Printed Circuit Design & Fab Circuits Assembly July 2022 cover
July 2022
white arrow with black shadow
Fuji Advertisement
Accutrace Advertisement
July 2022 • VOL. 39 • NO. 7
Printed Circuit Design and Fab Circuits Assembly logo
First Person
6
Staff retention.
Mike Buetow
money matters
18
Enabling (disruptive) tech.
Peter Bigelow
19
Perfect packaging.
Greg Papandrew
Tech Talk
22
More chips per panel.
E. Jan Vardaman
28
Specifying impedance.
John Burkhert, Jr.
46
Industry 4.0 AOI.
Filemon Sagrero
47
Swindlers’ lists.
Robert Boguski
Departments
July 2022 • VOL. 39 • NO. 7
Printed Circuit Design and Fab Circuits Assembly logo
Features
31
TRACE HEATING
Companies should perform their own testing or develop their own thermal models to determine conductor current carrying capacity in any given technology. An explanation of IPC-2152 and the information it provides to get started.
by MIKE JOUPPI
Printed Circuit Design & Fab Circuits Assembly July 2022 cover
37
STANDARDS
After many years of debate, a specification for organic solderability preservatives is finally here. IPC-4555 sets the record straight: OSPs are not all the same, and they have regained their leadership role as a final finish.
by MICHAEL CARANO
41
ACQUISITIONS
In May, Summit Interconnect announced its acquisition of Royal Circuit Solutions, expanding the fabricator’s capacity of rigid and flex PCBs. But it was the behind-the-scenes technologies and assembly capacity that convinced Summit president and CEO Shane Whiteside to make the deal.
by MIKE BUETOW
ON PCB CHAT (pcbchat.com)
RIT PCB DESIGN COURSE RECAP
with DR. KIRSCH MACKEY and DR. JAMES LEE
BEST PRACTICES FOR PURCHASING X-RAY EQUIPMENT
with KEITH BRYANT, DR. DAVID BERNARD, DAVID KRUIDHOF and ROBERT BOGUSKI
PEOPLE MANAGEMENT SKILLS
with JOHN BURKHERT JR.
Rush PCB Advertisement
PCEA logo
PCEA
PO Box 807
AMESBURY, MA 01913
PCEA BOARD OF DIRECTORS
Stephen Chavez, chairman
Michael Creeden, vice chairman
Justin Fleming, secretary
Gary Ferrari, chairman emeritus

MEMBERS
Michael Buetow
Tomas Chester
Douglas Dixon
Tara Dunn
Richard Hartley
Scott McCurdy
Anaya Vardya
Susy Webb
Eriko Yamato

THE PRINTED CIRCUIT ENGINEERING ASSOCIATION, INC. BRANDS:

PUBLICATION

WEBSITES

NEWSLETTER

PODCASTS

EVENTS

EDUCATION

AWARDS PROGRAMS

DATABASE

The Printed Circuit Engineering Association, Inc. Brands
Staff
PRESIDENT
Mike Buetow 617-327-4702 | mike@pcea.net
VICE PRESIDENT, SALES & MARKETING
Frances Stewart 678-817-1286 | frances@pcea.net
SENIOR SALES EXECUTIVE
Brooke Anglin 404-316-9018 | brooke@pcea.net
CHIEF CONTENT OFFICER
Chelsey Drysdale 949-295-3109 | chelsey@pcea.net

PCD&F/CIRCUITS ASSEMBLY EDITORIAL
CHIEF CONTENT OFFICER
Chelsey Drysdale 949-295-3109 | chelsey@pcea.net

COLUMNISTS AND ADVISORS
Clive Ashmore, Peter Bigelow, Robert Boguski, John D. Borneman, John Burkhert, Jr., Joseph Fama, Mark Finstad, Bill Hargin, Nick Koop, Alun Morgan, Susan Mucha, Greg Papandrew, Akber Roy, Chrys Shea, Jan Vardaman, Ranko Vujosevic, Gene Weiner

