PCD&F
Antenova Inpai Cellular Antenna
Inpai SMD cellular antenna is for NB-IoT and CATM on 4G/LTE networks, including telematics. Measures 35mm x 8mm x 3.3mm with a clearance of 35mm x 13mm. Has a slightly smaller footprint than Lucida antenna. Made with high-grade dielectric constant laminate substrates.
Antenova
atg Luther Maelzer A9L Flying Probe
A9L large format flying probe tester handles circuit boards up to 36″ x 26″ (915mm x 660mm). Features eight test heads driven by linear drives for speed of up to 230 measurements/sec. Is said to eliminate limitations due to test point density or fine-pitch contacts down to 35µm and features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/-0.025mΩ, HiPot and latent defect testing.
Mycronic / atg Luther Maelzer
Celus Design Platform with Component Search
Celus Design Platform simplifies and accelerates the design process with automated, AI-driven recommendations of millions of components. Enables assessment of supply chain risks prior to procurement process, ensuring components are available for sourcing.
Automates component search and schematic generation, enabling quicker, more accurate designs and capturing all requirements. Proprietary AI algorithms then analyze specs and capabilities of available components to offer guided suggestions. A detailed component view emphasizes where components are used and provides list of alternatives accessible by clicking on manufacturer parts number or descriptor in bill of materials (BoM).
Celus
FlexLink 1-LV-S and 1-LV-R Laser Markers
1-LV-S and 1-LV-R laser markers offer precise, high-speed and contact-free laser marking. Suitable for different production requirements, with 1-LV-S for single-sided board marking and 1-LV-R featuring inverter capabilities for dual-sided applications. Apply permanent, high-contrast markings on PCB surfaces, including all typical content types such as text, logos, barcodes, serial numbers and 2D codes, to support traceability and identification requirements. Feature an FOV area of up to 120mm x 120mm (4.72″ x 4.72″). Include antistatic edge belts, programmable motorized width adjustment and a dual-camera vision system for fiducial recognition and code verification. Adjustable marking position and a programmable board stop system ensure precise alignment, even when PCB has cutouts at leading edge. Enables faster programming and has advanced functionalities to accelerate code verification and reduce cycle times. Come with a 24″ touchscreen.
FlexLink
Harwin Kontrol BBi SMT Interconnects
Kontrol range of board-to-board interconnects (BBi) now come in single-row SMT connectors and cable assemblies featuring a 1.27mm pitch (0.05″). Are designed to bridge gap between high-end connectors and traditional pin header and sockets, offering flexibility and performance for a range of applications.
Come in vertical (male only) or horizontal (male and female) mounting options, with full shrouding and recessed contacts to prevent damage to the pins. Are polarized to prevent mismating, and feature a tolerance to misalignment, with a permissible linear misalignment of up to 0.075mm and an allowable misalignment angle of 4.3°.
Have current rating of 1.2A per contact and 25mΩ contact resistance. Are qualified for up to 500 mating operations, operated across a 170°C temperature range (-55° to +125°C, board-to-board / –20° to 105°C cable-to-board and cable-to-cable) and have been tested to withstand vibration forces of 20G for up to 12 hr. Come in tape-and-reel packaging for automated assembly processes, with disposable pick-and-place caps included where needed.
Harwin
KiCad 9.0.0 ECAD
KiCad 9.0.0 ECAD tool now features predefined sets of jobs: for example, plotting, exporting and running design rule checks (DRC) on schematics and PCBs. Independent jobset files are reusable. Implements embedding various elements in schematics, PCB layouts, footprints and symbols that were previously linked to external files, for creating fully self-contained KiCad files that do not rely on external files such as fonts or 3-D models. Allows grouping of various symbols and footprints into classes that can have specific design rules applied.
KiCad
Kyocera AVX 9258-100 Series BtB Compression Contacts
9258-100 Series spring-finger board-to-board compression contacts provide full connector functionality in a miniature, low-profile, single-contact form factor that supports flexible PCB placement. High-strength, UL-approved copper alloy contacts come with three deflected height profiles spanning 1.0mm to 3.75mm to maximize application suitability and up to 0.4µm of gold plating for signal integrity, reliability and durability. Are said to withstand up to 50g of shock, 2.7g of random vibration and 2,500 mating cycles. Come in tape-and-reel for SMT assembly. Rated for up to 6A, 600VACRMS or the DC equivalent, and operating temperatures extending from -40° to +125°C. Applications include rugged, industrial handheld and portable devices, board-to-board connections in traditional power or signal applications, and ground connections between PCBs or housings.
Kyocera AVX
Renesas/Altium Renesas 365 ECAD
Renesas 365, powered by Altium, streamlines electronics system development from silicon selection to system lifecycle management. Is built on Altium 365 platform, and is said to eliminate inefficiencies, connect teams, enable solution discovery and ensure digital continuity.
Connects Altium’s advanced cloud platform with Renesas’ comprehensive embedded compute, analog & connectivity and power portfolio. By integrating hardware, software and lifecycle data into a single digital environment, it streamlines workflows, accelerates time to market, ensures digital traceability and real-time insights, and improves decision-making from concept to deployment.
