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May 2022 • VOL. 39 • NO. 5
Printed Circuit Design and Fab Circuits Assembly logo
First Person
6
Live shows are worth the wait.
Mike Buetow
money matters
16
Supply Chain 4.0.
Peter Bigelow
17
Negotiate everywhere.
Greg Papandrew
Tech Talk
18
Via options.
John Burkhert, Jr.
22
Build back smarter.
Alun Morgan
53
Why Lean Six Sigma?
Filemon Sagrero
55
One-hour stand.
Robert Boguski
57
Green lit.
Clive Ashmore
Departments
May 2022 • VOL. 39 • NO. 5
Printed Circuit Design and Fab Circuits Assembly logo
Features
24
SIGNAL DEGRADATION
A simple, practical way to identify bandwidth with a numerical analysis of defects in a single bit or single symbol response.
by YURIY SHLEPNEV, Ph.D.
Printed Circuit Design & Fab Circuits Assembly May 2022 cover
32
RF DESIGN
The rush of equipment for more RF applications is being deployed across the world, with 5G and millimeter wave (mmWave) communications expanding into the commercial space to take advantage of the wider bandwidth, higher data rates and low latency that these frequency bands offer.
by THOMAS SLEASMAN
36
TEST BOARDS
Rev. 3.0 will incorporate user input. What should be on the next layout?
by CHRYS SHEA
37
DECONTAMINATION
When fogging large production areas and office locations, airborne disinfectants not only travel to the general locations but are drawn into the HVAC air handling systems, redepositing contamination throughout the system. Even when hardware is covered during fogging, the risk of contamination grows every time.
by TERRY MUNSON and PHIL ISAACS
47
EMS
How an EMS tracks defects by tying flying probe test to its novel MES.
by MICHAEL L. MARTEL
ON PCB CHAT (pcbchat.com)
Latest ECAD Market Data
with WALLY RHINES
New HDP Initiatives
with Jack Fisher and Madan Jagernauth
Nickel-Less Surface Finishes
with Kunal Shah
the Cadence-Dassault Systèmes Integration
with Michael Jackson and Stéphane Declee
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The Route
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Recent Meetings Revive Future Possibilities
A

ND WE’RE BACK!

After a (too long) break, PCEA meetups have restarted with a bang, with two local chapter meetings, plus the first national event in PCEA history.

Professional development was the focus of both chapter meetings. This can be looked at two ways: one in terms of technology advancements and the other tied to learning the basics of placement and routing.

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Around the World

PCDF People
A headshot picture of Faisal Ahmed grinning
Amazon Lab126 named Faisal Ahmed ECAD application engineer. He has more than 20 years’ experience in PCB design, most recently at Cadence.
Anirudh Devgan, Ph.D., president and CEO, Cadence Design Systems, will be honored with the 2021 Phil Kaufman Award for Distinguished Contributions to Electronic System Design during a ceremony May 12.
NXP Semiconductor promoted Dan Beeker to technical director. He has more than 40 years’ experience in engineering with Free- scale and NXP.
Around the World
Private Equity Firm Acquires Elvia PCB Group
NORMANDY, FRANCE – Private equity firm Tikehau Ace Capital has finalized the acquisition of 100% of the capital of Elvia PCB Group. Terms were not disclosed.

Alain Dietsch has been appointed CEO of Elvia PCB. He was previously CEO of Cobham Electrical and Electronic Equipment.

Bruno Cassin will leave his operational duties to join the supervisory board.

Elvia PCB had consolidated revenue of €60 million in 2019. The group manufactures PCBs for defense, aeronautics, space, industrial, telecom, automotive and medical.

Around the World
BH to Acquire LG’s In-Car Handset Wireless Charging Business

SEOUL – Printed circuit board fabricator BH said it will acquire LG Electronics’ in-car handset wireless charging business unit for 136.7 billion won (US$111.5 million), according to reports. BH will form a new subsidiary called BH EVS, and the acquisition is expected to be completed in August.

BH said demand for in-car handset wireless charging units is some 20 million units per year. The firm expects orders worth US$2 billion in the next decade.

BH CEO Lee Kyung-hwan will be CEO of BH EVS, and BH will own a 56% stake. DKT, another subsidiary of BH, will own a 44% stake.

