TLT Expands in Vilnius with 4 New Factories

VILNIUS, LITHUANIA – TLT has opened four new factories at its High-Tech Hill technology park, marking a milestone for European electronics manufacturing. The expansion includes a new state-of-the-art PCB plant – the first built in Europe in two decades – along with expanded facilities for electronics manufacturing, mechanical engineering and component assembly.

Local Government Approves Incentives for India’s Largest PCB Plant

CHENNAI, ANDHRA PRADESH, INDIA – The Andhra Pradesh government has cleared an ₹856-crore ($993 million) incentive package to support the development of India’s largest printed circuit board facility, to be established by Syrma SGS in partnership with Korea’s Shinhyup Electronics.

The project, valued at ₹1,595 crore, will be located in the Naidupeta industrial area near Chennai. The new site will produce single-layer and multilayer PCBs, HDI/flex PCBs, copper-clad laminate (CCL) manufacturing and electronics manufacturing services. The state government will provide 12.6 acres of land at a subsidized rate to facilitate the initiative.

Scheduled for commissioning by October 2026, the facility is expected to contribute significantly to Syrma SGS’s revenues in fiscal 2027 and strengthen India’s electronics ecosystem. The site will produce PCBs for the automotive, electric mobility, healthcare and smart metering sectors.

Panasonic Industry to Double Megtron Circuit Board Material Production for AI Servers

TOKYO – Panasonic Industry, part of the Panasonic Group, will significantly expand its Megtron multilayer circuit board material production in Southeast Asia to address surging demand for AI servers and ICT infrastructure.

Panasonic Industry will invest approximately 17 billion yen ($114 million) in a new manufacturing facility at its plant in Ayutthaya, Thailand, that will double output over the next five years. The facility is scheduled to begin operations in November 2027, with mass production starting by the end of fiscal year 2028.

Megtron materials are used in servers, switches and routers that power AI and next-generation networking. Panasonic Industry stated that the investment reflects its commitment to innovation in electronic materials and its role in enabling advanced AI development and broader societal solutions.

Kaynes Technology’s CEO Resigns

KARNATAKA, INDIA – Kaynes Technology announced that chief executive officer and key managerial personnel Rajesh Sharma has tendered his resignation, effective Oct. 31. The company stated Sharma is stepping down to pursue opportunities outside the organization.

The move came as a surprise to many outside the company, which, during his nearly four-year tenure, has become one of India’s leading EMS companies, with revenues for the fiscal year ended in March of $325 million.

In his resignation letter, Sharma reflected on milestones such as the company’s IPO and listing, capacity expansions, domestic and global acquisitions. He described his journey with Kaynes Technology as “very fulfilling, both professionally and personally.”

Videoton EAS Bulgaria Expands into Automotive Electronics Production

STARA ZAGORA, BULGARIA – Videoton EAS’s Bulgarian subsidiary, VEAS Bulgaria, has officially entered the automotive sector with the launch of serial production of electronic modules for lighting systems. The milestone follows a Certificate of Compliance received last December and successful validation by a leading automotive manufacturer in August.

Videoton is one of Europe’s largest EMS companies, with 2024 revenues of EUR 771 million (about $900 million).

The Stara Zagora plant is now producing its first automotive product family, marking a significant step toward full IATF certification, which requires 12 months of automotive manufacturing activity. Definitive certification is expected in the fourth quarter of 2026.

Variosystems Relaunches Southlake Facility

SOUTHLAKE, TX – Variosystems has relaunched its 65,000 sq. ft. facility here, expanding its North American electronics manufacturing services (EMS). The redesigned site was unveiled on Sept. 9, in a celebration joined by local government officials, employees and partners.

The modernization of the Southlake facility is centered on three priorities: supporting efficiency and sustainable growth, strengthening a USMCA-compliant electronics supply chain in North America and laying the foundation for future investments and customer collaboration. The relaunch also positions the site as a hub for enhanced box-build assembly capabilities. With this relaunch, Variosystems sets its mission of co-creating with innovators, advancing EMS expertise and delivering integrated solutions with greater proximity to its North American customer base.

Inventec to Establish Manufacturing Facility Near Houston

KATY, TX – Top 10 EMS/ODM Inventec is set to establish a presence in the Houston suburbs, with renovations beginning this fall on its first facility in the region. The company has leased approximately 540,000 sq. ft. of space in Katy, signaling a long-term commitment to the area.