PRODUCTION
ART DIRECTOR & PRODUCTION
blueprint4MARKETING, Inc. | production@pcea.net

SALES
VICE PRESIDENT, SALES & MARKETING
Frances Stewart 678-817-1286 | frances@pcea.net
SENIOR SALES EXECUTIVE
Brooke Anglin 404-316-9018 | brooke@pcea.net

REPRINTS
brooke@pcea.net

EVENTS/TRADE SHOWS
EXHIBIT SALES
Frances Stewart 678-817-1286 | frances@pcea.net
TECHNICAL CONFERENCE
Mike Buetow 617-327-4702 | mike@pcea.net

SUBSCRIPTIONS
Printed Circuit Design & Fab/Circuits Assembly is distributed without charge to qualified subscribers. To subscribe, visit pcdandf.com or circuitsassembly.com and click on Subscribe. For changes or cancellations to existing subscriptions: subscriptions@pcea.net

Printed Circuit Design & Fab/Circuits Assembly is published monthly by Printed Circuit Engineering Association, Inc., PO Box 807 Amesbury, MA 01913. ISSN 1939-5442. GST 124513185/ Agreement #1419617.

© 2022, by Printed Circuit Engineering Association, Inc. All rights reserved. Reproduction of material appearing in Printed Circuit Design & Fab/Circuits Assembly is forbidden without written permission.

The Route
A headshot photo of Mike Buetow smiling (Editor-in-Chief at UP Media Group)
mike
buetow
President
Training Begets Retaining
F

oxconn was in the news (again) last month, this time for alleging competitors are poaching its employees.

The complaints were levied specifically at rivals in Vietnam, where the world’s largest ODM/EMS is expanding its factories as major customers like Apple shift production away from China, in part to avoid being a pawn in the geopolitical tug-of-war between the US and China.

Foxconn, which currently employs about 60,000 workers in Vietnam, asserts its EMS competitors are establishing their own operations near Foxconn’s to make it easier to entice workers to jump ship.

Indium Advertisement
Fischer Advertisement

Around the World

PCDF People
Michael V. Carano headshot
Averatek appointed Michael V. Carano vice president of quality. Carano brings 40 years of electronics industry experience to Averatek, with expertise in manufacturing, chemicals, metals, semiconductors, medical devices and printing.
Fresh Consulting named Rob Blomstrom PCB design engineer.

SEMI named Joe Stockunas Americas president. Before joining SEMI, he served as executive vice president and corporate officer of Nordson, overseeing the company’s worldwide electronics systems business.

Around the World
Technical Conference Program Set for PCB West 2022
PEACHTREE CITY, GA – The PCEA Conferences Task Group announced the technical program for PCB West 2022, featuring nearly 50 presentations and more than 110 hours of in-depth electronics engineering training.

Among the industry experts on tap for this year’s show are Rick Hartley, Susy Webb, Thomas Chester and Dan Beeker. The conference will be held October 4 to 7 at the Santa Clara Convention Center and features classes for every level of experience, from novice to expert.

The scope of classes ranges from basics on design engineering and DfM, to designing and building advanced HDI and routing high I/O count chip packages, board stackup, circuit grounding, low layer-count (IoT) board design, high-frequency design, thermal management, and a complete virtual plant tour of a flexible circuit manufacturing facility. New courses this year include RF and microwave design, PCB layout of DDR memory, mechanical design, and raw material selection.

Around the World
PCB West Keynoter Dr. Brian Toleno to Focus on Where Electronics Meets Virtual Reality

PEACHTREE CITY, GA – The metaverses offer myriad opportunities not just for users but for developers of computing devices. As that market takes off, what novel innovations in materials and production will be needed for printed circuit designs to meet the requirements for weight, size, and functionality?

