Printed Circuit Design & Fab Circuits Assembly January 2022 cover
January 2022
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January 2022 • VOL. 39 • NO. 1
Printed Circuit Design and Fab Circuits Assembly logo
First Person
Tackling skilled labor shortages.
Mike Buetow
money matters
Let’s talk.
Peter Bigelow
Preparing for supply-chain pressures.
Gene Weiner
Tech Talk
Out in the cold.
John Burkhert, Jr.
A modest sampling of a big phrasebook.
Robert Boguski
Root causes of field returns.
Allen Abell
When not to go green.
Bob Willis
January 2022 • VOL. 39 • NO. 1
Printed Circuit Design and Fab Circuits Assembly logo
Billions of dollars are lost each year designing products that are expected to fail EMC testing. The billion-dollar mistake is rooted in the misunderstanding of the nature of electronic energy. One drawing is to blame.
by Daniel Beeker
Printed Circuit Design & Fab Circuits Assembly January 2022 cover
A look at what PDN impedance and target impedance are and an explanation of their importance for the design of modern high-speed digital boards.
by Ralf Brüning
Do classic design rules apply in the case of thin foils? A series of experiments test the well-known area ratio rule.
by Chrys Shea, Greg Smith and Ray Welch
IN the Digital Edition
Updates in silicon and electronics technology.
by Binghamton University
College Training Programs for Electronics
Thermal Management
Solder Paste Inspection
POSTMASTER: Send address changes to
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Editor in chief
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Chelsey Drysdale, 949-295-3109,

editorial office
P.O. Box 470, Canton, GA 30169

Akber Roy, Peter Bigelow, John Burkhert, Mark Finstad, Bill Hargin, Nick Koop, Greg Papandrew

Clive Ashmore, David Bernard, Robert Boguski, John D. Borneman, Joseph Fama, Susan Mucha, Chrys Shea, Jan Vardaman, Ranko Vujosevic


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vice president, editorial and production
Mike Buetow

Printed Circuit Design & Fab/Circuits Assembly is distributed without charge to qualified subscribers. For others, annual Subscription Rates in U.S. funds are: $80 (U.S. and Canada), $145 (all other countries). Single copy price is $8.50. All subscription and single copy orders or inquiries should be directed to Printed Circuit Design & Fab/Circuits Assembly, PO Box 470 Canton, GA 30169, email

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The Route
A headshot photo of Mike Buetow smiling (Editor-in-Chief at UP Media Group)
Next-Generation Engineers Need Next-Generation Training

ou know the labor situation is bad when even the Air Force is getting involved to find solutions.

Indeed, as was recently announced, the Air Force Research Laboratory is working with NextFlex to come up with ways to attract students to careers in technology and science.

NextFlex isn’t a random choice. It was formed under the auspices of the US Department of Defense’s Manufacturing Technology Program. As one of eight DoD Manufacturing Innovation Institutes, the consortium is a partnership among the DoD, industry and academia. Its specific focus is development of flexible hybrid electronics (FHE), and to develop an education and workforce development program.

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Around the World
PCDF People
Canadian Circuits appointed Richard Denier general manager.
A headshot picture of Erik Weyls grinning
MacDermid Alpha Electronics Solutions appointed Erik Weyls vice president, Circuitry Solutions. He most recently held several positions of executive leadership with Coventya, a specialty chemicals solutions provider.
Microsoft named Ian Jackson PCB layout team manager.
A headshot picture of Greg Caldwell grinning
Nano Dimension appointed Greg Caldwell vice president of global marketing. He previously was head of marketing and sales enablement with Anark, and has held director level positions at 3D Systems, Microsoft and Sun Microsystems.
A headshot picture of Bob Burns smiling
Printed Circuits promoted Bob Burns to vice president, sales and marketing. He has been with the fabricator in sales for more than 20 years.
Around the World
PCB West Issues Call for Abstracts for Fall Show
ATLANTA – UP Media Group Inc. seeks abstracts for its annual PCB West technical conference coming in 2022. PCB West will be held October 4 to 7, 2022, in Santa Clara, CA. The event includes a four-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center.

Presentations of the following durations are sought for the technical conference: one-hour lectures and presentations; two-hour workshops; and half-day (3.5 hour) and full-day seminars.

Preference is given to presentations of two hours in length or more, and no presentations of less than one hour will be considered.

Papers and presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Abstracts of 100 to 500 words and speaker biographies should be submitted to by Feb. 25. Accepted presentations are due Aug. 31.

