PCD&F
Schmoll Releases XRA³ X-ray
Schmoll XRA³ series x-ray machines come with 70kV microfocus x-ray source and high-resolution CMOS detector, detects PCBs and enables precise referencing and processing by integrated drilling units. Are for multilayer and innerlayer PCBs. Patented flex-table mounting plate is said to ensure PCB registration due to full-surface vacuum system. Linear motor technology in all axes for system availability and minimal maintenance costs. Comes as manual or fully automatic. XRA³ handles panels up to 710 x 762mm; XRA³ XXL handles 813 x 1219mm.
Schmoll
Stackpole CSSU2512 Resistor
CSSU2512 has a 5W power rating in standard 2512 footprint, using an all-metal element and thermally conductive structure to minimize resistance heat-rise. Delivers 5W performance comparable to lower-rated 3W chips, with resistance options from 1–10mΩ, 1% tolerance and 50ppm TCR.
Stackpole Electronics
Zuken Panel Builder 2026 for E3.series
Panel Builder 2026 is the newest update to the E3.series manufacturing module, adding expanded controls for wiring preparation, assembly coordination and multi-build management. Supports tracking of repeat panel builds under a single project record and aligns wire-processing outputs with Wiring Task Manager data. Includes Skip Attribute filtering for variant-specific exclusions and pin-level wire sorting for refined instruction sequencing. Technicians can toggle between 2-D and 3-D sheets during wiring tasks, with enhanced task filtering and progress indicators for complex assemblies. Assembly workflows permit loading updated .e3s data without clearing existing tasks.
Zuken
CA
A.P.E. Intruder BGA Rework Station
Intruder is a complete hot air BGA rework station with split vision placement/removal capability. Comes with own separate computer (control) station. Features integral split vision placement and removal capability.
APE
ASMPT Siplace V Placement Platform
Siplace V placement platform has a new machine frame and efficient linear drives and measuring systems with increased resolution. Placement heads can now be changed during operation via a central head interface. CP20 placement head places up to 52,500cph with a precision of 25µm @ 3σ). Switches between collect-and-place, pick-and-place and mixed modes via software. Twin VHF placement head handles parts up to 200x150x28mm with up to 100N. Handles components down to 016008M. Come in single or dual gantry versions and can be configured with single or dual conveyors.
ASMPT
Asys VEGO GenS Handler
VEGO GenS handler has modular design and up to 20% faster cycle time than previous models. Transport speed is up to 50% faster and speed range 10x greater. Stores 5x more program memory and 15x more data. Uses up to 100% less compressed air and reduces energy consumption 20% due to use of fewer pneumatic components. Software scales and upgrades on demand. Is self-learning and intuitive.
Asys
Cencorp 1500 OF EVO 2 Odd-Form Placement
1500 OF EVO 2 odd-form placement machine features large feeder bench capable of handling up to 24 different components in all sizes. Average placement speed is 1.9cps with a 400mm pick-and-place cycle using radial components. Robust gantry enables semi-press fit capability with assembly forces up to 600N with full force monitoring during placement process. Exchangeable feeders available for axial, radial and tube feeders. All existing PMJ or Cencorp feeders are compatible. Equipped with software for online CAD import, MES connectivity and traceability.
Cencorp
Indium SiPaste C312HF Solder Paste
SiPaste C312HF halogen-free, cleanable solder paste is for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications. Is said to offer class stencil print transfer efficiency and stencil life with consistent printing, response-to-pause, and reflow performance. Post-reflow flux residue can be cleaned with a standard cleaning process using semiaqueous chemistries or a saponifier, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not required. Offers slump resistance, low voiding across all components, minimal stencil cleaning during printing, a wide reflow profile window, and wets to various metallization. Is specifically designed for fine-feature printing with fine powders ranging from Type 5 to Type 8.
Indium Corp.
Juki RS-2 Component Mounter
RS-2 offers high-speed placement up to 50,000cph, aided by laser sensor closer to the board and reduces travel time from pick-up to placement. Height of laser sensor on 8-nozzle Takumi head automatically adjusts based on height of each component being placed, Component height can be selected from six levels: 1, 3, 6, 12, 20, and 25mm. Handles various component shapes, including BGA, SoP and QFP, ranging from 03015 to sizes up to 74mm square or 50mmx150mm, with placement heights accommodating up to 25mm. RF feeder supports up to 112 feeder units (front and rear combined). Is for multi-product, small-lot production with minimized setup times. Coplanarity sensor detects floating and BGA ball deformation to prevent placement of defective components.