Those are the questions Dr. Brian Toleno, manager, Applied Materials at Meta’s Reality Labs, will tackle when he keynotes this year’s PCB West conference. His talk, Augmented and Virtual Reality, the Next Computer Revolution, will describe the current market, use cases, and the technology all around AR/VR, with a focus on the printed circuit board aspects.

At Meta, Dr. Toleno leads a multi-disciplinary team that works on the material challenges in Meta’s consumer electronics hardware. These devices include VR headsets (Quest 2), smart glasses (Ray-Ban Stories), Portal smart screens and other exciting devices that help bring people together.

Tatsuta Advertisement
Around the World
CA People
Benjamin Freeman Headshot
Arch Systems appointed Benjamin Freeman vice president of engineering. Freeman specializes in analytics and technology-assisted optimization of physical processes.
Restronics Mid Atlantic named Matthew Osborne managing partner.

Sanmina promoted Rodrigo Sierra Avila to acting plant manager, Guadalajara.

Yamaha Motor Europe SMT Section appointed Kamil Stasiak product marketing manager.

Andy Wittbrodt Headshot
Yamaha named Andy Wittbrodt key account manager. He joins Yamaha with 27 years of technical sales and service operations experience in electronics.
John Neiderman Headshot
Zestron Americas appointed John Neiderman US and Canada sales manager. Neiderman has over 20 years of sales and technical experience in electronics manufacturing.
Around the World
PCD&F’s Annual Designers’ Salary Survey Open

PEACHTREE CITY, GAPRINTED CIRCUIT DESIGN & FAB is undertaking its annual salary survey of printed circuit board designers, design engineers and other layout specialists.

Results will be published in an upcoming issue of PCD&F. The data collected are revealed only in the aggregate, and no individual data will be revealed.

Designers for years have taken advantage of the results to benchmark their salaries, benefits and credentials against peers. The survey link is here: https://www.surveymonkey.com/r/N989JS3.

Because this is a survey, not a poll, the audience being surveyed is not selected or controlled.

Around the World
Vector Fabrication to Invest $60M in Vietnam PCB Plant
DA NANG, VIETNAM – Vector Fabrication has received an investment license for a PCB and MEMS factory, with plans to invest $60 million, according to reports.

The factory is expected to be 40,000 sq. m., and the first phase is expected to begin in the first quarter of 2025. The plant plans to begin manufacturing MEMS as of the first quarter of 2027.

The fabricator will build two-, four-layer and multilayer PCBs, probe cards and IC burn-in boards.

Vector reportedly develops substrates for Intel.

Around the World
Ampel Acquires US Circuit, RMC
ELK GROVE VILLAGE, IL – Ampel has acquired fellow fabricators Rocky Mountain Circuits and US Circuit for an undisclosed sum.

Production at Boulder, CO-based Rocky Mountain Circuits is shutting down, and existing orders will be moved to Ampel and US Circuit.

RMC will maintain a sales and engineering support office, however.

Ampel was founded in 1983 and also owns Lazer-Tech, Image Circuits, Tritech PCB, PC Specialties, Crimp Circuits and Texas Circuitry.

Around the World
Nitto Acquires Bend Labs

FARMINGTON, UT – Nitto Denko acquired Bend Labs for an undisclosed sum.

The sensor device technology company merged into Nitto, starting business as Nitto Bend Technologies.

Bend’s flexible sensor measures bend, stretch and force. The flexible sensor is expected to meet automation demands in the automotive field and remote monitoring in the digital healthcare field. Nitto anticipates this technology to be used in sports and robotics as well.

The impact of this acquisition on Nitto’s consolidated earnings forecast for 2022 is insignificant.

Nitto develops new products and services in three domains: information interface, next-generation mobility and human life.

