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June 2022
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June 2022 • VOL. 39 • NO. 6
Printed Circuit Design and Fab Circuits Assembly logo
First Person
Right on Target.
Mike Buetow
money matters
When you want to write a check, but can’t.
Peter Bigelow
Extra size, extra costs.
Greg Papandrew
Exit strategies.
Susan Mucha
Covid innovations.
Gene Weiner
Tech Talk
Beyond PCB constraints.
John Burkhert, Jr.
Lined up for onshoring.
Alun Morgan
The flex stackup.
Nick Koop
Updates in silicon and electronics technology.
Binghamton University
June 2022 • VOL. 39 • NO. 6
Printed Circuit Design and Fab Circuits Assembly logo
Reflections, even from a single discontinuity, can destroy a signal, but the effect of the major discontinuities can be predicted with validated models before the board is designed.
Managing propagation delay and relative time delay mismatches is a challenge. We need to know how to calculate trace length from time delay value to implement the PCB trace routing accordingly.
Fresh off its inaugural meeting, the PCBAA gets legislative good news. What’s next for the organization that wants to rebuild US production? Travis Kelly, president and chief executive of Isola and chairman of the PCBAA, explains.
Working with a contract manufacturer can be daunting, particularly if it lacks experience sourcing challenging parts in a challenging market.
Printed Circuit Design & Fab Circuits Assembly June 2022 cover
A case study showed a well-balanced aqueous cleaning agent removed lead-free, water-soluble tack flux residues better than straight deionized water.
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PO Box 807
Stephen Chavez, chairman
Michael Creeden, vice chairman
Justin Fleming, secretary
Gary Ferrari, chairman emeritus

Michael Buetow
Tomas Chester
Douglas Dixon
Tara Dunn
Richard Hartley
Scott McCurdy
Anaya Vardya
Susy Webb
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The Route
A headshot photo of Mike Buetow smiling (Editor-in-Chief at UP Media Group)
‘At the Edge’ of a Data Revolution

AVE BIG BOX stores learned lessons that can be applied by electronics manufacturers?

One of the big takeaways from the Future Compute conference on the campus of MIT in May was a definitive “yes!”

There, we heard about how some of the large retail chains like Target use software, hardware and data in all kinds of customer experiences.

Almost every employee has handheld devices tracking the billions of sensors and cameras in use across some 1,900 stores and 50 regional distribution centers. At each store, it runs about 100 different software applications. They look at traffic trends: When is the peak? When is the lag? And how can they be modulated?

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Around the World

PCDF People
Anaya Vardya of American Standard Circuits and Doug Dixon of 360Biz have joined the Printed Circuit Engineering Association (PCEA) board of directors.
Boston Materials named Rafael Padilla sales director – electronic solutions.
A portrait headshot photograph of Russ Steiner smiling
Casco Automotive promoted Russ Steiner to global ECAD manager. He joined the company in 2018, and has been in printed circuit design and engineering since 1979.
Google named Jonah Stephenson staff electronic packaging engineer. He spent the previous seven years at Facebook, and has more than 23 years’ experience in design engineering.
Insulectro named Joe Harbour director of operations, East and Midwest regions.
Meta named Oscar Miguelino PCB design engineer.
Paul Trio is now director of the SEMI International Standards program.
Around the World
Summit Acquires Royal Circuit and Affiliates
ANAHEIM, CA – Summit Interconnect announced the acquisition of printed circuit board fabricator Royal Circuit Solutions and its assembly affiliate Advanced Assembly for an undisclosed sum.

The deal includes Royal Circuit’s operations in Hollister and Santa Ana, California, and the Advanced Assembly EMS site in Aurora, Colorado.

The acquisition expands Summit’s PCB offering in rigid, flex, rigid/flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.

Around the World
TTM Technologies to Acquire Telephonics for $330M

SANTA ANA, CA – TTM Technologies has agreed to acquire Telephonics in a debt-free cash transaction for $330 million, subject to customary working capital adjustments at closing.

Telephonics provides intelligence, surveillance and communications solutions deployed across land, sea and air applications. The transaction is expected to broaden TTM’s Aerospace and Defense product offerings.

The transaction is subject to customary closing conditions, including regulatory approvals. It is expected to close in the second quarter of 2022.

Around the World
Simmtech Subsidiary Opens Manufacturing Plant in Malaysia

BATU KAWAN, MALAYSIA – Simmtech Holdings, through its Malaysia-based subsidiary, Sustio, in May officially opened its new manufacturing facility here, according to reports.

