PCD&F
ETCO TFC and FWC Series Flex Circuit Connectors
TFC and FWC series flex circuit connectors are designed for attaching lead wires to flexible circuits and laminates used in space-constrained or dynamic applications. Use lances that embed into aluminum- or copper-foil and film laminates and terminate to lead wires using an F-crimp. Intended for flex circuits that bend, fold or move during operation in consumer, medical, aerospace and military electronics. TFC series supports thin films measuring 0.01″–0.025″ with 18–22AWG wire, while FWC series supports foil or film laminates measuring 0.01″–0.04″ with 16–22AWG wire. Both series come in brass or tinned high-brass and are supplied in strip form for automated production.
ETCO Inc.
Inneos Cheetah 25G Optical Transceiver
Cheetah 25G optical transceiver is built on the company’s OptoBGA platform and supports high-speed data transmission in applications where copper interconnects face limitations related to electromagnetic interference, weight, power and system cost. Designed for systems requiring 25G connectivity across wide temperature ranges and harsh operating environments. Supports high-volume assembly processes while maintaining signal integrity at high data rates.
Inneos
Keysight 3D Interconnect Designer
3D Interconnect Designer software supports design of complex interconnect structures in chiplet and 3-D IC packages used in AI infrastructure and data center applications. Addresses manual optimization challenges in multi-die and stacked-die designs, including vias, transmission lines, solder balls and micro-bumps. Supports advanced geometries such as hatched and waffled ground planes used in silicon interposers and bridge-based architectures. Validates designs against emerging standards including UCIe and BoW and incorporates electromagnetic-based simulation for electrical analysis of PCB- and package-level 3-D interconnect structures.
Keysight Technologies
Molex Impress Co-Packaged Copper Solutions
Impress Co-Packaged Copper Solutions is a compression-based connector and cable assembly for near-ASIC connectivity in high-speed data center systems. Supports data rates up to 224Gbps PAM-4 and is intended for next-generation AI and hyperscale computing architectures. Places connection interface directly on ASIC package substrate to reduce signal path length through PCB. Two-piece system consists of compression-attached socket and mating cable assembly designed to manage signal integrity and power distribution in high-density environments. Compression attachment minimizes substrate stress and supports maintenance or rework. Enables 1.6T and 3.2T networking transitions in AI and cloud infrastructure environments.
Molex
Stackpole RNCA Resistors
RNCA Series AEC-Q200 qualified thin-film chip resistors offer anti-moisture and anti-sulfur performance, for automotive applications. Are said to cut failure rates by a factor of 10 or more compared to conventional thin-film resistors while meeting automotive qualification requirements.
Stackpole Electronics
Vishay CRCW0201-AT e3 Resistors
CRCW0201-AT e3 series AEC-Q200 qualified thick-film resistors come in 0201 case size measuring 0.6mm × 0.3mm × 0.23mm. Designed to reduce PCB space requirements by approximately 50% compared to 0402 components. Provide a power rating of 0.05W at +70°C, maximum operating voltage of 30V and operating temperature range of -55° to +155°C. Resistance values range from 10Ω to 1MΩ, including a 0Ω jumper option, with tolerances of ±1% and ±5% and temperature coefficient of ±200ppm/K.
Vishay Intertechnology
Vishay IHLL and IHLP Series Power Inductors
IHLL (commercial grade) and IHLP (AEC-Q200 automotive grade) power inductors come in 0806 and 1210 case sizes. Include IHLL-0806AZ-1Z, IHLL-1210AB-1Z, IHLP-0806AB-5A and IHLP-1210ABEZ-5A models supporting inductance values from 0.22µH to 4.70µH with typical DCR as low as 6.6mΩ. Operate at temperatures up to +165°C. Use composite powdered-iron construction that fully encapsulates windings. Automotive versions feature side-plated terminations to support solder fillets and inspection, while commercial versions use bottom-only terminations.
Vishay Intertechnology
Vishay RCA-SR e3 Thick-Film Resistors
RCA-SR e3 Series AEC-Q200-qualified thick-film chip resistors are for sulfur-containing environments and come in 0201, 0402, 0603, 0805 and 1206 case sizes. Provide resistance values from 10Ω to 10MΩ, including 0Ω jumpers, with tolerances of ±1% and ±5% and TCR of ±100ppm/K and ±200ppm/K. Rated for power up to 0.25W and operating voltages from 30V to 200V, with operating temperature range of -55°C to +155°C. Meet ASTM B809-25 sulfur resistance testing with maximum resistance drift of 1% after 1000hr. at 60°C and specify ΔR/R ≤ 1% after 1000hr. of rated power at 70°C. Feature protective coating and pure matte tin terminations compatible with lead-free and lead-containing solder processes.