Downstream Advertisement
Around the World
PCB Technologies Launches SiP Subsidiary iNPACK
OCEAN TOWNSHIP, NJ – PCB Technologies is launching a subsidiary to provide system-in-package solutions. Beginning this month, iNPACK will focus on high-end technology that contributes to improved signal integrity and reduces unwanted inductance effects.

iNPACK will provide SiP, semiconductor packaging, organic substrates (25µm lines and 25µm spacing), and 3-D, 2.5-D and 2-D packaging solutions for aerospace, defense, medical, consumer electronics, automotive, energy and communications industries.

“The new company incorporates innovative interconnects as part of its substrates and micro-assembly process capabilities,” said Jeff De Serrano, PCB Technologies’ president for North America. “Our technological solutions can more than double the electronic functionality in the same form factor and create substrate-like PCBs. To top it off, our lead times are only six months long. The goal is to support our customers from design concept to production, all under the same roof, while utilizing unified design rules.”

Around the World
GPV, Enics to Merge, Creating Europe’s 2d Largest EMS
VEJLE, DENMARK – Europe’s EMS industry was shaken up in June as GPV and Enics announced a pending merger to form the continent’s second-largest EMS company with more than 7,500 employees and annual revenue of more than DKK 7 billion ($990 million).

The transaction values the combined business at more than DKK 4 billion ($566 million). Closing is subject to customary approvals, including from antitrust officials.

Danish industrial conglomerate Schouw & Co., listed on Nasdaq Copenhagen, will hold 80% of the merged entity, while the current owner of Enics, Ahlström Capital will hold 20%. Additionally, as a result of the transaction, Ahlström Capital will receive approximately EUR 60 million ($63.1 million) in cash. The merger will create an international electronics group with more than 7,500 employees.

Around the World
Align Capital Partners Acquires StenTech
MARKHAM, CANADA – Align Capital Partners has acquired StenTech for an undisclosed sum.

StenTech provides surface mount technology stencils, pallets, tooling and related components.

The company boasts more than 2,000 customers across North America.

Around the World
Proposed IPC Standard for Green Cleaners Open for Public Review
BANNOCKBURN, IL – A draft version of IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing, is now open for public review. The draft standard has been progressing through the standards process since fall of 2021 and, despite some minor delays in the draft development timelines – as is common during consensus-based standards development processes – the draft is now ready for public review through Jul. 15.

The draft IPC-1402 standard has been developed by volunteers and key governmental agencies from Asia, Europe and North America. This first-of-its-kind standard for the electronics manufacturing industry defines and sets minimum criteria for green cleaners – chemical cleaners meeting a defensible set of green chemistry requirements – used in electronics manufacturing processes. Also, this standard provides a core set of foundational environmental, health and safety requirements that aim to reduce impacts and improve the safety of cleaning products.

Around the World
PG Technoplast to Invest $41M in Maharashtra, India
UTTAR PRADESH, INDIA – PG Technoplast signed a memorandum of understanding with the government of Maharashtra to invest Rs 3.15 billion (US$41 million) in the state, according to reports.

The electronics manufacturing services provider has eight production sites in India. The company will work with Maharashtra Industrial Development Corp. to create the region’s largest room AC manufacturing capacity.

“We are grateful to the government of Maharashtra for facilitating PG’s push to provide its customers turnkey solutions for all home appliances,” said Vikas Gupta, MD-Operations, PG Group. “The move will help bring room AC manufacturing to the Western region of the country, which historically has been concentrated in the Northern, and now Southern, parts of the country.”

In the fiscal third quarter, the firm’s net profit declined 2.6% to Rs 63.3 million, and sales increased 45% to Rs 2.7 billion compared to the same period last year.

Around the World
GPV to Construct Mechanics Factory in Thailand
PHRAEKSA, THAILAND – GPV Mechanics is constructing a 12,000m2 mechanics manufacturing factory in Thailand. The facility will be built with room to grow, say reports.

“We are very much looking forward to serving our customers from the new factory in 2023. The main piling ceremony is an important first step in going forward with the construction work. Safety of our employees is key, and so is the safety of all involved in the construction of our new production facility. Our ambition is to execute the building construction with zero LTIs,” said Bjørn Fiskers, managing director.

