Off The Shelf typography
Off The Shelf typography
Machines Materials Tools Systems Software
Avishtech Gauss Stack Pro Software
Gauss Stack Pro software reportedly enhances PCB prototyping and reliability. Goes from stackup to layout in same environment to look at areas of concern from manufacturing, reliability, signal integrity and thermomechanical behavior standpoints. Can input layout files directly into software. Provides detailed, spatial simulation of factors such as glass stop, resin starvation and filler damming. Developers can simulate impact of imbalance of layouts on board level warpage. Stackups and layouts can be visualized and meshed.
Avishtech
Keysight PathWave Advanced Design System (ADS) 2023 RF/Microwave Software
Keysight PathWave Advanced Design System (ADS) 2023 RF/Microwave Software
PathWave Advanced Design System (ADS) 2023 integrated design and simulation software addresses increasing design complexity and higher frequencies for radio frequency (RF) and microwave designs. Includes enhancements to electromagnetic (EM) simulation for circuit designers. Streamlines integration of multi-technology circuit assembly and simulation into enterprise EDA design workflows. Addresses signal complexity, design densification, multi-technology integration and frequencies moving to 60GHz and beyond.

New features include: Automation of EM-circuit co-simulation setup which ensures that analysis is easily accessible by circuit designers without the help of an EM expert or the need for invasive layout editing. Advanced EM solvers and meshing technologies are accessible via a single unified environment with parallelized simulation acceleration through cloud-based, high-performance computing (HPC) that supports fast, high-capacity simulation. Seamless integration with Cadence Virtuoso, Synopsys Custom Compiler and Ansys HFSS facilitates enterprise electronic design automation signoff workflows.

Keysight Technologies
KiCad 6.0.6 PCB CAD
KiCad 6.0.6 PCB CAD
KiCad 6.0.6 EDA software contains bug fixes and other minor improvements, including the following: fix intermittent QA crash; fix stock templates path for flatpack; allow closing PCM progress windows after installation from ZIP file; enable and disable apply and discard buttons in PCM; fix net highlighting between schematic and board editors; fix “select previous symbol” toolbar state in footprint assignment tool; update selection filter title bar with language changes; implement cross-references for labels; resolve title variable when plotting; plot alternate pin definitions correctly; fix library symbol properties dialog tab selection bug; fix duplicate pin number test; fix duplicate messages when updating schematic from PCB; fix blind via visibility issue; fix reference and value variable expansion; change default symbol matching to use UUID instead of reference when back annotating schematic; use correct backside placement angle using experimental Gerber export option; import P-CAD footprints to correct layer; Import Eagle octagonal pads correctly; prevent length and skew tuning dialog values from becoming negative; fix router not on grid issue; maintain visibility state when changing layer count; many router fixes; export microvias correctly to Hyperlynx; and others.
KiCad
Molex Quad-Row Board-to-Board Connectors
Molex Quad-Row Board-to-Board Connectors
Quad-Row board-to-board connectors feature staggered-circuit layout. Support compact form factors, including smartphones, smartwatches, wearables, game consoles and AR/VR devices. Pins are positioned across four rows at signal contact pitch of 0.175mm. Adhere to 3.0A current rating. Align with standard soldering pitch of 0.35mm to expedite volume manufacturing using typical SMT processes. Interior armor and insert-molded power nail safeguard pins from damage during volume manufacturing and assembly. Suited for applications requiring small PCBs and flex assembles. Come in 32- and 36-pin configurations with 20- and 64-pin configurations coming soon. Plans are underway to support up to 100-pin counts.
Molex
Rohm BD9xxN1 Series Automotive LDO Regulator ICs
BD9xxN1 series automotive LDO regulator ICs have stable operation at nanoscale output capacitance. BD950N1G-C, BD933N1G-C, BD900N1G-C, BD950N1WG-C, BD933N1WG-C and BD900N1WG-C are optimized for primary (direct connection to 12V) power supplies in applications including powertrain, body, ADAS and car infotainment. In addition to common µF-order MLCCs (multilayer ceramic capacitors) and large-capacitance electrolytic capacitors, regulators can handle output capacitances down to 1µF or less in 0603/0402 size. Meet basic requirements of automotive products, such as operation above 125°C, qualification under the AEC-Q100 automotive reliability standard, and input voltages greater than 40V for primary power supply. Support output capacitance of 100nF.