Around the World
CCL Maker NexFlex Receives Buyout Bids

SEOUL – Six investors have submitted bids in a preliminary tender for 100% stake in NexFlex, according to reports. The sale price is estimated around 700 billion won (US$574 million).

NexFlex manufactures flexible copper-clad laminates for smartphone and TV flex substrates. The firm supplies FCCLs to companies such as Samsung Electronics and Apple.

The company is currently held by private equity firm SkyLake Equity Partners. A final candidate was expected to be shortlisted in April.

Its annual revenue expanded to 150 billion won in 2021 from 69 billion won in 2019.

Around the World
Nano Dimension Opens HQ Near Boston
WALTHAM, MA – Nano Dimension opened a new US headquarters in the Boston suburbs. The move to Waltham, MA, enables the additive manufacturing OEM to work closer to academic and research institutions, early adopters of its solutions for AME, printed electronics and Micro-AM.

The new headquarters will house expanded sales operations, customer support and fabrication facilities that will be used for customer open houses and continued support for AME Academy events and local organizations.

Veteran Gene Weiner has been retained as a consultant through his firm Weiner International Associates. In addition, Dana Korf, principal consultant, Korf Consultancy, has signed on as Nano Dimension’s new AME standards manager.

Nano Dimension retains its presence in Sunrise, FL, as a marketing, sales support and NaNoS printing services and logistics center.

Around the World
KLA Moves Frontline DfM to Cloud
MILPITAS, CA – KLA launched Frontline Cloud Services, a software solution that accelerates design-for-manufacturability analysis and time-to-market for printed circuit boards. The new cloud-based SaaS offering moves DfM analysis to the cloud, which, according to the company, significantly reduces IT bottlenecks and the amount of time needed to run analyses.

Asserting on-premises DfM analysis can take hours or days, KLA proposes a cloud-based solution to tap greater compute power.

“As a leader in PCB CAM, engineering and Industry 4.0 solutions, our customers share with us the bottlenecks that slow down their PCB manufacturing process,” said Eran Lazar, general manager, Frontline division, and vice president at KLA. “We decided to tackle the challenges of DfM analysis by taking advantage of the unlimited computational power of the cloud, while keeping the proven application intact. For PCB manufacturers eager to make the most of cloud-based efficiencies while maintaining exacting security protocols, we continually ensure Frontline Cloud Services meets the highest security standards.”

Per the company, customers running comparative tests on complex PCBs saw Frontline Cloud Services enable up to 90% faster DfM analysis speeds. For example, one customer producing high-density interconnect PCBs saw analysis time shorten to 30 minutes from 75 hours when running the same DfM analysis on premises versus with Frontline Cloud Services. Another customer producing PCBs for miniLED ran a similar test, and analysis time was reduced to 20 minutes from nine hours.

Around the World
CA People
AIM Solder’s Andres Lozoya has been awarded a Lean Six Sigma Black Belt.
Rich Mathews Headshot
Apex Tool Group named Rich Mathews chief marketing officer. He has over 30 years’ experience modernizing and growing consumer brands.
ARC Technology Solutions named Rich Flynn supply chain manager.

Arch Systems appointed Cameron Sobie, Ph.D., senior staff factory data scientist.

Georg Fuerlinger Headshot
Arch Systems also appointed Georg Fuerlinger (left) senior account manager. Based in Vienna, Austria, Fuerlinger will work with Arch Systems’ clients and strategic partners throughout Europe.
Uma Patravali Headshot
Emerald EMS named Uma Patravali president of the Bestronics manufacturing division. Patravali has a master’s in industrial engineering from Western Michigan and has worked for GE, Creation Technologies and Sanmina.
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Around the World
Altium Launches Electronic Design Program for College Students
SAN DIEGO – Altium launched Altium Education, a free online curriculum and certification program for college and university students interested in engineering and electronics design. This hands-on course takes college students from the basics of electronics to designing their first printed circuit board.

Altium Education is for university and college students studying engineering and computer science. Designed for virtual, hybrid and physical classrooms, the curriculum supplements engineering classes, and professors can incorporate it into their current lesson plans.

The program features hands-on lessons focused on schematics, design layout and manufacturing. Students will receive guided instruction that culminates in the completion of their own manufacturable PCB. An educator’s guide is provided for the course. A free license of Altium Designer ECAD software is included for any student enrolled in the course.