GPV currently has 7,100m2 mechanics production and 15,000m2 electronics production in Bangkok.

The company is also building a new 11,300m2 electronics manufacturing facility in Sri Lanka.

APCT Advertisement
Market Watch
EDITED by CHELSEY DRYSDALE
Hot Takes
  • Global semiconductor equipment billings grew 5% year-over-year to $24.7 billion in the first quarter. Sequential billings in the seasonally soft first quarter declined 10%. (SEMI)
  • Total semiconductor sales in 2022 are forecast to increase 11%, the same growth rate that was forecast in January. (IC Insights)
  • Tech manufacturing plants are operating at 87% capacity, and that’s expected to increase 5.8% throughout 2022. Capital expenditures are forecast to grow 7.2% during the same period. (Institute for Supply Management)
Resinlab Advertisement
ROI
Innovative Technology: Enabling or Disruptive?
Fabricators and designers must communicate about new technology to verify its viability.
More often than not over the past couple of decades, new technologies, processes and options we fabricators have been asked, begged or threatened to add to our repertoire of offerings were ones that could be best considered disruptive. What’s disruptive to a manufacturer may seem benign to the casual eye, as often the technology – or process – that is most disruptive is a simple one.

Indeed, sometimes that technology is nothing more than the rebirth of an older, tried-and-true, albeit significantly tweaked, process. REACH, and the prior RoHS, caused much disruption, and yet most of the plating chemistries and surface finishes in use today are essentially highly refined formulas of older plating technologies such as ENIG, silver and tin.

BOARD BUYING
All Wet: PCB Packaging, Shipping and Storage
Limiting PCB moisture absorption is the full responsibility of the supplier. How to pack boards right.
PCB suppliers who use good packaging methods are keeping their products safe from physical damage incurred during transit from the manufacturing facility to customers’ warehouses. Equally important, these packaging practices help ensure shelf-life expectancy by preventing moisture absorption.

To protect their orders, PCB buyers should require suppliers strictly follow corporate shipping specifications. Nothing is more frustrating than waiting for quality product to be built, only to have it damaged because of poor packaging practices. It’s just as frustrating when boards become useless while sitting on the shelf.

PCBs can be very heavy. Their sharp corners sometimes wreak havoc on the corrugated cardboard boxes in which they are shipped. A good freight spec should state boards are to be vacuum-packed with a bubble wrap base, with no more than 25 boards to a stack. When a board is oversized or heavier than normal, 10 to 15 pieces is the best option. Whatever number is used, the packaging should be consistent in count for a particular shipment.

ON THE FOREFRONT
ECTC Highlights Next-Generation Packaging Challenges
Large crowds mulled the latest substrate trends and new developments in 3-D IC hybrid bonding.
The IEEE Electronics Components and Technology Conference (ECTC) returned to an in-person conference at the end of May with more than 1,500 attendees, domestic and international. Attendance in San Diego matched pre-pandemic numbers. While some presentations remained virtual, using video recording, many were onsite. A variety of electronics packaging topics were discussed. Judging by the crowded rooms, this year’s hot topic was 3-D IC hybrid bonding.

Advanced packaging. A pre-conference Heterogeneous Integration Roadmap workshop discussed trends in networking for the future and new developments in advanced packaging for high-performance computing and data centers. The workshop concluded with a panel of presenters discussing the latest trends in medical health and wearables.

PCB West 2022 logo
Register by the early bird deadline of
SEPTEMBER 6, 2022
to save up to $200 on the 4-day all-inclusive conference pass!
Arrows
CONFERENCE:
October 4 – 7
EXHIBITION:
Wednesday,October 5
SANTA CLARA CONVENTION CENTER, CA
PCbwest.com
PCB West 2022 logo
SANTA CLARA CONVENTION CENTER, CA
CONFERENCE: October 4 – 7
EXHIBITION: Wednesday, October 5
Who’s Exhibiting
Accurate Circuit Engineering

AGC Multi Material America, Inc

All Flex Flexible Circuits & Heaters

AllSpice.io

American Standard Circuits, Inc.