It’s the company’s first advanced manufacturing facility based in Penang, says Southeast Asia managing director Jeffery Chun.

“It is also our eighth factory, along with other operations in Korea, China and Japan. In May last year, Sustio broke ground on an 18-acre site at BKIP, investing more than RM600 million. Despite the lockdown caused by the Covid-19 situation, the practical construction work took only nine months to complete, and the factory is now fully equipped and ready to run mass production. This new factory has already employed more than 700 workforces, and it will reach its full employment of more than 1,000 employees by next year. This new factory will also deliver the first Made in Malaysia semiconductor memory chip packaging substrate and printed circuit board, bolstering Malaysia’s semiconductor supply chain even further.”

The factory is expected to increase Simmtech’s total capacity of substrates and PCBs 20%, according to Chun.

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Around the World
CA People
Benchmark named Beth Kufahl director, materials, and Benchmark Space Systems named Bharat Patel avionics engineer.

Bestronics hired Alison Shyu as program manager.

Creation Technologies named Steve Heinzen strategic account leader.

Emerald EMS appointed Lucian Soaita chief operating officer.

Essemtec named Quintin Armstrong North American service manager.

Irene Sterian, director, technology and innovation development at Celestica and founder of REMAP, passed away on May 8.

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Ethan Mueller, Kyzen’s regional manager – Midwest, received a 2022 40 Under 40 Award from Products Finishing Magazine. Mueller manages sales and customer support functions in the Midwest US.
Sam Reed Headshot
Libra Industries appointed Sam Reed (left) director of operations for its Cleveland EMS location and Luis Montiel chief financial officer.

Around the World
Icape Acquires German PCB Supplier SAFA2000
MUNICH – Icape Group in April acquired German PCB supplier SAFA2000 for an undisclosed sum. SAFA2000 had 2021 revenue of €15.5 million (US$16.8 million), with 28 employees and 360 active customers.

“Icape Group is well established in Germany,” said Cyril Calvignac, CEO, Icape. “Our business unit recently moved to brand-new offices. We deployed more logistics solutions in Nuremberg. We invested in the acquisition of BA Elektroniks in 2021, and we are now moving forward with the acquisition of SAFA2000, which brings another experienced structure to our organization, with very interesting tools, new customers, an expansion of our suppliers’ list, and advanced logistics services with a fully operational warehouse to manage our activities in this dynamic country that represents our biggest market share in Europe.”

The German company will be integrated into Icape Deutschland in 2023.

Around the World
Icape Prepares IPO, Aims for Revenue of €500M by 2026
FONTENAY-AUX-ROSES, FRANCE – Icape Group is preparing an initial public offering on the small-cap market of the Euronext exchange. The planned IPO is subject to regulatory approval of the company prospectus, admission to the exchange, and favorable market conditions.

The printed circuit board fabricator and assembler had revenue of €169 million (US$182.4 million) in 2021, up 34%. The company aims for revenue of €500 million by 2026.

The company is currently owned by its founder, managers and employees.

Icape consists of 27 subsidiaries. The company believes its global organization is structured and sized to absorb a new phase of significant growth.

Around the World
Cicor Completes Acquisition of SMT Elektronik

DRESDEN GERMANY – Cicor Group completed its acquisition of SMT Elektronik, according to reports. No financial terms of the agreement were disclosed.

The transaction will be financed by existing credit facilities and funds from a mandatory convertible bond issued in January.

SMT Elektronik is integrating approximately 130 employees here, expanding its electronic manufacturing services business in Germany. The merged firms will operate as Cicor Deutschland, effective immediately.

SMT Elektronik’s customer base is related to Cicor’s target markets of medical and industrial technology. The company generated sales of some €20 million in 2021.

As part of the deal, Cicor also acquired SMT’s data logger business, including Monilog products.

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Around the World
Cnergenz Seeks to Raise RM58M from IPO in Malaysia
BURSA, MALAYSIA – Cnergenz expects to raise RM58 million (US$13 million) from a planned initial public offering in May, according to reports. The Penang-based electronics manufacturer said the IPO involves the public issue of 100 million shares and an offer for sale of 50 million offer shares by way of private placement.

From the public issue, 25 million shares will be made available for application by the public, while 10 million shares will be designated for application by directors and employees. The remaining shares will be reserved for investors.