Is said to ensure every silicon component is application-ready and optimized for software-defined products. Enables searches for components and complete solutions from Renesas’ portfolio. Multidisciplinary cloud-based development environment ensures real-time collaboration across hardware, software and mechanical teams. AI-ready development tools.
Renesas / Altium
Rogers RO4830 Plus Laminate
RO4830 Plus circuit materials are for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors. Woven glass-free thermoset laminates have a dielectric constant of approximately 3.03 at 77GHz (microstrip differential phase length method) and insertion loss of 1.5dB/inch for 5 mil laminates, as measured by the microstrip differential phase length method. Are engineered for the cap layer on FR-4 multilayer board designs. These thermoset laminates are free of woven glass, contributing to laser drilling performance and CAF resistance. Can be fabricated using standard FR-4 processes and are compatible with RO4400 bond ply. Are PFAS-free, UL-V0 and lead-free solder process-compatible.
Come in dielectric thicknesses of 0.005, and standard panel sizes of 18″x24″ (610x457mm), 20″x24″ (610x508mm), and 21″x24″ (610x533mm) with 0.5oz. (18µm) low profile electrodeposited copper (VLP ED).
Rogers Corp.
Stackpole RNCE Resistors
RNCE thin film resistors are said to withstand higher temperatures, high-moisture and high-sulfur environments, with exceptionally low changes in resistance over their functional lifetime. Feature a proprietary alloy said to be more resistant to moisture corrosion and has long-term stability, as well as a structure and materials that withstand sulfur and temperature extremes. Operates at temperatures up to 175°C and has full power operation up to 85°C, for use in a range of precision applications where standard thin film resistors cannot be used. Come in sizes from 0402 through 1206, in tolerances as low as 0.05% and TCRs of 25 and 50ppm. Feature resistance shifts of less than 0.1% for industry standard tests such as load life, temperature cycling, biased humidity and short time overload.
Stackpole Electronics
Ucamco Integr8tor Nexus
Integr8tor Nexus v2024.11 features embedded Elea Image server, which offers high-res, dynamic display of DPF data residing on a server in a browser-based user interface on a client, and Elea command server, which enhances Workflow Engine Elea with CAM-like functionality, allowing real-time modifications of DPF data directly on the server. Also includes Elea Web Components, a collection of graphical widgets for browser-based interfaces that encapsulate a specific aspect of job information and creates dynamic mini-applications tailored to handle specific subtasks. Allows online viewing of job data generated during an Integr8tor Nexus run and provides extensive browser-based capabilities for reviewing job data and analysis results, respectively, along with an array of enhancements and extensions to data analysis and reporting tools.
Ucamco
Ucamco UcamX v2024.11
UcamX v2024.11 allows users to easily view all object and aperture attributes in a layer, and achieve a specific panel copper density by filling it with the PCB image. Also includes ability to quickly view all negative objects on a layer without selections, snap the center of the enclosing box of selected objects, indicate if a newer version for all features is in the license, select micrometer as unit, access a new entry in settings.xml with a minimum via diameter and adapt the negative background for Codes in PanelPlus to the text length.
Ucamco
Ventec VT-47LT Prepreg
VT-47LT low-CTE prepreg for HDI is classified as IPC-4101/126 prepreg, avoiding the need for requalification of alternative IPC-4101 grades. Offers best-in-class z-axis CTE. The low-CTE epoxy slashes thermal expansion mismatches, easing stress on microvia structures.
Ventec
Vishay W1HV MLCCs
VJ….W1HV series surface-mount high voltage multilayer ceramic chip capacitors come in case sizes ranging from 1206 to 2225. For use as input filtering, output filtering, and snubber capacitors for alternative and conventional energy generation, distribution, metering, management and storage. Applications include industrial automation (motor drives, power tools and welding equipment); consumer appliances (telecom mobile and fixed infrastructure); medical instrumentation. With C0G (NP0) dielectric, offer voltages to 3000VDC, capacitance values from 1.5pF to 82nF and a temperature coefficient of capacitance (TCC) of 0ppm/°C ±30ppm/°C from -55° to +125°C. X7R devices provide capacitance from 100pF to 100nF, voltages to 2000VDC and TCC of ±15% from -55° to +125°C. Feature a nickel barrier with 100% tin terminations and is available with polymer terminations for additional protection against board flexure damage. Are RoHS-compliant, halogen-free and Vishay Green.
Vishay Intertechnology
CA
Accu-Assembly AccuCart Smart Rack
AccuCart Smart Rack for Feeders manages feeder management and inventory tracking in surface mount technology (SMT) assembly environments. Offers native support for Fuji and Yamaha feeders, using the feeder’s electronic ID to automatically identify reel and part number currently loaded, eliminating need for manual scanning or human intervention. Seamless integration with placement machine databases ensures accurate, up-to-the-minute inventory control. Pick-to-Light system illuminates exact feeder location when part number is requested via tablet or PC. Intuitive system reduces search time, enhances picking accuracy and accelerates line changeovers. For high-mix, low-to-mid volume production environments.