APCT

Archer Circuits

Arlon EMD

Bay Area Circuits, Inc.

Binary Process Solutions

Bittele Electronics Inc.

Cadence Design Systems

Cicor Group

DownStream Technologies, Inc.

DuraTech Industries

Dynamic Electronics Co. Ltd.

EM Solutions Inc.

EMA Design Automation

Emerald EMS

Fischer Technology, Inc.

Flexible Circuit Technologies

Fujipoly America

GS Swiss PCB AG

HZO, Inc.

ICAPE Group

Imagineering, Inc.

Insulectro

IPC-2581 Consortium

Ironwood Electronics

ISOLA

JetPCB USA

Leader Tech, Inc.

MFS Technology (S) Pte Ltd.

MicroConnex, A Carlisle Company

Micro Systems Technologies Management GmbH

MVINIX Corporation

Nano Dimension

Notion Systems GmbH

Oak-Mitsui Technologies LLC

Ohmega Technologies/Ticer Technologies

OKI Circuit Technology Co., Ltd.

Optiprint AG

Panasonic Electronic Materials

PCB Technologies – USA

PFC Flexible Circuits Limited

Polar Instruments, Inc.

Polyonics

Printed Circuits LLC

Rogers Corporation

San Diego PCB Design

San-ei Kagaku Co., Ltd.

Screaming Circuits

SEP Co., Ltd.

Shenzhen Kinwong Electronic Co., Ltd.

Siemens

Sierra Circuits

Summit Interconnect

Sunshine Global Circuits

Sunstone Circuits

SVTronics, Inc.

Taiyo America Inc.

Tempo Automation

Trilogy-Net Inc.

Ultra Librarian

Vayo (Shanghai) Technology Co., Ltd

Ventec International Group

Victory Giant Technology

Xiamen Bolion Tech Co., Ltd.

Zuken USA Inc.

PCbwest.com
designer’s notebook
How to Specify Impedance on a PCB
Determining your optimum geometry, plus two methods for providing data to the fabricator.
Controlling impedance (resistance) is almost a given with today’s technology. One day we are adding a wireless option to a common object and calling it the Internet of Things. The next day we’re simply keeping up with the competition on processing the code. The trend is toward a greater percentage of the connections falling under the domain of impedance control.

Controlled impedance has two main branches: Single-ended transmission lines are the backbone of RF technology, while differential pairs do the heavy lifting for digital circuits. We’ll start with the single-ended lines. They have a start and an end point. The signal is sent one way on the transmission line, and the circuit is completed over the adjacent ground plane.

The main factor influencing impedance is the width of the trace relative to the thickness of the dielectric material between the trace and the ground plane – or planes – used as a reference. What is a reference? It is usually a metal plane with zero volts – “ground” but can have a few volts of its own, either positive or negative relative to what’s happening on the trace itself.

Precision Technologies Advertisement
trace heating
Making Technology-Specific
Design Charts
IPC-2152 is an important baseline for determining current carrying capacity, but further work must be done for individual applications. by Mike Jouppi
In response to recent chatter about IPC-2152 in multiple online articles, I believed it necessary to reiterate the purpose behind the IPC design standard for sizing electrical traces.

IPC 1-10b is a task group of volunteers from several companies in the electronics industry. I was task group chairman from 1999 to 2016. We designed test boards and wrote IPC-2152, Standard for Determining Current-Carrying Capacity in Printed Board Design. The standard is intended to describe the test data used to define trace heating in a specific configuration through conductor sizing design charts. Testing was performed following IPC-TM-650, method 2.5.4.1A, “Conductor Temperature Rise Due to Current Changes in Conductors.” The design charts are only applicable to that configuration. Designs with different board sizes, thicknesses, and materials, including copper planes – when mounted by bolted fasteners or wedgelocks – have different trace temperatures for an applied current. People and corporations have to create their own charts if they want to have an accurate temperature for a given trace size and applied current. The information included in IPC-2152 provides that information. (Accurate temperatures can only occur from a design chart if that chart represents the specific technology.)