The proceeds will be allocated for the firm’s operations facility, in addition to R&D development and working capital.

Around the World
SEC OKs Registration Statement on Tempo, ACE Acquisition
SAN FRANCISCO – Tempo Automation and ACE Convergence Acquisition said the registration statement in connection with their previously announced proposed business combination has been declared effective by the US Securities and Exchange Commission.

The deal is estimated at an equity value of $919 million post-transaction. The transaction could include cash of more than $500 million.

ACE will hold a general meeting May 5 during which shareholders will be asked to consider and vote on proposals to approve the merger and related matters.

The deal is expected to close shortly after the meeting, subject to shareholder approvals and the satisfaction or waiver of the conditions in the agreement and plan of merger and other customary closing conditions.

Upon closing, the company will be renamed Tempo Automation Holdings.

Around the World
Henkel Opens Technical Application Center in Silicon Valley
SANTA CLARA, CA – Henkel opened an application center here designed to support product development for the materials company’s electronics customers in the Silicon Valley. The $2 million investment includes dispensing robots, 3-D printers, mechanical property evaluation equipment, coating and jetting systems and failure analysis capabilities, among other assets.

In addition to the hands-on laboratory, the facility provides multiple secure collaboration spaces for Henkel technical staff and customers, as well as digital platforms for virtual engagement opportunities.

“The current pace of technology progress is unprecedented,” said Stefan de Diego, regional head of electronics, Americas and Europe, Henkel. “And, for today’s innovators, being first to market is integral to commercial success. With our knowledgeable team and extensive lab resources – located in the global epicenter of tech innovation – Henkel can provide even more immediate and impactful prototype design and analysis support for our customers, helping them meet critical time-to-market windows with tested, proven devices.”

Henkel’s application center offers a co-development environment, with access to resources required for technology design and testing.

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Market Watch
Computer Comedown

Trends in the US electronics equipment market (shipments only)

Computers and electronics products
Storage devices
Other peripheral equipment
Nondefense communications equipment
Defense communications equipment
A/V equipment
Nondefense search and navigation equipment
Defense search and navigation equipment
Medical, measurement and control
rRevised. *Preliminary. 1Includes semiconductors. Seasonally adjusted.
Source: U.S. Department of Commerce Census Bureau, May 3, 2022
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All Stretched Out
Shipping, Covid-19 and inflation challenges rival supply chain issues when securing capital equipment.
When I made my 2022 capital investment plan, I never thought it would be my 2023 capital investment plan. However, with a couple minor exceptions, equipment will be put in service during 2023, not this year as originally planned.

I thought I was the exception, but in conversations with colleagues, I realize I am the current norm. A trio of events had the combined impact of making what should be simple investments in machinery and equipment anything but.

The most talked about, problematic event has been the strained supply chain. I am not sure exactly how much of the problem getting machinery and equipment is directly attributable to the supply chain, but it has indeed had an impact. When obtaining lead-time quotations, availability of parts, chips, etc., are always the culprit cited for the long length of time to build the equipment, whether a complex custom-built item or simply a copier for the office.

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PCB Panelization Costs:
It’s All About the Real Estate
Just like housing, a little extra size can cost a lot more.
Printed circuit boards in panel or array format increase the efficiency of the assembly operation, especially in volume applications. Takt time is greatly reduced, and handling of product is easier. However, rising material prices are cutting into that advantage because more material is required to produce those arrays.

PCB costs are based on the amount of raw material required to make a particular board. The metal finish, like ENIG or silver, plays a part in pricing, but it is the amount of fiberglass and copper needed that really determines the final cost.

The quoted price for most boards in panel or array format is based on a fabricator’s desired panel price for a particular technology or quantity, divided by the number of arrays (or pieces) that fit on a standard 18 x 24″ manufacturing panel. The more arrays or pieces that fit on the panel, the lower the cost.

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EMS M&A: Will Your Exit Strategy Be Customer Beneficial?
Firstronic and Lacroix took a long-term approach to joining forces, eliminating the usual learning curve.
As a 40-year veteran of the electronics manufacturing services industry, I’ve seen my share of EMS mergers and acquisitions from both sides of the equation. The basic EMS industry business model adds complexity to that equation not found in most industries because EMS companies are an extension of their customers’ manufacturing operations or, in some cases, their entire manufacturing operation. If a larger conglomerate acquires the company that manufactures your dish soap, you won’t notice unless the product’s effectiveness or branding changes dramatically. If your EMS provider is acquired, it’s obvious on day one.