Upon course completion, students will obtain a certificate signifying they have successfully completed Altium’s course covering the fundamentals of PCB design.

Around the World
ISU Petasys to Construct 4th Fab Shop in South Korea
DAEGU, SOUTH KOREA – Printed circuit board fabricator ISU Petasys plans to spend 54 billion won (US$44 million) to build a fourth factory here, according to reports. The site will manufacture multilayer boards.

ISU Petasys currently makes boards for Nokia, Cisco, Juniper, Arista and others. The firm reportedly is looking to add Google to its client list.

The company said multilayer board demand is high because of 5G.

Around the World
Simmtech to Open Factory in Penang
PENANG – Simmtech Holdings will invest more than S$120 million to establish its first large-scale factory in Malaysia to address the global chip shortage, according to reports.

Once fully operational, the production facility is expected to employ more than 1,000 staff and contribute more than 20% to the company’s global capacity.

Simmtech provides printed circuit boards and packaging substrates for the semiconductor industry.

Around the World
TTM Breaks Ground at 1st Factory in Penang
PENANG, MALAYSIA – TTM Technologies in April broke ground at a new $130 million manufacturing plant here.

TTM’s expansion here is in direct response to customer requirements for advanced technology PCB supply chain resiliency and diversification in regions beyond China, the firm says. The new plant will serve TTM’s global commercial markets, including networking communications, data center computing, and medical, industrial, and instrumentation.

The automated plant will be built on approximately 27 acres of industrial land at Penang Science Park. Construction is expected to take 12 to 15 months, followed by equipment installations in the middle of 2023. Pilot production is targeted to begin in the second half of 2023, with volume production commencing in 2024, gradually ramping to full phase 1 capacity in 2025.

TTM expects the new plant to achieve run-rate revenue of approximately $180 million in 2025. The factory has also been planned to support a 25% upside phase 2 expansion.

Around the World
Katek to Buy SigmaPoint, Expand to North America
MUNICH – Katek has signed a comprehensive, exclusive term sheet to acquire Canadian electronics manufacturing services provider SigmaPoint Technologies. Financial terms were not disclosed. Closing is planned for the end of the second quarter, subject to official approvals.

The move expands Katek’s presence to include homeland security and defense and strengthens the offering for Katek’s European customers in North America.

SigmaPoint is one of Canada’s leading EMS providers, with annual sales over $100 million and 280 employees. Its largest customer in North America is one of Katek’s top five customers in Europe.

SigmaPoint CEO Dan Bergeron and the full management team will continue to lead SigmaPoint after the acquisition.

The investment is part of Katek’s strategy of opening additional markets for high-value electronics.

Rainer Koppitz, CEO, Katek, said, “As the number three electronics service provider in Europe, we are making good on the promise to our European customers of a presence on the North American continent.”

Katek also is opening its first Asian plant in Malaysia.

Around the World
Neways to Construct EMS Factory in Slovakia
NOVA DUBNICA, SLOVAKIA – Neways said it plans to replace its two electronics manufacturing sites in Slovakia with one new 16,000 sq. m. factory, according to reports. The new site will focus on PCB, cable harnesses and cabinet production.

The company says the facility will potentially grow to 800 staff, and the location will provide the option for further expansion.

Construction is set to begin in October, and the site will be fully operational by the end of next year.

Around the World
SEMI Wins $1M Grant to Create Microelectronics Apprenticeship
MILPITAS, CA – SEMI, in partnership with Ignited Education, Foothill College and Krause Center for Innovation, has won a $1 million California Apprenticeship Initiative New and Innovative Grant for the development of a semiconductor pre-apprenticeship and apprenticeship program to expand the pathway to careers in the microelectronics industry.

The SEMI Foundation and its partners will develop the industry career training program to be offered by California community colleges and ultimately schools in other states. The program will connect CAI partners with SEMI member companies to define job competencies that shape the coursework.

Around the World
VTech Mexico EMS Plant Nears Production Readiness
TECATE, MEXICO – VTech’s first EMS facility outside Asia is making progress toward establishing production. The pro-audio focus supports wood and non-wood (semi-EMS) production.

The Mexico facility is able to fully leverage the Top 50 EMS company’s supply chain in China and Malaysia. Its NPI team supports Mexico through all stages from concept to mass production.