Ventec Advertisment
Standards
OSP Myths Dispelled
A new specification tackles the application and performance of organic solderability preservatives.
by Michael Carano
After many years of starts, stops and debate, an industry committee has finally developed a standard for organic solderability preservatives (OSPs). IPC-4555, Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards, is out now, and it was a long time coming.

With the electronics industry fully entrenched in lead-free soldering, a standard for OSP is critical. There are more stringent requirements for solder joint reliability, resistance to corrosion, as well as additional requirements related to complex substrate designs.

Vayo Advertisement
ACQUISITIONS
A Royal Summit
Summit Interconnect’s chief executive explains the PCB fabricator’s latest buy. by Mike Buetow
Summit Interconnect in May announced the acquisition of fellow printed circuit board fabricator Royal Circuit Solutions for an undisclosed sum.

But while the deal at first glance looks like the latest in a long string of capacity buys for the second-largest fabricator in North America, there is more to it than meets the eye.

For its part, Royal has engineering tools and staff that Summit can leverage to speed its own operations.

Royal also includes an electronics assembly operation, Aurora, CO-based Advanced Assembly. The EMS outfit’s quickturn production capabilities fit well with Summit’s commercial prototype programs. That the fab and assembly sides are integrated adds one more appealing facet to the acquisition.

Sigmatron International Advertisement
Stay connected to top PCB Leaders with
PCU logo
Rick Hartley
Susy Webb
Lee Ritchey
Gary Ferrari
& more
It’s like having a second brain.
Printed Circuit University logo
Online courses and webinars for the printed circuit engineering community.
GETTING LEAN
An Industry 4.0 Approach to Employing 3-D AOI
on an SMT Line
Correlating inspection trending with test data to fine-tune accept/reject parameters.
Industry 4.0 automated inspection technology opens the door to enhanced levels of process control. In addition to having to upgrade equipment, however, fully leveraging the power of this technology requires a strong team, an accurate program validation database, and a methodology to track trends in continuous improvement activities. Here is a look at an implementation process for inline 3-D solder paste inspection and 3-D automated optical inspection following reflow on SigmaTron’s SMT lines in Tijuana.

A planned phase two of this implementation includes adding 3-D AOI to secondary assembly operations post-SMT, plus correlating AOI trending with final test data to fine-tune AOI acceptance/rejection parameters. The facility is currently averaging 50ppm defect rates across its SMT lines. The goal of this greater inspection process is to drop that to zero defects; although, given material constraints are driving a defective component rate that represents a third of that 50ppm level on some programs, zero ppms may be unachievable until material availability returns to normal.

Seeing is Believing
Swindlers’ Lists
Engineers know a snow job when they hear it.
Dear Mr. Christ,

Knowing you’re a busy man, we’ll cut to the chase: Our firm is offering you an exclusive list of the five million attendees to your recent motivational speech on the mountain. Our proprietary Digitaldisciple algorithms identify those most receptive to your message, broken down by district in Judea, so you can focus on the finer points of conversion, based on leaders and laggards, attendance-wise. We’ve done the work, so you don’t have to, for a very – dare we say it – revelatory price. Others promise salvation in the form of prescreened customer lists, but only we deliver. Accept no substitutes! Click the link at the bottom of this email, and a customer service representative will contact you soon about how we can make the Beatitudes work for you!

You know those lists? Of course you do.