In many transactions, the only consideration of impact to an EMS company’s customer base is visits to key customers during the due diligence phase to enable the acquiring entity to assess whether the business levels they anticipate are likely to continue in the new entity. The alignment of EMS brand/differentiating processes and facility redundancy are often minor considerations.

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What’s Old is New
Covid Class Creations
The PCB East keynoter gives a roundup of innovative technologies to come out of the pandemic.
We have gone where no mask has gone before! The Printed Circuit Engineering Association (PCEA) held its first regional conference and exhibition in Marlborough, MA, in April.

A resurrected PCB East drew attendees from as far as the West Coast and Florida. There is nothing like in-person contact. The social aspect of networking has been missing for far too long. The enthusiasm of the attendees bodes well for future face-to-face regional gatherings.

designer’s notebook
Reasons to Go Beyond the PCB Constraints
Keeping some margin on the table increases the chances of immediate success and leaves a little bit for later.
There are many more ways to constrain a PCB layout than when I started my journey as a semi-intelligent designer. Guardrails were put in place to smooth transition into fabrication once the layout is completed. The other thrust of newer rules concerns the shrinking timing budget of our digital interfaces, particularly the memory banks.

We have so many aspects we can control that it can be tempting to disable or ignore some of them. That is a completely rational choice to make. New features take time to learn and implement. It may not be so easy to get everyone on board for a new feature or a whole new iteration of the software.

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material gains
Onshoring and Second Sourcing
The current difficulties call for a more strategic approach to arranging our global supply chains.
The supply chain chaos in the aftermath of the pandemic has highlighted the risks associated with globalization. As a phenomenon, globalization has served many of us well. Its ideological opponents, however, see today’s situation as justification for its demise. There is no denying current events have highlighted shortcomings. We would be foolish not to learn and adapt.

I’ve addressed the subject of onshoring as a potential antidote to globalization many times in the past. Arguably, now, the idea makes more sense than ever. On the face of it, shorter supply chains promise some protection against the unpredictability of today’s world. Hot on the heels of the pandemic, we now have the Ukraine crisis, and there is the fallout from Brexit, which has made for difficult and time-consuming trade between the region’s most influential economies. One major obstacle to the return of onshoring is essential indigenous-supporting industries have been largely swept away as activities have migrated offshore, taking expertise and investment with them. The conditions that caused and drove the offshoring remain in place, perhaps masked by current logistical difficulties. Accessing the data needed to move manufacturing activities from an established location is another barrier to reshoring.

The Flexperts
Where is My Flex?
When designing a rigid-flex, start with flex in the middle of a stack-up and move outward.

You’re designing a new rigid-flex. Devices are getting fanned out, via structures defined, and layer count is becoming clearer. You have determined how many flex layers you need from rigid section to rigid section. There are competing considerations on how those flex layers are configured: foil and dielectric thickness, bonded or unbonded, and where they will be in the stack-up of layers. All this impacts flexibility and how the part will bend in the installed application.

For today, let’s concentrate on where the flex layers land in the stack-up and the effect that can have on manufacturing and end-application use. Several strategies have rational logic and can be successful in select situations.

Reflections from Discontinuities
A single one can destroy a signal, but predictions with validated models can be made. by Yuriy Shlepnev, ph.d.

An ideal digital interconnect is a lossless transmission line with characteristic impedance and phase delay flat over the signal bandwidth and termination resistors equal to the characteristic impedance. In such interconnect, bits generated by a transmitter would flow seamlessly into the receiver with no limits on the bit rate. Such a utopian transmission line exists only in our imaginations and textbooks. The physics of our world prohibit it. One way to describe “what happens to the signal on the way to a receiver?” is to use the balance of power that can be written for the passive interconnect as follows:

P_out = P_in – P_absorbed – P_reflected – P_leaked + P_coupled

This is frequency domain over the bandwidth of the signal.1 P_out is the power delivered to the receiver, and P_in is the power delivered by transmitter to the interconnect. All other terms in the balance of power equation describe the signal distortion. The formula above expresses all we need to know about the interconnects. (It should be “cast in granite.”). As they say, “a formula is worth a thousand words,” almost literally in this case. To understand it, imagine the interconnect system as a multiport with the transmitter at port 1, receiver at port 2 and multiple other ports for links coupled to the link connecting port 1 and 2 and terminations to real impedance (not necessarily identical at all ports) – something like this below, together with the definition of waves and scattering parameters (or S-parameters):