Phase I of the project, backed by a $5 million investment, will convert 39,390 sq. ft. of the warehouse into an electronics assembly facility. Work is scheduled to begin last month, with completion expected by the end of October. Investor filings project up to $55 million in leasehold improvements over the 10-year lease, suggesting further expansions are planned.

Industry reports link the Katy facility to Inventec’s broader $85 million US investment strategy approved earlier this year, with Texas chosen for its reliable power grid, proximity to Mexico operations and suitability for high-demand assembly such as AI servers.

Benchmark Names Moezidis Next CEO, Benck to Retire in 2026

TEMPE, AZ – Benchmark Electronics in September promoted David Moezidis to president, and named him the successor to longtime chief executive Jeff Benck, who is retiring next year.

Moezidis, who was Benchmark’s executive vice president, will also retain his position as chief commercial officer. He has more than 35 years of experience in engineering, operations and sales across the EMS, semiconductor and digital imaging sectors.

Benck, who has led the company since 2019, is set to retire Mar. 31. He will continue as an advisor until March 2027 to ensure a smooth transition.

Scanfil Expands and Modernizes Johor Bahru Facility

JOHOR BAHRU, MALAYSIA – Scanfil has officially inaugurated the expansion and modernization of its facility here, building its electronics and complex box-build manufacturing capabilities. The $5 million investment, first announced in January, expands production space by nearly 50% and enhances efficiency, quality and capacity.

The Johor Bahru site, which became part of Scanfil through the acquisition of SRXGlobal in October 2024, employs 170 people and operates on one-stop-shop principles for electronics manufacturing. The upgrades include new machinery, enhanced IT systems and a redesigned layout under Scanfil’s Dream Factory program, which integrates IT, processes and technology.

CEO Christophe Sut highlighted that the expansion reflects strong customer demand and the favorable business environment in Malaysia, reinforcing Scanfil’s strategic plan in the region.

Syrma, Elemaster Launch India JV for High-Rel Electronics

BENGALURU – Syrma SGS Technology has signed a joint venture agreement with Italy-based Elemaster to form Syrma SGS Elemaster Private Limited, an India-focused platform serving high-reliability customers in railway, industrial and medical electronics. The JV’s initial ~20,000 sq. ft. facility in the Bommasandra Industrial Area of Bengaluru will be configured for SMT, THT and box-build assembly lines.

The partnership combines Syrma’s scaled, cost-efficient manufacturing with Elemaster’s design expertise and European OEM relationships, aiming to unlock margin-accretive growth, increase share-of-wallet with global accounts and accelerate “Make in India” solutions. A phased expansion under joint governance is planned to support demand. Company leaders said the JV strengthens India’s position as a trusted hub for advanced manufacturing while giving customers local production with global quality and traceability.

Nathan Trotter Announces $65M Tin Refining Plant

RICHMOND, VA – Nathan Trotter will invest approximately $65 million to construct a 115,000-sq. ft. tin processing facility on a 44-acre site north of Martinsville, which will significantly increase American tin supply and recycling capabilities. At full capacity, the new Tin Ridge facility is expected to create an estimated 118 local jobs.

The US government has declared tin a critical mineral due to its role in solder used in circuit boards and electronics components for countless commercial and government applications, including critical defense systems, smartphones, flat panel displays, electric vehicles, batteries, advanced robotics, and aerospace technologies.

To address the nation’s dependence on tin imports, Nathan Trotter will develop and operate the nation’s first plant capable of refining “noteworthy volumes” of both tin concentrate and scrap tin in support of the US economy and defense industrial base. The cutting-edge facility has also been designed to utilize the most advanced and environmentally friendly technology, enabling successful operations into the future.

Mexican Tariff Plans Could Cause Headaches in Beijing

MEXICO CITY – Mexico is weighing steep new tariffs on a broad swath of imports as part of an industrial policy aimed at protecting domestic manufacturers.

President Claudia Sheinbaum in September introduced a bill that would impose duties ranging from 10% to 50% on goods spanning various industries, including the automotive sector, which is key to many US-based companies.