Speakers receive complimentary access to the online proceedings, complimentary pass to the technical conference, and more.

PCD&F/CIRCUITS ASSEMBLY is media partner for the event, and the Printed Circuit Engineering Association is a sponsoring association. (CD)

Around the World
Nan Ya PCB to Acquire Symtek Automation Asia
TAICHUNG CITY, TAIWAN – Nan Ya Printed Circuit Board announced it is acquiring Symtek Automation Asia for NT $502.3 million (US $18 million). A 30% deposit will be paid; 60% will be paid after delivery, and 10% after acceptance.

Executive officers approved the transaction after the procurement organization completed a price comparison and negotiation.

Symtek supplies printed circuit board and semiconductor process equipment. It has over 350 employees in Zhongli, Taiwan, and over 350 employees in Dongguan, China. The company was founded as Schmid Automation Asia, then went indepen- dent in 2014 and was renamed Symtek Automation Asia. (CD)

Around the World

CIRCUITS ASSEMBLY Reopens SEA Registration

Blue logo for Circuits Assembly's Service Excellence Awards
ATLANTA – CIRCUITS ASSEMBLY reopened registration for its annual Service Excellence Awards (SEAs) for EMS providers and electronics assembly equipment, material, service, and software suppliers. The 2022 program returns to its original format after a focus group of past participants emphasized the value of the feedback they receive from their customers.
Now in its 30th year, the SEAs honor companies for excelling in the critical area of customer service, permitting participants to benchmark customer service against their peers. It is the only industry awards program that uses direct customer feedback to determine best-in-class.

Customers are surveyed to determine their satisfaction with a participating company in various categories, including dependability/timely delivery; manufacturing quality; responsiveness to requests and changes; technology; and value for the price. For the first time this year, participants will be rated on flexibility/ease of doing business.

Around the World
CA People
Cristian Tudor HeadshotÂngelo Marques Headshot
Indium promoted Cristian Tudor (top left), to senior applications engineer, and Ângelo Marques has been appointed design for excellence (DfX) specialist in Europe. Tudor joined Indium as an applications engineer in 2000 and is based in Romania. Marques has over 25 years’ automotive electronics experience in new product introduction and process optimization.
Bright Machines announced cofounder and CEO Amar Hanspal is stepping down and cofounder Lior Susan has been appointed interim CEO.
Creation Technologies named Farid Anani vice president/general manager.
Joel Scutchfield Headshot
KIC promoted Robert Baxter to customer success manager.
Kimball Electronics appointed Douglas Hass chief compliance officer.
Ray Bellavance Headshot
MicroCare named Ray Bellavance vice president, Global Sales & Marketing. He joins the company with nearly 30 years’ experience selling industrial chemicals and tools, including MicroCare products.
Virtex Enterprises appointed Michael Maloof business development manager – Medical Sector.
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Around the World
Elin Electronics Files for IPO
DELHI – Electronics manufacturer Elin Electronics has filed for an initial public offering. The company’s IPO comprises equity shares of face value of Rs 5 (US$0.067) each, comprising a fresh issue aggregating up to Rs 1.75 billion, and an offer for sale of up to Rs 5.85 billion.

Currently, eight individual promoters hold 38.69% and other selling shareholders own 52.51% stake in the company.

Proceeds from the fresh issue will be used to the extent of Rs 800 million to repay/prepay debt and Rs 489.7 million for funding capital expenditure for upgrading and expanding existing plants.

Revenues from operations increased 9.8% year-over-year to Rs 8.6 billion in fiscal 2021 primarily due to increased consumer purchases of home and personal appliances aided by the relaxation of Covid-19-led restrictions. Net profit grew 26.8% to Rs 348.6 million for fiscal 2021. (CD)

Around the World
IPC: Material and Labor Costs Remain Large Issues for Electronics Supply Chain
BANNOCKBURN, IL – Material and labor costs continue to be two of the largest issues facing the electronics supply chain, according to an IPC report. Nine in ten electronics manufacturers report rising material costs, and nearly three-fourths report rising labor costs, the association says.

Ease of recruiting workers remains difficult, with 57% reporting it has gotten worse in the last month. Seventy-two percent of North American firms report ease of recruiting workers is declining, while 37% of firms in APAC and 43% of those operating globally report the same.

Conversely, 35% of firms operating globally report ease of recruiting workers is improving, whereas 6% of firms in North America and Europe report the same. Among firms in APAC, ease of recruitment is holding steady at 51%.