VTech acquired the plant in 2021 from QSC, where it manufactured wood enclosure loudspeakers.

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Market Watch
EDITED by CHELSEY DRYSDALE
Components Creep Up

Trends in the US electronics equipment market (shipments only)

%CHANGE
DEC.
JAN.
FEB.
YTD%
Computers and electronics products
1.2
1.9
1.2
5.9
Computers
-2.1
2.5
3.8
-0.9
Storage devices
1.9
6.8
2.0
10.8
Other peripheral equipment
7.1
-3.7
6.5
-3.6
Nondefense communications equipment
-0.3
8.0
0.9
14.3
Defense communications equipment
1.3
6.0
-1.6
8.5
A/V equipment
-7.3
34.5
-8.2
50.3
Components1
0.9
2.8
2.4
14.2
Nondefense search and navigation equipment
0.3
1.0
-1.0
1.7
Defense search and navigation equipment
-0.1
0.8
1.2
1.6
Medical, measurement and control
1.9
-0.3
0.8
2.8
rRevised. *Preliminary. 1Includes semiconductors. Seasonally adjusted.
Source: U.S. Department of Commerce Census Bureau, Apr. 4, 2022
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ROI
Here Comes Supply Chain 4.0!
Will it be able to handle unforeseen events better than its predecessor?
Many are excited and working diligently toward enabling Factory (Industry or Tech) 4.0 to dramatically change their manufacturing and business environment, but maybe we should focus instead on Supply Chain 4.0, as that may change the manufacturing and business environment more – and not in a good way!

Businesses are currently operating within Supply Chain 3.0. Supply Chain 3.0 has taken decades to refine into a highly efficient, cost-effective, global supply chain. We know how we got here. Companies sought lower-cost skilled labor and a cost-friendly operating environment in which to build manufacturing facilities. As manufacturing shifted to these lower-cost areas, governments invested in infrastructure and education to attract ancillary businesses to invest there as well. Shipping and logistics improved thanks to the advent of containerships, larger aircraft, better roads and rail, and countries opening their borders to trade. The result was a global supply chain in which components and parts are made almost everywhere and transported “just in time” to assembly sites, before finished products are shipped to customers.

BOARD BUYING
In PCB Procurement, Negotiate All Over
Review pricing with current and outside suppliers to confirm you are paying the going rate.
“We don’t have the bandwidth to move business.”

That’s what a printed circuit board buyer told me recently.

Let’s unpack that because it could be a shortsighted attitude.

When an EMS firm puts a PCB supplier on its AVL, it often asks only for pricing on new projects. When it comes to existing work, the response is often, “We don’t move boards once they are placed,” or, “we don’t have time to rebid those,” or, “it takes too much effort to move to another vendor.”

designer’s notebook
Selecting the Appropriate Through-Via Technology for a PCB Project
Component manufacturers continue to seek breakthroughs, adding functions and reducing size, while fan-out is left to the designer.
While the printed circuit board is composed of sheets of dielectric and conductor layers, it’s the vias that really bring a circuit to life and keep it going. Permitting signals to pass from one layer to another makes this a 3-D puzzle that can scale to a staggering number of layers.

You don’t have to go back many decades to find a time when we called them printed wiring boards. (Officially, the standards still do.) Components were mounted to what looked like a pegboard: rows of evenly spaced holes where the leads of the part extended through two or more of the holes. You just added wire. As far as routing consistency, every board was a one-off, built up one wire at a time.

material gains
Build Back Better – and Smarter
As the pandemic becomes endemic, restoring order to the world’s prices and supply chains will take time and won’t be easy.
As we all adjust to the reality that Covid and its derivatives are here to stay, communities around the world are beginning to rebuild economically: returning to work, reviving businesses where possible and making new plans if not.

It is no surprise materials, inventory and shipping are in short supply and are often stuck in the wrong places. In some cases, services that companies used to rely on are no longer available because the suppliers have gone out of business. Workforces are depleted, and some knowhow, skills and experience have been lost. Rebuilding is not as straightforward as opening the factory doors, picking up the tools that were put down at the beginning of 2020 and getting on with it. Even now governments are still mandating measures such as the sudden full lockdown of Shanghai, which has severely impacted road and air transport. We must still expect the unexpected!