Vishay Intertechnology
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CA
Adaptsys 3DInspect Automated Carrier Tape Inspection System
3DInspect is an automated system for inspecting carrier tape pockets and generating Certificates of Conformance. Measures carrier tape dimensions and produces inspection reports automatically, reducing inspection time per reel from up to 30min to approximately 1min. Replaces manual inspection and documentation processes. Can be used as a standalone inspection tool or integrated into tape-and-reel operations.
Adaptsys Group
Count On Tools Large-Format Vacuum Nozzle
Large-format vacuum nozzle is designed for Yamaha YRM pick-and-place platforms to improve handling stability and pickup reliability for larger and heavier SMT components in high-mix production environments. Features a 25mm base diameter to increase surface contact during vacuum pickup and is precision-machined to fit ANE locations 64, 66 and 68. Includes 15mm O-ring.
Count On Tools
Henkel Loctite Stycast UV 7998 Conformal Coating
Loctite Stycast UV 7998 solvent-free conformal coating provides UL 94 V-0 flame retardancy for printed circuit boards and components. Protects against moisture, dust, chemicals and other contaminants. Offers self-leveling behavior, wetting and uniform coverage without voiding. Cures within seconds under UV light, followed by a secondary moisture cure. Formulation is solvent- and VOC-free.
Henkel
Inspectis HD-124-WUV Dual White & UV Ring Light
HD-124-WUV Dual White & UV Ring Light is for use with digital microscope systems. Integrates 32 white LEDs and 8 high-power UV LEDs arranged in dual rings for sequential or independent illumination control. Features integrated on/off switch, electronic dimmer and dedicated UV and segment control switches to adjust lighting zones. Powered directly through the digital microscope to reduce cable management. Includes detachable diffuser with optional polarizer/analyzer filter kit available.
Inspectis
Koh Young Revolution to Success (RtoS) Inspection Software
Revolution to Success (RtoS) inspection software platform unifies programming, review, analytics and process optimization within a single operating environment. Designed to manage inspection data more efficiently and consolidate inspection functions into one interface. Supports integration across AI-powered inspection systems, including closed-loop optimization in printing and placement processes.
Koh Young
Kurtz Ersa HR 600 XL Heating Head
HR 600 XL heating head supports controlled rework of large-format and high-density assemblies. Designed for BGAs, QFNs, connectors and complex components. Integrates with vision alignment and process control to deliver repeatable thermal profiles.
Kurtz Ersa
Kurtz Ersa i-CON TRACE Networked Soldering Station
i-CON TRACE soldering station provides traceability, IoT connectivity and IPC CFX certification for hand soldering operations. Captures process data to support quality documentation, compliance requirements and connected factory integration.
Kurtz Ersa
Kurtz Ersa VersaFlex 2.0 Selective Solder Module
VersaFlex 2.0 selective solder module enables independent, parallel processing of two PCBs within a single system. Supports automatic nozzle changing and matrix-controlled preheating to improve throughput, setup consistency and repeatability in high-mix production environments.
Kurtz Ersa
Magnalytix OE in a Box Objective Evidence Kit
OE in a Box is an objective evidence kit designed to support J-STD assembly cleanliness and reliability validation. Consolidates materials required for surface insulation resistance testing and objective evidence generation, including B-52 Legacy 2 SIR test cards, components and supporting materials, into a single package. Intended to streamline objective evidence workflows and align with third-party validation and reporting requirements used in assembly qualification and compliance programs.
Magnalytix
OM Digital Solutions TG-7 Industry NY-TGV Super Adapter Kit
TG-7 Industry NY-TGV Super Adapter Kit is a digital camera and microscope adapter system for digital imaging from binocular stereoscopic microscopes used in inspection, research and testing. Integrates TG-7 Industry digital camera and NY-TGV Super Adapter to enable image capture and live viewing without modification to the optical system. Supports HDMI output to external monitors, wireless image transfer and remote operation. Includes dedicated microscope adapter mode, date stamping and support for write-once memory cards for documentation.
OM Digital Solutions
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