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Around the World
Latécoère to Acquire EMS Firm Malaga
TOULOUSE, FRANCE – Latécoère has entered into a definitive agreement to acquire electronics manufacturer Malaga Aerospace, Defense & Electronics Systems for an undisclosed sum. Malaga provides PCBs for high-reliability applications across defense (~80% of sales), commercial aviation and industrial end markets (~20% of sales). The firm employs 100 staff in Spain.

Latécoère provides electrical wiring interconnection systems.

Thierry Mootz, CEO, Latécoère, said in a press release: “MADES is a market-leading company with effective management and first quartile operational and customer performance. Following the acquisitions of SDM in Mexico and TAC in Belgium, this is the third acquisition since the capital increase completed in August. MADES is developing our position in the US defense market segment and will create significant synergies within Latécoère’s interconnection systems division, as well as reinforcing our number one position for avionic racks.

Closing is subject to a number of commercial and regulatory conditions, including approval by the Spanish Council of Ministers. (CD)

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Around the World
Lacroix Gains Majority of Firstronic
GRAND RAPIDS, MI – Lacroix has signed an exclusive agreement for the acquisition of a majority stake in EMS firm Firstronic. The group’s equity stake, first acquired in 2017, will increase to 62% from 12.5%.

Concurrently, private equity firm Bpifrance will take a 26% stake. John Sammut will remain CEO of Firstronic and will retain 4% of share capital, while COO Jochen Lipp will take an equity stake in Firstronic of 3%.

“We have had a stake in Firstronic for almost four years, during which time we have been able to observe the commitment and know-how of Firstronic’s teams and the strong potential synergies between our respective entities,” said Vincent Bedouin, CEO, Lacroix. “Together with keeping in place a highly experienced management team, which has been able to grow the business at a rapid pace, these elements convinced us that a combination would be mutually beneficial and incorporating Firstronic largely facilitated.”

Firstronic serves tier-one customers primarily in the automotive, industry and healthcare sectors in North America. The company has production sites in Michigan and Mexico and 1,300 staff.

In 2020, Firstronic posted revenue of $87 million, almost 20% of Lacroix’s revenue. Strong growth is expected across both indicators for the 2021 financial year, with a trajectory of $140 million in revenue and EBITDA above 9%. The deal should immediately prove accretive within the upcoming financial year. (CD)

Around the World
Delta Electronics to Acquire Universal Instruments for $89M
TAIPEI – A subsidiary of Delta Electronics will acquire Universal Instruments for $88.9 million, Delta announced on Dec. 18. The transaction is subject to certain closing conditions, and is expected to generate substantial synergies through the companies’ respective R&D operations and global customer base.

Universal Instruments is a North America-based OEM of electronics placement equipment. Delta Electronics, founded in 1971, is an OEM of switching power supplies and thermal management products. Following the aforementioned transaction, Universal Instruments will continue operating under its original management team.

“By adding Universal’s precision automation machine offering and leading technologies to our highly diversified industrial automation portfolio, we can offer customers total solutions capable of enhancing the productivity and carbon footprint of their production lines,” said Ping Cheng, chief executive, Delta Electronics.

Conklin, NY-based Universal Instruments has more than 500 patents and close to 30,000 systems delivered. The deal includes Universal Instruments’ Advanced Process Lab (APL), which assists customers in each phase of the products’ lifecycle (prototyping, process development, analytics, and advanced assembly). (MB)

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Market Watch
Hot Takes
  • Semiconductor sales are finishing 2021 up more than 20% at $550 billion after growing 10.8% to $464 billion in 2020. (SEMI)
  • The electronic component sales sentiment index for November was down 8.3 points sequentially to 111, and is expected to fall below 100 in December for the first time in 18 months. An index below 100 suggests a contracting market. (ECIA)
  • More Wi-Fi 6 devices will ship in 2022 than 5G devices, to the tune of at least 2.5 billion Wi-Fi 6 devices versus roughly 1.5 billion 5G devices. (Deloitte)
  • Global AR/VR device shipments in 2022 will reach 12.02 million units, up 26% year-over-year, with Oculus and Microsoft the leaders in the consumer and commercial markets, respectively. (TrendForce)
Strained Communication
Working unconventional hours in remote locations disrupts business more than material shortages.
As we enter the third year of our pandemic-altered world, more chains are strained than just supplies. With people working remotely during odd hours, changing careers, or stepping out of the workforce altogether to care for loved ones, the basic chain becoming strained is communication.