Off The Shelf typography
Off The Shelf typography
Machines Materials Tools Systems Software
Averatek ACL,
CBF Materials for A-SAP
Aluminum clad laminate and catalyzed buildup film use Toyo catalyzed aluminum foil that provides well-controlled surface texture and uniformly coated palladium metal. Developed for outer and buildup layers, ACL and CBF enhance use of HDI PCB and package substrate manufacturing technology A-SAP. Fill technical gap between mSAP HDI PCB and package substrates. A-SAP can be used for materials with thin electroless base copper layer. Liquid metal ink forms palladium catalyst, which permits less than 10nm of uniform metal coating.
Averatek
Cadence OnCloud SaaS Software
OnCloud SaaS software provides toolsets for PCB design, multiphysics system analysis and computational fluid dynamics; direct and secure access to Cadence software and cloud data storage, without installation and licensing; and online support resources, including thousands of training courses and rapid adoption kits.
Cadence Design Systems
Hirose KW30 Connector
Hirose KW30 Connector
KW30 1mm-pitch wire-to-board connector comes in two to eight positions. Miniature single-row connector offers reliability via a two-point contact design, combined with crimp contact deflection prevention. Rib design provides secure fit when mating plug and receptacle. Center lock prevents incomplete mating, mis-insertion and lock damage. Is offered in straight or right-angle interface types; 28, 30 or 32AWG; and gold plating. Is for home appliances/white goods, medical devices, office equipment, industrial robots, FA controllers and servo motors. Has current rating up to 3.0A, voltage rating of 100V AC/DC and operating temp. range of -55° to +105°C.
Hirose
NI TestScale Functional Tester
TestScale modules can be combined in custom configurations to meet coverage needs and slot into small industrial chassis that connects to host PC using USB. TestScale Chassis can be rack-mounted or mounted within fixture. Hardware connects to NI and third-party software such as TestStand, LabVIEW and Python using NI-DAQmx driver. Optimizes coverage with flex modular design and daisy-chain chassis. Reportedly reduces footprint up to 50%. Speeds fixture design with standard 37-pin connectors and production-optimized form factor.
National Instruments
Rogers RO3003G2 Laminates
RO3003G2 laminates now include a 9µm electrodeposited HVLP foil option. Are for antenna outer layers for millimeter wave (mWave) radar PCBs, for example. Can reduce copper reduction steps needed to meet final PCB copper thickness requirements after filled via formation. Unbalanced cladding options permit thicker copper to remain on ground layer.
Rogers Corp.
Circuits Assembly Advertisement
Technical Abstracts
In Case You Missed It
Flexible Wireless Electronics
“Room-Temperature High-Precision Printing of Flexible Wireless Electronics Based on MXene Inks”

Authors: Yuzhou Shao, et al.

Abstract: Wireless technologies-supported printed flexible electronics are crucial for the Internet of Things, human-machine interaction, and wearable and biomedical applications. However, the challenges to existing printing approaches remain, such as low printing precision, difficulty in conformal printing, complex ink formulations and processes. Here the authors present a room-temperature direct printing strategy for flexible wireless electronics, where distinct high-performance functional modules (e.g., antennas, micro-supercapacitors and sensors) can be fabricated with high resolution and further integrated on various flat/curved substrates. The additive-free titanium carbide (Ti3C2Tx) MXene aqueous inks are regulated with large single-layer ratio (>90%) and narrow flake size distribution, offering metallic conductivity (~6, 900 S cm−1) in the ultrafine-printed tracks (3µm line gap and 0.43% spatial uniformity) without annealing. In particular, the authors built an all-MXene-printed integrated system capable of wireless communication, energy harvesting and smart sensing. This work opens a door for high-precision additive manufacturing of printed wireless electronics at room temperature. (Nature Communications, Jun. 9, 2022, https://www.nature.com/articles/s41467-022-30648-2)

Semi Advertisement
PCB Chat Advertisement
Printed Circuit Design & Fab Circuits Assembly logo
Thanks for reading our July 2022 issue!