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Signal integrity
Bandwidth for Modeling and Measuring PCB Interconnects
Numerical analysis of defects in single bit and single symbol response.
by Yuriy Shlepnev, PH.D
Modeling and measuring digital serial interconnects is usually done in the frequency domain. That means the minimal and maximal frequencies (or bandwidth) should be defined before analysis or measurement begins. The data rate and rise time define the signal bandwidth, and the usual practice is to define the maximal frequency as either the inverse of the rise/fall time (or fraction of it) or as a multiple of the fundamental or Nyquist frequency.1 Such a simple bandwidth definition may work for some structures, but it may fail for others. Ultimately, an SI engineer must make the decision for a particular signal type and interconnect structure.1

Here we introduce a simple, practical way to identify the bandwidth with a numerical analysis of defects in a single bit (SBR) or single symbol response (SSR). It begins with a brief introduction into structure and spectrum for 6Gbps and 112Gbps signals. Then, it proceeds with analysis of defects in SBR and SSR introduced by the bandwidth deficiency for two practical cases. The bandwidth is defined by a model with an acceptable level of defects in either SBR or SSR.

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RF design
Embedded Resistor Copper Foil for mmWave Applications
Embedded passives are being deployed for commercial market applications. by Thomas Sleasman
Recent advancements in mobile technologies have exponentially increased demand for radio spectrum bandwidth. The rush of equipment for more RF applications is being deployed across the world, with 5G and millimeter wave (mmWave) communications expanding into the commercial space to take advantage of the wider bandwidth, higher data rates and low latency that these frequency bands offer. Cellular 5G and 6G, low Earth orbit (LEO), mid Earth orbit (MEO), geosynchronous communications networks, interconnected devices (internet of things), autonomous driving vehicles, defense and environmental monitoring are all driving these needs. The antenna and sensors necessary to manage the signals for these applications are similarly changing, becoming more sophisticated.

To ensure high-data-rate wireless connectivity, the broadband high-gain antennas necessary to manage high-frequency but lower-power signals are increasingly moving from dish and horn to flat-panel active electronically steered antennas (AESA) for beam forming and massive MIMO designs. In response, the RF industry has developed new integrated circuits, materials, processes and equipment to build devices to manage these mission-critical sensor applications.

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Test Boards
Revamping the SMTA Miniaturization Test Vehicle
Rev. 3.0 will incorporate user input. What should be on the next layout?
by Chrys Shea
The current SMTA Miniaturization Test Vehicle was released in 2018 and is projected to have an effective lifespan of three to five years. Its design has served the SMT community well – and will continue to do so with an updated layout, bill of materials (BoM) and associated programming and analysis files slated for release in late 2022.

The board is used for standard tests, such as solder paste selection, wipe frequency and pad or aperture design, which will remain the same in the new revision, albeit with some components removed and others added. FIGURES 1 and 2 show the top and bottom sides of the board with the footprints that will be removed outlined in orange, and ones that may be removed outlined in blue:

  • The 1206 and 0603 components will be completely eliminated, opening up several square inches of real estate on the populated side of the board.
  • The QFN layout will avoid copper pads on the opposite side to make x-ray analysis easier.
  • The SIR coupon will be removed, thereby eliminating the need for the gold fingers on the short edge of the board, which in turn will eliminate the notch that requires machine board stop adjustments for the unpopulated side. It will also free up about 6 sq. in. of real estate for print or reflow tests.
  • At least one set of the fine resolution spread tests will be removed, freeing up even more space on the unpopulated side.
DECONTAMINATION
The Risks of Electronic Hardware Exposure to Disinfectants
Case studies show cleaning the workplace can harm materials and equipment. by Terry Munson and Phil Isaacs
During the pandemic, cleaning and disinfecting common areas and surfaces to protect and remove the Covid-19 virus and all other viruses and bacteria has become urgent. During this time manufacturers have turned to professional cleaning services or have assigned facilities departments the responsibility of properly disinfecting areas. Adding corrosive chemicals to the working environment is a new condition. While the CDC issued guidelines for human exposure and documented the timing and conditions when workers can return to a work area after fogging, spraying and disinfecting, it missed the understanding and risk of contamination these corrosive chemicals can cause to exposed electronic hardware, components, material in production and production equipment. Below are case studies showing the chemical effects and residue patterns negatively impacting hardware and operating conditions.