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Signal integrity
How to Calculate Trace Length from Time Delay Value for High-Speed Signals
Here’s an effective process for implementing PCB trace routing.
by Lance Wang
To keep a good high-speed signal quality from driver to receiver on a PCB is not an easy task for designers. One of the most challenging issues is managing the propagation delay and relative time delay mismatches. To manage the time delays, we need to know how to calculate trace length from time delay value to implement the PCB trace routing accordingly. Here’s the process:

According to physics, electromagnetic signals travel in a vacuum or through the air at the same speed as light, which is:

Vc = 3 x 108M/sec. = 186,000 miles/sec. = 11.8 inch/nanosec.

A signal travels on a PCB transmission line at a slower speed, affected by the dielectric constant (Er) of the PCB material. The transmission line structure also affects the signal speed.

There are two general PCB trace structures*: stripline and microstrip.

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to save up $200 to on the 4-day all-inclusive conference pass!
October 4 – 7
Wednesday,October 5
PCB West 2022 logo
CONFERENCE: October 4 – 7
EXHIBITION: Wednesday, October 5
Who’s Exhibiting
Accurate Circuit Engineering

AGC Multi Material America, Inc

All Flex Flexible Circuits & Heaters

American Standard Circuits, Inc.


Archer Circuits

Arlon EMD

Bay Area Circuits, Inc.

Binary Process Solutions

Bittele Electronics Inc.

Cadence Design Systems

Cicor Group

DownStream Technologies, Inc.

DuraTech Industries

Dynamic Electronics Co. Ltd.

EM Solutions Inc.

EMA Design Automation

Emerald EMS

Fischer Technology, Inc.

Flexible Circuit Technologies

Fujipoly America


HZO, Inc.


Imagineering, Inc.


IPC-2581 Consortium

Ironwood Electronics



Leader Tech, Inc.

MFS Technology (S) Pte Ltd.

MicroConnex, A Carlisle Company

MVINIX Corporation

Nano Dimension

Notion Systems GmbH

Oak-Mitsui Technologies LLC

Ohmega Technologies/Ticer Technologies

OKI Circuit Technology Co., Ltd.

Optiprint AG

Panasonic Electronic Materials

PCB Technologies – USA

PFC Flexible Circuits Limited

Polar Instruments, Inc.


Printed Circuits LLC

Rogers Corporation

San Diego PCB Design

San-ei Kagaku Co., Ltd.

Screaming Circuits

SEP Co., Ltd.

Shenzhen Danyu Electronics Co., Ltd.


Sierra Circuits

Summit Interconnect

Sunshine Global Circuits

Sunstone Circuits

SVTronics, Inc.

Taiyo America Inc.

Tempo Automation

Trilogy-Net Inc.

Ultra Librarian

Vayo (Shanghai) Technology Co., Ltd

Ventec International Group

Victory Giant Technology

Xiamen Bolion Tech Co., Ltd.

Zuken USA Inc.
Supply Chain
Will US Government Incentives Spur Domestic Investment?
Fresh off its inaugural meeting, the PCBAA gets legislative good news. What’s next for the organization that wants to rebuild US production?
by Mike Buetow
In early May the Printed Circuit Board Association of America, or PCBAA, held its first annual meeting, at which they shared progress on their overarching goal, which is to advance US domestic production of PCBs and base materials.

Coinciding with that meeting came an announcement from a pair of US legislators that they had introduced a bill to incentivize purchases of domestically produced PCBs, as well as industry investments in factories, equipment, workforce training, and research and development.

The bill, known as the Supporting American Printed Circuit Boards Act of 2022, is said to be modeled on the CHIPS Act of 2021, a much-touted piece of legislation that earmarks more than $50 billion toward new onshore semiconductor fabrication plants.

Production Sourcing Approach
Engineers looking to scale up production are victims of their success if they don’t have a long-term supply chain plan.
by Brian Laney
The situation: Your engineering team is looking to move from idea to production. You reach out to a contract manufacturer. Question: When does it begin to feel like a partnership?

As a business owner or engineer, working with a contract manufacturer can be daunting, particularly if it doesn’t have experience sourcing challenging parts in a challenging market. How can we as a community of manufacturers help solve this problem? We must put in the time to clearly identify the challenges, set aside time, and build resources to assist customers in real time – and offer a stratified path to a solution based on the type of client. Sounds easy, right? But don’t flinch when it comes to defusing bombs.