The measure is part of the government’s Plan México initiative, unveiled earlier this year, which seeks to reduce dependence on foreign suppliers and increase local production. The bill calls for sourcing at least 50% of “strategic supplies” domestically, positioning tariffs as a “strategic tool” of trade and industrial policy rather than simply a revenue generator. (more)

Among PCB Design, Raises are Up, Benefits are Down and Deadlines Don’t Budge

Boards aren’t the only things getting more complex. Workloads are too.
by Ryann Howard

PCB designers are, by and large, a veteran crew. Many have been in the game for decades, steadily turning out increasingly complex boards while titles and org charts shift around them.

Likewise, the annual PCD&F Salary Survey shows a stable but strained picture. Respins haven’t surged, which speaks well for quality, but workloads are climbing and professional development support hasn’t kept pace. Designers say they can keep projects on track, but they’d like better resourcing and clearer priorities before the pressure ratchets higher.

Financially, the story is steady if not perfect. Salaries continue to climb and bonuses are common, but benefits have stagnated or dropped for a third of respondents. And although job satisfaction trends positive, nearly half see themselves stepping away from the role within the next five years – a reminder that retention and succession planning will soon be just as important as design rules.

A Novel Wrap Plating Method for Multilayer PCB Fabrication

Avoiding via failures caused by barrel plating separation.
by Akber Roy

PCB manufacturers face challenges in the precise registration of multiple layers, which is required to ensure reliable interconnects, and in integrating new technologies that enhance performance. We continuously optimize and simplify processes to improve efficiency, yield and maintain product quality. Balancing these factors is crucial for producing high-density, high-performance PCBs that meet the specific needs of various applications.

Here, we review and explain problems associated with conventional copper wrap plating requirements specified in IPC-6012B, and explore the advantages of the newly developed “Innovative Wrap” technology.

PCBs with via-in-pad designs undergo the VIPPO (via-in-pad-plated-over) process, where manufacturers fill the vias with either conductive or nonconductive epoxy material, then perform planarization and cap plating. Differences in CTE (coefficient of thermal expansion) of via fill material, copper plating and dielectric material cause these materials to expand at different rates during the thermal cycling that occurs during assembly. This differential expansion stresses the interconnect between barrel plating and surface copper, which can lead to reliability issues. As shown in Figure 1, in no-wrap plating, surface plating can separate from the hole plating during thermal cycles of the assembly process, causing via failures.

Cold Paste, Hot Mess

Avoiding solder paste failures through proper handling and preparation.
by Kevin Pigeon

Our technical support team often sees the same preventable issues repeat themselves. Three times this week alone, I traced the root cause of a solder paste problem back to using paste straight out of the refrigerator without warming it up. In each case, once the user followed proper handling procedures, the problem resolved itself.

As more companies lose experienced staff and hire new engineers, these issues are occurring more frequently.

Solder paste is a carefully formulated mixture of metal powder and flux. Its properties – such as viscosity, tack and printability – can be affected significantly by temperature, humidity and agitation (Figure 1).

Designing for Durability: What Parylene Means for High-Rel Electronics

Test points, underfills and connectors: rethinking legacy rules for parylene.
by Mike Buetow

Conformal coatings come in several types, each with its specific properties and performance advantages.

These coatings, which include acrylics, epoxies, silicones, polyurethanes, styrenated block-copolymer and parylene, act as barriers against contamination from chemicals, moisture and humidity, and various corrosive gases and salt sprays that are found in many marine, automotive, industrial and military environments.

In Case You Missed It

Component Reliability

“Reliability Analysis and Parameter Optimization of Board-Level BGA Packaging Structures under Thermal-Drop Impact Load”

Authors: Yanxi Sun, Zixin Zhen, Xuexia Yang, Miao Zhu and Chao Chang

Abstract: A three-dimensional finite element model of board-level ball grid array (BGA) package structure is established, and numerical calculations are performed based on thermal-drop impact load sequence coupling. The effects of chip thickness, solder ball height, diameter and array on its temperature field distribution, solder ball stress and average impact life are investigated. Optimization schemes were designed using Taguchi quadrature and surface response method. The optimal combination of structural parameters to minimize solder ball peeling stress was determined through mathematical and statistical analysis and regression analysis. (Soldering & Surface Mount Technology, Apr. 2, 2025, https://www.emerald.com/ssmt/article-abstract/37/4/308/1256208/Reliability-analysis-and-parameter-optimisation-of)