PCD&F
Circuits Integrated Hellas CI-ONE Ka-Band Integrated Switch Power Amplifiers
CI-ONE Ka-band integrated switch power amplifiers combine a power amplifier and single-pole double-throw RF switch in a surface-mount module for satellite communication, aerospace, radar and 5G/6G applications. Built on GaAs pHEMT technology, operate from a 6V supply and support output power levels of 30dBm, 34dBm and 36dBm for 1W, 2W and 4W architectures. Provide switching speeds of 5ns and approximately 22% efficiency at the 1dB compression point. Reduce component count, simplify RF routing and lower thermal complexity in Ka-band front-end designs. Integrated architecture reduces module size by approximately three times compared to discrete implementations.
Circuits Integrated Hellas
KiCad v. 10.0 PCB Layout Tool
KiCad version 10.0 PCB design software introduces updates for schematic capture, PCB layout and design workflow management. Supports design variants, lasso selection and customizable toolbars, along with import capabilities for Allegro, Pads and gEDA formats. PCB design enhancements include time-domain track tuning, graphical design rule editing and expanded design block functionality. Adds support for inner-layer objects in footprints, pin and gate swap, and improved DRC workflows. Library updates include STEP-based 3D models and expanded symbol, footprint and model libraries. Designed to support complex PCB design workflows and improve usability, performance and interoperability across electronics design environments.
KiCad
Octopart Discover Platform
Discover platform supports electronics component discovery by linking system intent, functional blocks and design constraints to component evaluation during early-stage development. Enables engineers to move beyond part-number search by maintaining system context across component selection and comparison. Retains constraints and architecture decisions throughout the evaluation process, allowing updates without restarting workflows. Integrates with CAD, PLM and partner data environments to align system-level design decisions with available component options. Intended for early-stage design exploration where cost, performance and reliability parameters are established.
Octopart
Siemens Fuse EDA AI Agent
Fuse EDA AI Agent is an autonomous workflow orchestration system for semiconductor, 3-D IC and PCB design across the EDA lifecycle. Coordinates multi-tool workflows spanning design, verification and manufacturing signoff, including RTL development, testbench generation, place-and-route and timing analysis. Built on a retrieval-augmented framework with multimodal data support and domain-specific parsers for design formats. Integrates with Siemens EDA tools including Xpedition and HyperLynx, as well as third-party platforms through Model Context Protocol orchestration. Supports hierarchical agent coordination, dynamic tool discovery and automated recovery loops for complex workflows.
Siemens
Stackpole MCJ Series Resistors
MCJ series jumper chip resistors use solid metal element construction to support low resistance and high current capacity in surface-mount formats. Support current ratings from 8A in 0201 size to 122A in 2512, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited by lower current ratings. Available in 0201, 0402, 0805, 1206 and 2512 sizes, with select sizes AEC-compliant for automotive use.
Stackpole Electronics
Stackpole TNC Series NTC Thermistors
TNC series thick-film NTC thermistors support temperature sensing and control applications in compact surface-mount formats. Use thick-film construction to improve mechanical robustness and reduce susceptibility to cracking compared to multilayer designs. Come in 0402, 0603 and 0805 sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Support operating temperatures up to 150°C and provide fast thermal response for automotive, battery monitoring, industrial and medical applications.
Stackpole Electronics
Umicore Auruna 8000 Gold-Iron Electrolyte
Auruna 8000 gold-iron electrolyte supports high-speed and brush plating applications using a nickel- and cobalt-free process. Produces coatings with approximately 99.7% gold and 0.3% iron, achieving hardness around 130HV and meeting ASTM B-488-01 Type I, Code C requirements. Operates at 45–65°C with pH range of 4.2–4.6 and supports plating speeds of approximately 8µm/min. Designed for applications requiring wear resistance and low porosity in technical gold plating.
Umicore
VPF 630900-1001-801 Polyimide Adhesive Material
630900-1001-801 polyimide adhesive material is designed for high-temperature PCB marking applications exposed to soldering and aggressive cleaning processes. Features 50µm polyimide base film with 20µm white silk-matte coating for thermal transfer printing of codes and variable data. Uses acrylate adhesive 801 for bonding to PCBs with a white glassine liner. Withstands short-term temperatures up to 300°C and resists soldering cycles and cleaning agents. Available from 200m² with 1,000mm working width; narrow roll formats available on request.