Recently, customers have tapped us to bring production to the US from Asia. These customers have been using turnkey, rapid-turn, low-volume solutions and are now looking at scaling production to about 1,000 from less than 100.

Defluxing of Copper Pillar Bumped Flip-Chips
A case study showed a well-balanced aqueous cleaning agent removed Pb-free, water-soluble tack flux residues better than straight DI water. by Ravi ParthasarathY and Umut Tosun
Solder bump technology is problematic below 150µm pitch, since it is challenging to manufacture and assemble. As the bump pitch size shrinks, solder bumps have many limitations in the fine-pitch process. Bump printing, plating or bump drops, along with bump pad sizes, are the major constraints; as a result, risk of shorts increases. Today, dies in production have as many as 25,000 bumps per die. It has been predicted this number will increase to 50,000 to 60,000 per die in the next year or two.1

Another form of bump gaining more popularity is the copper pillar. These bumps, instead of being spherical in shape, are in the form of a pillar, with various shapes and sizes. The most popular shape is in the form of a cylinder. The pillar shape allows the high ratio of bump height to bump diameter, therefore permitting very tight pitch, even when bump heights are large. Sometimes a solder cap is formed on top of the pillar to help with connectivity with the mating chip.1 Due to the cylindrical shape and non-collapsing nature of Cu pillar bumps, they can be easily mounted on the fine trace of the laminate. Copper pillars are terminals used to flip-chip IC chips to a substrate in a semiconductor package by thermal compression flip-chip (TCFC) technology. Copper pillars are formed on aluminum electrode pads of an IC chip.