Rohm Semiconductor
Saturn PCB Design Toolkit v. 8.20
Saturn PCB Design Toolkit v. 8.20 includes the following calculators: microstrip; stripline; differential pair; via current; PCB trace current; planar inductor; padstack; crosstalk; Ohm’s law; XC XL reactance; BGA land; Er effective; wavelength; and PPM. Incorporates current capacity of PCB trace, via current, differential pairs and more.
Saturn PCB Design
Stackpole HCSM2818 Resistors
HCSM2818 resisters are rated at 5W and now provide a 2mΩ resistance value with TCR of 100ppm. Are stable at wide range of temperatures and power loads. Applications include power modules and inverters, lithium ion battery management, portable power management for electric and hybrid motor control, and defense electronics.
Stackpole Electronics
Stackpole CSNL2512-3W Resistor
Stackpole CSNL2512-3W Resistor
CSNL2512-3W current sensing resistor now includes 0.2mΩ resistance value. Handles 3W of power, while providing TCR from ±50ppm for 1 and 2mΩ to ±175ppm for 0.2mΩ. AEC-compliant CSNL offers stable performance with expected change in resistance of less than 1% for most industry standard performance tests, including load life, short-time overload and biased humidity. Ideal for electric vehicles, power tools, HVAC controls, instrumentation, programmable power supplies, networking and infrastructure equipment, and communications equipment.
Stackpole Electronics
Ucamco Reference Gerber Viewer
Reference Gerber Viewer now includes formal syntax checker. Reports imperfections. Visualizer accepts almost anything following specification. Syntax checker reports syntax errors. Is accessible from any modern web browser.
Ucamco
Zuken eCADStar 2022 ECAD
Zuken eCADStar 2022 ECAD
eCADStar 2022 PCB design software offers advanced capabilities for organization and reuse of designs, fine-tuning of high-speed circuitry, and layout and modification of densely populated PCB layouts through semiautomatic functionality. Organization of large circuit diagrams in schematic application has been simplified with additional support for multi-instanced hierarchy, making it possible to group circuit parts (e.g., multi-channels, like amplifiers) that are used several times in a design into hierarchical blocks. Blocks can be replicated in any number of instances. All instances are updated automatically whenever changes are made to block definition. Library management now has 3-D Model Manager that can import ProStep and other 3-D formats. Models can be organized into sub-folders. Overhaul of Configuration Editor makes it easier to define or edit physical track and layer stack cross-sections for analysis. Users can define etch factors to compensate for impedance variations introduced by inaccuracies in etching process, either for entire designs or for individual PCB tracks, enhancing accuracy of signal integrity analysis, especially for ultra-high-speed differential signals. Bi-directional cross-probe between Electrical Editor and Schematic and PCB has been introduced. Modification of existing layout patterns, such as moving placed components, now supports push-aside, automatically adjusting surrounding components and corresponding routing patterns in real-time. Routing of multi-pad footprint pads, in which single pins correspond to multiple IC pads, is now supported. Component positions can be exported to CSV file for either entire layout or part of it.
Zuken
Insituware SM-100 Smart Mixer
Insituware SM-100 Smart Mixer
SM-100 smart mixer provides solder paste mixing with real-time quality control and materials traceability. Automatically mixes solder paste jars to fit-for-use state. Monitors temperature, mixing time and fitness. Can mix solder paste directly from cold storage to bring to room temperature. Provides red, yellow and green light indicators of paste quality with reusable lid that attaches to solder paste jar. Reportedly eliminates hand mixing, reduces mix time and ensures repeatability. Mixing cycle provides statistical process control and documentation. Provides insight on paste quality before printing. Measurements correlate to J-STD-005 standards and IPC- TM-650 test methods.