As the pandemic altered our world, we learned and isolated in ways we never expected. As the SARS-CoV-2 virus spread, manufacturing facilities closed worldwide to help slow the spread of the disease. Scientists and engineers sought methods to safely reopen factories, prioritizing the effectiveness of disinfecting methods for the health and safety of the employees. Possible reliability impacts to electronic products and equipment were typically not of highest consideration. The initial unknown nature of the virus, its mode of spread, and length of time it lives on surfaces resulted in a need to apply disinfecting agents to the environments where people are exposed to other people.

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EMS
Vanguard EMS:
Manufacturing the Smarter Way
Integrated flying probe testers and in-house MES have the EMS firm leading the pack. by Michael L. Martel
Vanguard EMS is one of the largest locally owned electronics manufacturers in the Pacific Northwest, with a 77,000 sq. ft. facility near Portland, OR. The company specializes in high-reliability electronics products for the medical, aerospace and defense, and infrastructure/industrial sectors. Some 70% of the firm’s customers are Fortune 500 companies. Founded in 1988 by Tektronix alumni, the company grew steadily and was acquired in 2003 by Floyd Sutz, Vanguard’s CEO and an employee since 1995.

“Basically, everything we build has a high cost of failure, especially out in the field,” said Chris Smith, director of sales. “Defense and aerospace, for example, are about 55% of our business. Medical is probably about 25%, and for those industries, these are products that are in the top five or 10% as far as difficulty is concerned. That’s a high level, and yet this year we will be marching up to about $70 million annually.”

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Getting lean
‘Why’ Lean Six Sigma?
Lean Six Sigma training leads to effective, intrinsic problem-solving.

Much has been written on the “how” of Lean Six Sigma. This column discusses the “why” behind Lean Six Sigma. SigmaTron’s facility in Tijuana, Mexico, began implementing its Lean Six Sigma program in 2018 as a way to instill a focused process improvement methodology in its automotive and medical customer projects. A consultant was brought in for initial training, and I volunteered to be the internal champion after agreement that the necessary management support and resources would be put in place. The initial training sessions were designed to train the engineering team as Green Belts and select production personnel as Yellow Belts.

One challenge in an electronics manufacturing services company is each customer has control of their design. While some incorporate EMS-driven design for manufacturability (DfM) recommendations, others do not. Although SigmaTron’s production personnel wanted to solve production problems as they arose, the root causes were often difficult to identify using basic quality tools such as pareto charts without a strong problem-solving methodology. With Lean Six Sigma training, the team evolved from engineers and technicians trying to fix problems to a cohesive team with the necessary tools to rapidly identify issues, brainstorm possible root causes, test hypotheses, and implement the best solution. Issues that had taken weeks to analyze with prior methods were addressed in days or hours.

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Seeing is Believing
A One-Hour Stand
A self-proclaimed “visionary” doesn’t always understand the true meaning of partnership.
In a perfect world, there would be truth in advertising.

It would be jaw-dropping to hear a politician say:

“My statements yesterday regarding the ignorance of voters on the issues of the day were not taken out of context. I meant every word I said, down to the last comma, semicolon and exclamation point, and I stand by them. Many of you don’t even know what a semicolon is, much less how to use it. What’s more, exploiting that gift of voters’ ignorance has propelled my political career and enhanced my electoral viability. Systems are meant for gaming, and I’m seizing the moment my schooling and ambition has set for me. Here in the land where preparation meets opportunity, mine eyes have seen the glory. God Bless America!”

SCREEN printing
When All the Lights are Green
The time to squeeze out more efficiency is when everything is in spec.
What kind of approach do you generally take? Do you follow the “if it ain’t broke, don’t fix it” mantra, or are you more the “it’s good, but it could be better” type? In electronics manufacturing, continuous improvement is often discussed, but how much does your organization adhere to this philosophy when the shop floor is humming and everything is within spec? This is when process engineers should try to squeeze out even more efficiency.

Certainly, there is urgency around a process that is not running as it should. However, when all the lights on the line are green, there is likely opportunity for more improvement than you realize. Consider challenging the process through the lenses of incremental cost reduction and quality enhancement.