Accu-Assembly Inc.
Cybord Real-Time Interception (RTI) Tool
Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time. Analyzes bottom view of each component in milliseconds and discards faulty components before placement. Is integrated into Fuji’s NXT III placement machines; other machines pending. Reportedly identifies every type of defect. Is a flexible, drop-in software. Offers analytics and monitoring.
Cybord
Essemtec Fox Ultra Placement Machine
Essemtec Fox Ultra reaches an optimum speed of 31,000cph. Places components from 008004 (0201 metric) up to 109 x 87mm. Full traceability software package comes standard. Feeder density is 180 (120 inline). Feeder solutions include loose component solution, stick feeder, strip feeders, tray changer, bowl feeder and more. Nonstop production feeder changeover allows feeder replacement without interrupting production process. Optional dispensing capable of jetting to an average of 280,000 dots per hour on standard boards and nearly 500,000 dots per hour on BGA patterns. Optional onboard inspection.
Essemtec
Essemtec Puma Ultra Pick-and-Place
Puma Ultra achieves 30,000cph, and places components from 008004 (0201 metric) up to 109 x 87mm. Full traceability software package comes standard. Feeder density is 260 (140 inline), and feeder solutions include loose component solution, stick feeder, strip feeders, tray changer, bowl feeder and more. Nonstop production feeder changeover allows feeder replacement without interrupting production process. Optional dispensing capable of jetting to an average of 280,000 dots per hour on standard boards and nearly 500,000 dots per hour on BGA patterns. Optional onboard inspection.
Essemtec
Indium Heat-Spring HSx TIM
Heat-Spring HSx thermal interface material is designed for large area dies with warpage of 200µm or more. Delivers 16W/m-K thermal conductivity at 20psi, for test heads with clamping forces of 30psi or less. Available in thicknesses from 300µm to 1mm and can be customized with or without a diffusion barrier to prevent die staining.
Indium Corp.
ITW EAE Electrovert Aquastorm 160 Cleaner
Electrovert Aquastorm 160 (AS160) cleaning system comes with Intermix nozzles for exceptional rinse efficiency for delicate or complex PCB assemblies. Versatile 24″ conveyor width accommodates a range of PCB sizes. Patented Torrid Dryer is said to guarantee optimal drying, reduce cycles times and increase throughput. Integration of Checkmate 4.0 enhances product control and precision alignment. Improved chemical isolation reduces chemical consumption for cost savings and environmental sustainability. Supports advanced capabilities like datalogging, CFX and Open Apps, enabling seamless tracking, communication and integration with existing factory systems.
ITW EAE
MicroCare HFE7100 Engineered Fluids
HFE7100 Engineered Fluids are said to be exact replacements for 3M Novec 7100, 7200, and 7300 fluids. Come in 5-gal. and 55-gal, drums, small packages including 1-gal. and liter containers, and convenient aerosols for diverse cleaning applications.
MicroCare
Panasonic Connect NPM-GW Placement Machine
NPM-GW modular placement machine features real-time monitoring, predictive maintenance and enhanced versatility in component handling. FC16 head achieves maximum speed of 104,000cph and placement accuracy of ±25µm. Supports component sizes from 0201 chips to larger packages. Integrates seamlessly with Panasonic’s Autonomous Factory initiative, utilizing AI-driven production planning, 5M (huMan, Machine, Material, Method, Measurement) process control and predictive error correction. Dual conveyor configuration supports long and short PCB configurations. Intelligent Tape Feeders (ITF) and Auto Setting Feeders (ASF) streamline component loading and supply, reducing downtime and enhancing productivity.
Panasonic Connect North America
Takaya APT-2400F/APT-2600FD Series Flying Probe
APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism, sensing technology and user-friendly interface said to reduce the load and improve operator efficiency.
Comes with four heads and six flying probes and contacts extremely small pads on miniaturized PCBs, conducting tests in a short time. Advanced measurement system and range of testing functions reportedly significantly improve test coverage, detect assembly defects and perform failure analysis. Comes in various models for large PCB and automated testing. New intuitive APT Plus Infinity operating system.
Takaya
Texmac
Vision Engineering EVO Cam HALO Microscope
EVO Cam HALO 4K digital microscope features advanced, adaptive illumination and new intelligent software. Includes a Super-Wide Dynamic Range, capturing images with brightness and contrast, and an enhanced illumination package featuring a quadrant light, panel light and white/UV light to optimize illumination for a variety of inspection needs. New intelligent hardware and software automatically detects lenses and adjusts magnification settings and provides intuitive image capture, measurement and analysis tools. Works with 360 Direct/Oblique Viewer, enabling users to inspect details from different angles.
Vision Engineering
Yincae UF 158UL Underfill
UF 158UL underfill is said to fill gaps as small as 10µm, even in 100x100mm chips. Unique formulation cures rapidly at room temperature. Provides protection against thermal stress, moisture, and mechanical shock. Is for a range of applications, including high-performance computing, artificial intelligence, automotive and aerospace.
Yincae