Insituware
Insituware CC-100 Thickness Tester
Insituware CC-100 Thickness Tester
CC-100 thickness tester provides nondestructive and contactless conformal coating thickness measurements. Measures dry thickness of conformal coatings to verify against IPC-A-610 requirements. Measures wet thickness of conformal coatings to provide insight for process adjustments. No ground plane is required. No measurements of uncoated boards required. Multi-coating support: acrylic, polyurethane, silicone, epoxy and UV. Less than 5 sec. measurement time. Reportedly eliminates need for coating test coupons. Local and cloud data storage for traceability and process control.
Insituware
Inspekto S70 Autonomous Machine Vision System Software
Inspekto S70 autonomous machine vision software features recommendations center that guides users to create and maintain inspection profiles and improve process integration and accuracy of inspection. Incorporates profile center, including tools that guide users when adjusting profile. Can compare previous and new profiles for same item. Serves as long-term QA solution. Includes AI-based active recommendations to adapt profile to production changes, either process- or environment-related. Can increase or decrease sensitivity to specific types of defects, while sensitivity to other defects remains unaltered; this can be done by selectively adding defected samples to profile parameters. Can add to profile both good (OK) and defected (NOK) samples for performance finetuning. Can define unlimited regions of interest within part and adjust size and sensitivity thresholds independently for each one. Inspects highly reflective objects regardless of whether inspected item is stationary or moving. Incorporates antireflection technology that can be applied to moving objects as well as stationary ones.
Inspekto
Master Bond EP17TF Epoxy
Master Bond EP17TF Epoxy
EP17TF one-part epoxy has paste consistency and can be dispensed evenly and uniformly. Has glass transition temp. of 150°-155°C and service temp. range from -150° to +550°F. Is designed to compensate for thermal mismatches. Resists impact, vibration, shock and rigorous thermal cycling. Is reliable electrical insulator, possessing volume resistivity greater than 1015 ohm-cm and dielectric constant of 4.5 at 60Hz at room temp. Maintains electrical insulation properties. Has good toughness with elongation of 5-10%. Exhibits superior strength properties, bonding well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. Offers lap shear strength of 3,200-3,400psi, tensile strength of 8,000-9,000psi and tensile modulus of 350,000-400,000psi at 75°F. Requires elevated temp. cure of 300°F for 5-6 hr., followed by post-cure at 350°F for 4-5 hr. Additional post cure is recommended. Withstands acids, bases, fuels, oils and many solvents. Is available in standard packaging from ½ pint containers up to 5-gal. pails.
Master Bond
Kyocera AVX Interactive Component Search Tool
This interactive component search tool is available as a fixed navigation menu option on the Kyocera AVX website and accessible via computer, tablet or smartphone. Explores extensive selection of company’s antennas, capacitors, circuit protection devices, filters, couplers and inductors, as well as view and purchase available stock from authorized distributor network. Groups products by technologies and common features. Interface features filtering menus that allow customers to narrow down list of suitable components and clickable product selections represented by component pictures. Once users narrow search to specific product line, they receive list of active part numbers. Clicking one of the part numbers reveals detailed product data, including parameters, descriptive information, downloads such as spec sheets, datasheets, product catalogs and available product stock at authorized distributors.
Kyocera AVX
Promation Panda 500 CE Robotic Soldering System
Promation Panda 500 CE Robotic Soldering System
Panda 500 CE robotic soldering system is capable of processing 500mm x 500mm PCB or pallet and deploying vision for fine alignment. Has multiple witness cameras for up-close viewing, dual-touch screen monitors and PCB visual import for programming.
Promation USA
Shenmao SMEF-Z52 Flux
Shenmao SMEF-Z52 Flux
SMEF-Z52 enhanced solder joint encapsulation material flux combines abilities of conventional flux and underfill. Epoxy cures after reflow and provides excellent bonding strength and joint protection. Is active epoxy flux designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. Activator helps eliminate solder balls and form smooth solder joints. Epoxy flux residue is cured and provides mechanical support to joint after reflow. Reportedly doesn’t require cleaning and is compatible with molded underfill and capillary underfill. Is suitable for system-in-package (SiP), wafer-level-package (WLP) and flip chip. Is halogen-free and complies with RoHS, RoHS 2.0 and REACH. Is designed for use in stencil printing, dispensing, jetting, dipping and pin-transfer processes.
Shenmao