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Off The Shelf typography
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Pulsonix v. 12.0 PCB Design Tool
Pulsonix v. 12.0 PCB Design Tool
Pulsonix v. 12.0 includes 3-D collision detection for multi-board designs and board folding. Visualizes boards in stacked or folded configuration and verifies boards and components fit together in intended space. Automated clash detection flags any space violations. Can ignore clashes intended for known connection points like plugs and sockets. 3-D capabilities are integrated into consolidated menu that organizes setup and operation. Has 64-bit implementation and additional multi-threading capabilities. Increased speed with large designs due to increased 64-bit address space and multi-threading for library access; 3-D rendering is now multi-threaded, meaning 3-D viewing and STEP output can be spread across multiple cores. Includes dark mode option, additional rules and DRC checking. New rules include stub routing length, loop antenna, return path, SMD to corner and SMD to plane rules. Has additional enhancements to edit differential pair traces.
Pulsonix
Saturn PCB Design Toolkit v. 8.08
Saturn PCB Design Toolkit v. 8.08 is a freeware PCB calculator for microstrip, stripline, differential pair, via current, PCB trace current, planar inductor, padstack, crosstalk, Ohm’s Law, XC XL reactance, BGA land, Er effective, wavelength and PPM. Incorporates current capacity of PCB trace, via current and differential pairs.
Saturn PCB
Vishay Draloric TNPV0805 e3 Resistors
Draloric TNPV0805 automotive-grade high-voltage thin-film flat-chip resistors combine operating voltages to 450V with tolerance of ±0.1% and TCR down to ±10ppm/K. Typical applications for AEC-Q200-qualified devices include voltage measurement in automotive and industrial inverters, voltage dividers for battery management systems, on-board chargers and test and measurement equipment. Available in 0805, 1206, and 1210 case sizes, with resistance values from 121kΩ to 3.01MΩ, an operating temp. range of -55° to +155°C, and operating voltage up to 1,000V for largest case size. Are stable and reliable in variety of environmental conditions, with load-life stability of ≤0.05% for 1,000 hr. at rated power and +70°C ambient temp., moisture resistivity of 85°C, 85% RH, and sulfur resistance in accordance with ASTM B 809. Suitable for processing on automatic SMD assembly systems and automatic soldering. Are halogen-free and RoHS-compliant. Pure matte tin plating provides compatibility with Pb-free and SnPb-containing soldering processes.
Vishay
XJTAG 3.12 Boundary Scan Software
XJTAG v. 3.12 tool for debugging boundary scan setups provides automatic help when signal integrity problems arise. Has flexible user levels; can control level of detail factory operators can access. Can work more efficiently with XJEase code by providing powerful searches that scan through all code files in project.
XJTAG
Keyence VR-6000 3-D Optical Profilometer
Keyence VR-6000 3-D Optical Profilometer
VR-6000 3-D optical profilometer is designed with built-in motorized rotational unit. Reportedly takes 3-D measurements around circumference of part without blind spots. Wall thickness, undercuts and cross-sectional measurements can be taken without cutting or destroying target. Full surface data can be captured with 0.1µm resolution. Offers place-and-press interface partnered with HDR scanning to capture accurate data on glossy or matte surfaces. HDR algorithm automatically determines optimum lighting conditions, adjusting brightness and focus. Surfaces can be scanned in as little as 1 sec. Can perform pass/fail inspections and compare data to CAD file or other part scans.
Keyence
Technical Abstracts
In Case You Missed It
Additive Manufacturing
“Improved Modeling of Kinematics-Induced Geometric Variations in Extrusion-Based Additive Manufacturing Through Between-Printer Transfer Learning”

Authors: Jie Ren, et al.

Abstract: The authors deal with the challenge by establishing a mathematical model that quantifies the printing width variations along the printing paths induced by printing speed and acceleration. The model provides vital information for predicting infill pattern nonuniformity and potentially enables using G-code adjustment to compensate for the infill errors in future research. In addition, since the model captures the mechanism of kinematics-induced variations, it provides a way of between-printer knowledge transfer on estimating printing errors. This article further proposes an informative-prior-based transfer learning algorithm to improve the quality prediction model for a printer with limited historical data by leveraging the shared data from interconnected 3-D printers. A case study based on experiments validated the effectiveness of the proposed methodology. (IEEE Transactions on Automation Science and Engineering, March 2021, https://ieeexplore.ieee.org/document/9380390)

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