Communication has been transitioning over the past couple decades. Time, culture and technology have dramatically transformed. Long gone are the storied two-martini business lunches where colleagues, customers and suppliers met, broke bread and discussed one-on-one issues that needed ironing out. Over the past decades, face time (not FaceTime) with any business client has become extremely difficult to arrange. Today with Covid, meeting face to face is all but impossible for many. Long-changing trends compounded by recent events have had a negative impact on the ability to communicate effectively, which in turn has strained the quality of relationships in too many cases.

What’s Old is New
Supply Chain Pressures in 2022
How prepared is your organization?
Here we are in January 2022 with a future fraught with more uncertainties than any other during my six decades in the PCB, IC fabrication and assembly industries.

Business is strong despite shortages in labor and parts. Prices are rising, dramatically in some cases. Profits are being squeezed. Rapid government changes in travel restrictions and worker conditions seem endless due to the continuing evolution of the pandemic.

Supply chains are under pressure from a variety of events and circumstances. These include some brief power shutdowns at plants that produce wafers and PCBs in China, chip and other component shortages, shipping issues with a backlog of over 100 cargo ships carrying, for example, container loads of copper-clad laminates anchored off the Southern California coast waiting to be unloaded. The battery industry is gobbling up copper supplies. Major consumers are buying into chipmakers who can guarantee their needs. This affects those who cannot, causing them to scramble for new sources.

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Designer’s notebook
Preparing a PCBA for Harsh Environments
Shake, rattle and roll: Your devices often experience it all.
The stark choices of organisms are to adapt, move or die. Our electronics sometimes tough it out so we can do our jobs or simply have a good romp on our favorite ride. No matter the purpose, extreme weather puts an electrical system to the test.

Whether the element is sand, saltwater, sunshine or perhaps a lack of thereof, many dangers age a system prematurely. Most faults caused by the environment are single-component failures. Okay, a part failed. Why? What is the root cause, and what can we do to prevent it from becoming part of a larger trend? Answering that two-part question is the gist of reliability engineering.

What broke is not always evident. Cosmetic damage or a burn scar may point the way if you’re lucky. In most cases, diagnosis is not that easy. Check connectors first, while the board-level investigation usually centers around the FETs that bring power to the device that is out of spec or failing altogether. Somewhere in there a tiny junction has burned up. The repair and return unit or perhaps field service technicians are a good source of reliability anecdotes.

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The Billion-Dollar Mistake
Stop designing products guaranteed to fail EMC testing.
by Daniel Beeker

Au: This article emphasizes the need to concentrate on design of transmission lines, or the “spaces,” instead of the “wires.” The industry focus has been on the movement of charges in the wires, which only occurs because the electric fields are moving. The energy is carried by the fields, not the displacement current. My apologies to the EM physicists for oversimplifying these concepts, but this approach will increase the chances of success for most designs.

Engineering teams worldwide are facing increasingly difficult challenges to design electronic products and achieve good signal integrity and compliance. However, the status quo is to expect the design to fail EMC testing not once, but three, four, or as many as five times. Each time the design is sent to be retested, there is little confidence in success. This cycle is expensive in both the time it takes to redesign the product and the cost of expediting fabricating the new PCB and assembly. Add this to the cost of retesting the product, and the numbers add up very quickly. This expense and delay in product certification are not in the budget or the schedule. The cost not only directly affects the bottom line of the electronic supply company, but also affects the customers waiting for the product. Instead of designing the next big thing, teams are trying to fix the current one. As a result, billions of dollars are lost each year designing products that are expected to fail.

What is wrong here? The billion-dollar mistake.

The billion-dollar mistake is rooted in the misunderstanding of the nature of electronic energy. One drawing is to blame.

State-of-the-Art Technology Flashes
Updates in silicon and electronics technology.
Ed.: This is a special feature courtesy of Binghamton University.
Next-gen chips will be powered from below. As transistors continue to be made thinner, the interconnects that supply them with current must be packed closer, which increases resistance and power. In processors, both signals and power reach the silicon from above. Arm researchers have developed a technology that separates those functions, saving power and making more room for signal routes. The signals travel along the copper traces of a PCB into a package that holds the SoC, through the solder balls that connect the chip to the package, and then via on-chip interconnects to the transistors. These interconnects are formed in layers called a stack. It can take a 10- to 20-layer stack to deliver power and data to the billions of transistors on today’s chips. (IEEC file #12450, IEEE Spectrum, 9/2/21)
High-Speed Design
What PDN Target Impedance Means for PCB Designers
A noisy PDN can easily become a strong parasitic EMI antenna. by Ralf BrÜning
High-speed circuits are used almost everywhere in electronic applications today.

