, including intelligent schematic auto-generation, delay-aware routing and reliability validation tools. Enhances early-stage design with auto-generated connectors and standardized circuits like ESD protection and filters. Uses rule-based logic and simulation feedback. Updates to Circuit Adviser enable analysis of component lifespan, thermal limits and voltage margins. Includes AI-assisted bus routing and decoupling capacitor placement, as well as timing-aware features for interfaces like DDR4 and PCIe.
Zuken
CA
A.P.E. APE-5000-0128 Desoldering Tool
APE-5000-0128 Classic desoldering hand tool is for high-volume solder removal in through-hole and advanced SMT applications, including power supplies, large BGAs and EV components. Handles rework requiring rapid extraction of large solder amounts. USA-built construction.
A.P.E.
ASMPT Works Integration CDX
Works Integration centralized data exchange platform designed to unify communication across all ASMPT hardware and software products while integrating third-party systems. Connects sensors and applications across production environment using industry standards such as IPC-2591 (CfX) and SECS/GEM, along with proprietary adapters for custom integrations. Is said to eliminate redundant interfaces, reduce system complexity and ensure scalable and secure data exchange.
ASMPT
Axxon-Mycronic CCAOI AOI
CCAOI inline AOI system is said to inspect 100% conformal coating with parallax-free imaging, 3-D thickness measurement starting at 2µm and dual-sided inspection. Supports MES integration and real-time data feedback. Comes in two scanner configurations: 11.8 x 15.8″ and 16.5 x 20.8″. Delivers full-surface image capture in 25 sec. and accommodates PCB sizes up to 33.0 x 20.8″.
Axxon-Mycronic
BEST StikNPeel Rework Stencil
StikNPeel rework stencils are ESD-safe and removable, for precise solder paste application during rework of QFPs and bottom-terminated components. Repositionable adhesive backing. Support simplified component placement, eliminate need for masking and are custom-cut to device specifications. Come in antistatic packages of 10.
BEST Inc.
Cognex OneVision Cloud AOI Platform
OneVision electronics inspection platform enables scalable AI-powered machine vision by combining cloud-based delivery with intuitive workflows for application development and deployment. Reduces setup time and unifies tools and data across sites. Compatible with In-Sight 3800 and 8900 systems.
Cognex
Inspectis Micro Size Optical Probe Tip
Micro Size Optical Probe Tip inspects µBGAs with a 0.4 x 3.5mm probe footprint and 90° viewing angle for low-clearance components. Integrates 5MP image sensor, LED lighting and high-power backlighting for high-resolution images under standoffs as low as 40µm. Mounts on stable stand with X-Y translation, for precise positioning and ergonomic handling for advanced inspection in constrained spaces. For use with Inspectis BGA inspection system.
Inspectis
Nikon Limited Angle CT
Nikon VOXLS and XT H 225 x-ray systems now come with Limited Angle CT. Enables high-resolution CT imaging without full 360° rotation, permitting closer sample positioning to the x-ray source for magnification. For inspecting PCBs, EV battery cells and carbon fiber parts. Supports scans of high-aspect-ratio or complex geometries. Proprietary reconstruction algorithm works for image precision.
Nikon
PicoScope 3000E Series Oscilloscopes
PicoScope 3000E series oscilloscopes now comes in PS3415E and PS3416E USB-powered PC-based models featuring four analog channels, 100MHz or 200MHz bandwidth, 5GSa/s sampling and 10-bit resolution (expandable to 14-bit with enhanced resolution). Select models include optional mixed-signal oscilloscope (MSO) functionality. Equipped with 2GSa deep capture memory and a built-in 14-bit 20MHz arbitrary waveform generator (AWG), these compact scopes support high-speed serial decoding, segmented memory, persistence mode and advanced analysis features. PicoScope 7 software interface is compatible with Windows, Mac and Linux.
Saelig
Sayaka SAM-CT34XZ Router/Depaneler
SAM-CT34XZ twin-table router introduces bottom-side cutting to safely depanel PCBs with tall top-side components. Enhances throughput with dual-table operation, automatic router-bit changes, blade diameter measurement, jig sensors, and DXF-based teaching. Offers cutting precision within ±0.01mm and spindle speeds up to 50,000rpm. Permits continuous operation by loading and unloading boards on alternating tables.
Sayaka
Seika Machinery
Shenmao SH Series Solder Pastes
SH-0595-210 (Sn95Pb5) and SH-05X25-210 (Sn92.5Pb5Ag2.5) solder pastes are for high-power component assembly in power electronics. Are halogen-free (ROL0) and feature advanced flux chemistry for consistent soldering under narrow reflow windows. Optimized for copper lead frames and die surfaces, and are said to offer good wetting, low flux residue and minimize solder splash in thermal environments. Voiding performance and printability support reliability in applications such as IGBT modules, automotive systems and energy conversion devices.
Shenmao
Synthomatic S500 AI Inspection
S500 AI-powered inspection system uses advanced deep learning AI to automatically detect defects, improve product quality, and reduce inspection costs, without the complexity of traditional machine vision. Captures real-time production images and accurately identifies and characterizes defects. Requires no coding. Is said to cut costs 59% and increase yield 30%. Runs locally on facility PC and seamlessly scales to the cloud as needed.
Synthomatic AI Solutions
Techcon Side-by-Side Dispensing Cartridge
Side-by-Side dispensing cartridge supports metering and dispensing of 2K adhesives and sealants. Available in 50ml and 200ml sizes with 1:1, 2:1, and 10:1 ratios. Designed for compatibility with standard cartridge guns. Includes full sets with cartridges, caps, plungers and o-rings. Larger sizes and accessories to follow.
Techcon
Würth WL-SMTW LEDs
WL-SMTW LED series now includes 1608 (1.6 x 0.8mm) and 3528 (3.5 x 2.8mm) top-view models with water-clear lenses and maximum operating temperature of 100°C. 1608 variant offers higher brightness than comparable 0603 LEDs, while 3528 delivers greater illumination for broader applications. Come in blue, green, yellow, amber and red (630nm and 640nm). UV- and IR-free emission. Features enhanced thermal resistance and optimized lead frame for improved heat dissipation and reliability.
Würth Elektronik
Zasche Smart Handling Big Bin Picking
Smart Handling Big Bin Picking System comes with intelligent camera guidance with manual operator control. Designed to streamline semiautomated load handling. Automates repetitive tasks while controlling variable placements. Features include modular three-axis design and teach-in functionality.
Zasche Handling
