PCD&F

Anthropic is building an in-house chip design team to develop custom AI processors, complementing its use of hardware from AWS, Google, Nvidia and AMD.

Eiso Enterprise opened a second-phase expansion at its Guishan plant, doubling PCB capacity for AI and aerospace demand.

Molex invested in CAEPlus to advance active liquid-cooling technology for AI data centers.

Syrma SGS and Kaga Electronics India formed a joint venture to manufacture bare PCBs in Haryana.

ZenaDrone began flight testing custom-designed printed circuit boards manufactured in-house.End of article content

CA

EMPEL Systems selected Altus Group to supply an advanced power electronics manufacturing line.

Keiron raised $21 million in a Series A round for its digital printed circuit board printing technology.

Komatsu Midori-Kai named Matric grand partner.

LG Electronics is expanding its Latin American footprint with a smart-factory production hub in Paraná, Brazil.

Pegatron is expanding operations in Ciudad Juárez, Mexico, with a $330 million investment.

Sanmina-SCI India was approved to establish a manufacturing unit in Oragadam, Sriperumbudur, expected to generate 1,350 jobs.

StenTech is expanding its North American manufacturing capacity.

Surrey Satellite Technology installed a Scienscope Smart Rack system.

Sypris Electronics won a manufacturing deal to produce complex electronic power assemblies for a new LEO satellite constellation.

Velocity Group opened an electronic and electromechanical products manufacturing plant in Ohio.

Zero Defects International more than doubled its flying-probe ICT testing capacity with new equipment.

Zollner Elektronik is building Phase 2 of its project in Cartago, Costa Rica, including a nearly 10,000-sq.-m. production, office and logistics facility.End of article content