Juki Automation
Keiron LiFT Printer
LiFT printer offers stencil-free paste application for component assembly. Unlike a traditional stencil of a jet or ink printer, uses a fully digital, contactless process, for precision, repeatable results down to the nanoliter level. Built-in solder paste volume metrology (SVPM) reduces need for additional inspection. Can handle deposits down to 01005.
Keiron Technologies
Mirtec TAL 3D Scan
TAL 3D Scan inspection module attaches to MV-6 Omni 3-D AOI, performing pre-inspection while main 3-D AOI operates. From a system-wide perspective, this is equivalent to inspecting two PCBs simultaneously. Consistently operates faster than the MV-6 Omni, effectively converges inspection time to zero within overall manufacturing process. Inspects components higher than 5mm, which typically takes longer to inspect beforehand, significantly reducing total inspection time.
Mirtec
Mycronic BA 01 Small Dot Ejector
BA 01 small dot ejector for MY700 jet printer accommodates solder paste deposits from 180 to 330µm in diameter with a volume ranging from 1 to 4nl. Reportedly reduces risk of overprinting, solder bridging and solder balls. Supports pitch sizes down to 0.35mm. Offers software-controlled variability, delivering multiple dot and volume size using only one applicator.
Mycronic
Mycronic MYPro A41DX, A41SX Placement Machines
MYPro A41DX and A41SX placement machines handle boards up to 1,000mm x 609mm in size, 12.5mm thick and up to 10kg using new T1000 conveyor. MX7 head places a significantly larger range of components of any size with perfect precision on a large substrate. Full backward compatibility with existing feeders and magazines. A41DX-17 has a rated speed of 49,000cph and includes standard electrical verification of components for quality assurance.
Mycronic
Mycronic GenI 3-D Metrology Inspection
GenI offers true 3-D metrology inspection and full measurement traceability. Is said to complete automatic AOI program generation setup in 10 min. or less with CAD data from Mycronic pick-and-place, permitting inline AOI without production stoppage during new product introduction. AI-powered, library-free inspection eliminates need for inspection libraries, ensuring consistent results regardless of programmer expertise. Inspection program based on first assembled board; no need for golden or perfect board.
Mycronic
Nordson SQ5000Pro Multi-Function Inspection
SQ5000Pro combines AOI, SPI and CMM-grade metrology in a single inline system. Platform captures dimensional, positional and volumetric data in seconds. Two new 500-series multi-reflection suppression (MRS) sensors – HR and HS variants – are said to deliver distortion-free imaging on reflective and complex surfaces. Unified architecture is suited for applications including fine-pitch SMT, advanced packaging, 0201 metric components, sockets and connectors and precision geometry measurement. Coordinate measurement software suite enables CMM-level accuracy at production throughput, while the updated AutoProgram tool leverages AI to reduce setup time and identify features and inspection regions.
Nordson
Shenmao SMF-TA52 Transient Adhesive
SMF-TA52 zero-residue transient adhesive is for assemblies using formic acid reflow. Holds solder preforms, dies and wafers in place during heating and reportedly breaks down fully at peak reflow, eliminating post-process cleaning. Supports dispensing and jetting and is compatible with formic acid reflow, vacuum reflow and silver sintering. Is SVHC-free, halogen-free and no-clean, meeting requirements common in semiconductor packaging and power-module production.
Shenmao Technology
Topline Zero Ohm Jumpers and Dummy Components
Zero Ohm jumpers and dummy components come in multiple body sizes and pitches for routing changes. SnPb and lead-free versions ship from stock for training applications and design modifications. Components support post-production changes, replacement of obsolete parts and routing adjustments on single-sided layouts. SOT23 Zero Ohm jumper package enables board-level routing changes without generating a new layout file.
TopLine Corp.
Vision Engineering ProteQ VISO 3-D Digital Stereo Microscope
ProteQ VISO 3-D digital stereo microscope has integrated autostereo display for eyepiece-free viewing for inspection and design workflows. Twin cameras and eye-tracking generate true 3-D images on a flat screen, supporting precision tasks in electronics, medical devices, micromolding and aerospace components. Includes upright viewing angle, adjustable display and a 10:1 zoom range, with option to switch between 3-D and 2-D modes for individual or group evaluation. Digital tools include image and video capture, picture-in-picture, overlays, annotation and measurement, with integration options for external software and connected platforms.
Vision Engineering