As a result, the importance and mechanisms of impedance (herein the meaning of PCB trace impedance – typically referred to as “characteristic impedance”) for signal integrity have been widely discussed and seem to be generally understood by PCB designers.

Simply put, PCB trace impedance is a measure of the resistance that a circuit opposes to a current once a voltage is applied. So far so good. But the concept of impedance is also used in PCB design to describe the behavior of power distribution systems/power distribution networks (PDS/PDN). And this PDN impedance is becoming more of a headache for PCB designers as IC vendors define increasingly tight so-called “target impedance limits” that a design must meet (a few milliohms over a broad frequency range).

Are you sure what the term PDN impedance means for you and what to pay attention to when designing a PDN? Let’s look at what PDN impedance and target impedance are and take a stab at explaining their importance for the design of modern high-speed digital boards.

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good tools.
You also have to know how to use them.
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Trades from: Rick Hartley, Susy Webb, Lee Ritchey, Dan Beeker, Eric Bogatin, Mike Creeden, Gary Ferrari, and more! text
Online courses and webinars for the printed circuit engineering community.
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Screen Printing
Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change?
A series of experiments test the well-known area ratio rule.
by Chrys Shea, Greg Smith and Ray Welch
A stencil aperture’s area ratio (AR) is a simple calculation that divides the area of the aperture opening by the area of its wall. It was derived in the 1990s and compares the adhesive forces of the solder paste deposit on the PCB pad with the adhesive forces of the solder paste on the stencil walls. For the material to transfer efficiently, the forces holding it to the pad must overcome the forces holding it to the aperture walls. Therefore, calculating the relative areas represents the relative adhesive forces affecting solder paste release.

The amount of solder paste released from an aperture is referred to as transfer efficiency (TE) and expressed as a percent of total aperture volume. Stencil or solder paste release characteristics are often illustrated by plotting TE against AR.

AR guidelines were originally set at 0.66 as a minimum to ensure good (>80%) TE. Many of these original guidelines have been relaxed due to improvements in solder paste, stencil materials and nanocoatings. With good materials, equipment and tooling, and robust printing practices, apertures with ARs as low as 0.50 can often be printed in production on 4-mil thick stencil foils with excellent results.

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Seeing is Believing
A Guide to Make One Perplexed
Or how the metaverse will save us, one contorted axiom at a time.

Ambrose Bierce, of sainted memory, is known for a Devil’s Dictionary, a cynic’s primer on human behavior, laid out in Noah Webster style.

Pity he strayed into hostile territory in bandit-infested Northern Mexico in 1913, never to be seen again. Maybe someone lurking in the sagebrush took offense at imagined slights in the Dictionary. People are so thin-skinned.

Pity also that he lived one hundred years too soon. Bierce missed his moment. Obfuscation has exploded, rivaling worthless college degrees (or maybe because of them). A euphemistic pandemic with no known vaccine, for which we need a new dictionary, has infiltrated our lexicon. Straight talk in professional settings is frowned upon, covertly if not overtly. Blunt talk is often memorable and career-threatening. Verbal mush is benign and soon forgotten. As the author of the Bartleby column in the Nov. 20, 2021, edition of The Economist noted, concerning contemporary biz-speak, “People rarely say what they mean, but hope that their meaning is nonetheless clear. Think Britain, but with paycheques. To navigate this kind of workplace, you need a phrasebook.”

Getting Lean
Connecting the Dots: Lean and Field Service
A process for addressing RMA for multi-factory production.
In a normal business environment, the electronics manufacturing services (EMS) industry has more variation than that of a Lean original equipment manufacturer (OEM). This doesn’t mean EMS providers are disorganized. It simply highlights the challenges of an environment where customer inputs dictate supply-chain choices, processes and validation methodologies that would normally be optimized to minimize variation at a Lean OEM. Pandemic restrictions, supply-chain shortages, logistics constraints and demand spikes of 2021 have caused further variation at EMS providers and customers. However, those challenges serve as incentive to increase Lean discipline.