VPF
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CA
Boardera PCB Project Analyzer API
PCB project analyzer API automates fabrication analysis, BoM processing, assembly planning and project pricing for electronics manufacturing workflows. Extracts fabrication data including layer stackup, board dimensions, copper area, drill data and pad features from design files. BoM tools map component data, generate procurement links, assess availability and end-of-life risk and flag RoHS and REACH compliance. Assembly planning functions calculate part counts, placement volumes and package classifications. Pricing modules support PCB-only, assembly-only and turnkey configurations aligned to fabrication and EMS processes. Integrates with manufacturer systems to support design analysis, quoting and production planning.
Boardera Software
COT Samsung Nozzle
Custom Samsung nozzle 2026-5654 supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 platforms. Features a Samsung-style nozzle base with standard reflector for machine recognition and a 4.5mm×4.5mm plastic tip matched to LED geometry. Tip design supports stable vacuum pickup while protecting sensitive LED surfaces during high-speed placement. Intended for SMT applications requiring handling of nonstandard component shapes.
Count On Tools
COT Mydata Midas Tool
Mydata Midas tool 2026-5652 supports placement of N61381US components in SMT assembly processes. Features 0.125″ outside diameter and 0.047″ inside diameter with a 90° V-cut profile for component alignment and seating. Pinned to D121 to maintain positioning consistency during pick-and-place operations. Geometry supports stable handling and consistent vacuum performance for automated assembly of nonstandard components.
Count On Tools
FabSpace AI EMS Marketplace Platform
EMS marketplace platform supports PCB assembly sourcing through AI-driven quote comparison and project tracking. Enables RFQ submission and evaluation of cost, lead time, certifications and supplier performance across pre-vetted EMS providers. Supports centralized quote management, real-time production tracking and communication with manufacturing partners. Platform structure enables credential-based supplier selection to improve sourcing transparency and reduce procurement risk.
FabSpace AI
Magnalytix OE in a Box Reliability Test Kit
OE in a Box reliability testing kit packages materials required to generate J-STD-001 objective evidence reports for electronics manufacturing. Includes B-52 Legacy 2 test cards, taped components, stencil, ESD bags and related materials for surface insulation resistance test preparation. Provides return logistics for completed boards to support third-party validation. Designed to streamline reliability testing workflows and compliance documentation.
Magnalytix
Saelig Rigol DNA5000, DNA6000 Series VNAs
DNA5000 and DNA6000 series vector network analyzers support RF and microwave testing from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations for analysis of filters, antennas, cables and high-speed interconnects. Provide dynamic range up to 127dB with low trace noise for stable measurement performance. Include fixture removal and de-embedding functions for direct S-parameter analysis. Built-in tools support SWR measurement, Smith chart display and time domain reflectometry. Support HDMI, LAN, USB and GPIB connectivity for integration with automated test systems.
Saelig Company
SolderKing SAC0307 Solder Paste
SAC0307 solder paste extends the SK P2-5 range with a low-silver alloy option for SMT assembly. Supports alternative alloy evaluation without changing flux chemistry or process settings. Designed for stencil printing and wetting across OSP, ENIG, immersion silver, tin and HASL finishes. Flux formulation reduces voiding and head-in-pillow defects with minimal residue after reflow. Complies with J-STD-004B and Bellcore ECM requirements. Comes in Type 4 and Type 5 powder sizes with extended tack and open times exceeding three days.
SolderKing Assembly Materials
TopLine Custom Extra-Large Format BGA Packages
Custom extra-large format BGA packages support high I/O-count applications with footprints up to 100mm×100mm. Provide increased ball-grid density for designs requiring expanded interconnect areas. Support integration of higher signal counts while maintaining compatibility with standard BGA structures. Intended for advanced electronic assemblies requiring nonstandard package dimensions.
TopLine Corp.
Yamaha Print Param Decision Assist Software
Print Param Decision Assist software analyzes PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction. Evaluates board dimensions, component types, solder paste, stencil thickness and aperture geometry to calculate pressure, speed, squeegee angle and cleaning intervals. Integrated into YSUP-PG within Yamaha’s YSUP intelligent factory platform. Supports parameter verification and setup optimization for stencil printing processes.
Yamaha Robotics
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