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State-of-the-Art Technology Flashes
Updates in silicon and electronics technology.
Ed.: This is a special feature courtesy of Binghamton University.
This ink is alive and made entirely of microbes. Northeastern University researchers have created a bacterial ink that reproduces itself and can be 3-D-printed into living architecture. The microbial ink flows like toothpaste under pressure and can be 3-D-printed into various tiny shapes, a circle, a square and a cone, all of which hold their form and glisten like Jell-O. This new substance is not the first-ever living ink. Scientists have previously created printable gels that were cocktails of bacteria and polymers that helped provide structure when printed. One such ink contained hyaluronic acid, a seaweed extract and fumed silica. (IEEC file #12578, The NY Times, 11/24/21)
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Machines Materials Tools Systems Software
Altair Simulation 2022 Software
Simulation 2022 software helps simulate antennas and broadens toolset for advanced driver-assistance systems applications. Supports automation of 5G envelope beam patterns and includes hybrid ray-tracing patterns and rotating doppler effects for ray-based solvers. Can better simulate full-wave antenna and array characterizations to analyze wireless systems. Improved ADAS tools consider sensor types like ultrasound. Has frequency-modulated continuous-wave radar simulations that target ADAS applications. Includes updates for AEC. Altair Units-accessible capabilities include S-FRAME software, as well as SimSolid rapid analysis, HyperWorks advanced meshing, and computational fluid dynamics wind load simulations. S-CONCRETE, S-FRAME and S-FOUNDATION include built-in design codes for different American, Canadian, European and Asian/Oceanian nations. S-TIMBER addresses sustainable buildings and structures; includes analysis capabilities and can simulate structural response to seismic loading according to NBCC, ASCE and IB codes. Provides enhanced control over panel modeling to design CLT, Glulam and Sawn lumber elements for code compliance. PollEx features expanded design verification, signal integrity and PCB modeling functionalities. Includes cross-probe verification like DFx Excel results and direct ECAD link to Pulsonix and Altium Designer. Altair SimLab includes application functionalities like drop test, multiphysics analysis for PCBs, and thermal management simulation that can cover entire systems. Introduces PSIM, which can handle simulation and design for power supplies, motor drives, control systems and microgrids.
Electroninks CircuitSeed Film
CircuitSeed thin, dense film is used as 3-D, finely patterned seed layers for subsequent metallization by plating. Reduces 20-plus-step process to a few steps. Reportedly uses at least 40x less water and substantially less energy. Supports multiple chemistries that can be printed via variety of techniques as dense, finely patterned seed layers on surfaces ranging from rigid to flexible plastics and 3-D.
Electroninks CircuitShield Ink
CircuitShield ink is for EMI shielding and backend semiconductor metallization. Powers technology that produces smartphones with 5G capabilities. Reportedly eliminates spray nozzle clogging and residue in silver film, and provides high shielding effectiveness. Has long shelf-life and excellent printing stability at room conditions. Is used for five-sided SiP shielding with aspect ratio from top to side wall close to one. Other use cases involve wafer metallization and conformal via coating.
Heraeus Condura.ultra AMB Substrate
Heraeus Condura.ultra AMB Substrate
Condura.ultra Ag-free AMB substrate enables bonding silicon-nitride-based ceramics with copper foils. Enables high-performance Si3N4 substrates using Ag-free active metal brazing bonding technology. Designed to offer outstanding reliability and processing for sintering, bonding and soldering. Comes with standard and thick Cu layers. Thermal conductivity is ≥60W/m.K and ≥80W/m.K.
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Hitachi FT230 XRF Analyzer
Hitachi FT230 XRF Analyzer
FT230 XRF analyzer speeds up analysis to help achieve 100% inspection and meet tightening specifications. Includes intelligent part recognition feature Find My Part; automatically selects features that need to be measured, analytical routines and reporting rules. On-board, user-built library handles new parts and routines as work changes. Runs on FT Connect software, with aspects of Smart-Link and X-ray Station software. FT Connect focuses interface on important aspects of XRF. Results are displayed on main measurement screen. Results can be exported in spreadsheet or JSON format for integration with SCADA, QMS, MES or ERP systems. Customized reports can be created. Has functions to confirm instrument stability, including routine instrument checks and calibration validation tools. On-board diagnostics provide information about instrument health. Data can be shared via ExTOPE Connect. High-res SDD screens parts for conformity to restricted materials legislations such as RoHS and analyzes composition of materials, including plating bath solutions and metal alloys, useful for validating incoming substrates and confirming chemistry.
Hitachi High-Tech Analytical Science
ExpressPCB Plus v. 3.1 Layout Software
ExpressPCB Plus v. 3.1 layout software creates multipage schematics and validates PCB layout. Schematic Link and Netlist Validation tools support use of symbols in ExpressCSH Plus. Reportedly has improved speed, stability and quality of results in Schematic Link and Netlist Validation tools. Includes updates to SnapEDA API.
Advantest DUT Scale Duo Interface
DUT Scale Duo Interface for V93000 EXA Scale SoC test systems tests advanced semiconductors. Usable space on DUT boards and probe cards is reportedly increased 50% or more; wafer probe and final test setups can accommodate component heights more than 3x taller. Can adapt to existing standard DUT board or probe card size or switch to new larger size. Using sliding mechanism, users can switch back and forth between both formats to adapt to specific application requirements. Stiff extended bridge achieves deflection performance in direct probing setups. Supports applications including digital and RF device testing.
Advantest Corp.
Technical Abstracts
In Case You Missed It
Additive Manufacturing
“A Review on Printed Electronics with Digital 3D Printing: Fabrication Techniques, Materials, Challenges and Future Opportunities”

Authors: C. Hanumanth Rao, et al.

Abstract: The introduction of 3-D printing technology has revolutionized the manufacturing and electronics product design in the past few years, where it is used to produce printed circuit boards. Printed electronics is one of the fastest growing additive manufacturing technologies and is becoming invaluable to various industries. The evolution of several contact and noncontact types of fabrication techniques has been reported in the recent past. Leveraging these technologies, various types of printed electronic components have been realized. One method is inkjet printing technology, which has been widely accepted for printed electronics manufacturing. As 3-D printing uses only those materials essential to create the product, it eliminates waste production, with a smaller equipment cost and minimizes the number of process steps, resulting in lower manufacturing costs with reduced turnaround time. Various kinds of conductive and nonconductive materials have emerged in the recent past in conjunction with many manufacturing techniques for printed electronics. Herein, the authors review the most commonly used substrates, electronic printing materials, and the widespread printing techniques employed at the industrial level, giving an overall vision for a better understanding and evaluation of their different features. The technical challenges of several contact and noncontact techniques with corresponding solutions are also presented. Finally, status on advances in the production of various kinds of materials employed in 3-D printed electronics and the methods for producing them, shortcomings, technical challenges, applications, benefits, and the future opportunities pertaining to printed electronics are discussed in detail. (Journal of Electronic Materials, Apr. 1, 2022,

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