Past columns have highlighted Lean Six Sigma core tools such Gemba and the DMAIC process that help identify and correct quality issues that develop in manufacturing operations as project assumptions change. Lean Six Sigma is helping create an empowered, educated workforce at SigmaTron, capable of rapidly addressing unanticipated challenges found in today’s production environments. That said, defects can escape the factory or be induced by activities once product leaves the factory. Focusing on this area can have a long-term impact on eliminating another set of defect opportunities: muda (waste) and cost.

Why does Datest compete
Service Excellence Award?
Datest offers testing, engineering, analytical, and other value-added services, all geared to speed, flexibility, and results.

We need a mechanism for obtaining meaningful feedback from customers on a regular basis. We also share that feedback with our AS9100 auditor.

The CIRCUITS ASSEMBLY Service Excellence Awards are ideal for capturing those honest reactions that make us a better company.”

Robert Boguski
President, Datest
Robert Boguski
Register today!

Deadline is April 5, 2022.

For more information, visit:

Circuits Assembly's Service Excellence Awards
Circuits Assembly's Service Excellence Awards
Defect of the Month
Avoid Green Solderable Finishes
A look at solder mask contamination on pads.
This month we look at solder mask contamination on pads. FIGURE 1 is a very, very bad example that never should have made it to the customer. Solder mask residues are visible on the surface and around the edge of the pad. There is also a level of solder mask undercutting.
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Off The Shelf
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Others of Note
Hirose TF43SW Flex Connector
TF43SW series hybrid flexible printed circuit/flat flexible connector has power contacts capable of handling 12A and 0.5A signal contacts. Is 1.2mm high with 4mm mounting depth. For use with FPC/FFC standard thickness of 0.3mm (+/-0.03mm). Has 66 contacts with 0.5mm pitch and length of 47.88mm. Retention tabs prevent unintended actuator separation.
KiCad 5.1.12 EDA Software
KiCad 5.1.12 contains bug fixes and other minor improvements. Fixed bugs since 5.1.10 can be found on KiCad 5.1.11 milestone page. Is made from 5.1 branch with cherry-picked changes from development branch. Packages for Windows, macOS, and Linux available or will be soon.
Technic TechniPad IS 7070
TechniPad IS 7070 nitrate-free immersion silver, for 5G applications, replaces silver nitrate with silver complex. Process provides controlled deposition of thin, pore-free silver without aggressive copper attack. Is half thickness of nitrate-based immersion silver.
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Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
Europlacer Intelligent Freeform Feeder
Europlacer Intelligent Freeform Feeder
Intelligent freeform feeder is alternative to taping loose components. Eliminates one process step and reduces possibility of human error. Comprises pair of trays, each featuring nine separate cells to hold different components. These are dropped into 25mm x 18mm cells without need for orientation or alignment.
Vision Engineering VE Cam Digital Microscope
Vision Engineering VE Cam Digital Microscope
VE Cam compact digital microscope comes in two variants with differing fields of view: VE Cam 50 (50mm FOV) and VE Cam 80 (80mm FOV). Includes features available on EVO Cam ll. Is standalone and doesn’t require PC, keyboard or mouse. With Wi-Fi screen sharing, results can be shared wirelessly to smart devices and displays with screen mirroring. Features 10 user-programmable presets and six hotkeys for one-touch access to most commonly used presets and configurable interface, which allows most commonly used settings to be shown on the screen. Is for PCB examination, PCB debug activities, discovering imperfections, and to trace problems in industrial applications.
Vision Engineering
Fujipoly Sarcon SPG-70A TIM
Fujipoly Sarcon SPG-70A TIM
Sarcon SPG-70A thermal interface material is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0W/m°K and has lowest thermal resistance among Fujipoly’s dispensable SPG products. When applied between heat-generating components and nearby heat sink or spreader, it fills gaps as small as 0.2mm. Has excellent vibration absorption capabilities and requires no heat curing. Comes in 30cc syringes or 325cc cartridges.
Fujipoly America
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Technical Abstracts
In Case You Missed It
Artificial Intelligence
“APOLLO: An Automated Power Modeling Framework for Runtime Power Introspection in High-Volume Commercial Microprocessors”

Authors: Zhiyao Xie, et al.

Abstract: Computer engineers at Duke University have developed a new AI method for accurately predicting the power consumption of any type of computer processor more than a trillion times per second, while barely using any computational power itself. Dubbed APOLLO, the technique has been validated on real-world, high-performance microprocessors and could help improve the efficiency and inform the development of new microprocessors. (MICRO-54: 54th Annual IEEE/ACM International Symposium on Microarchitecture, 2021,

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Thanks for reading our January 2022 issue!