In Case You Missed It
Additive Manufacturing
“A Novel Method of Incorporating CNT into Additive Manufacturing Electronics Dielectric Material”
Authors: Daniel Slep and Fan Yang
Abstract: Flexible hybrid electronics parts that are additively manufactured offer greater flexibility in geometry, complexity, and variety or customizability. In this work, UV-curable dielectric materials for additive electronics and incorporated carbon nanotubes (CNTs) within a formulated UV/LED curable matrix were used. It is shown that inkjet printing CNT mixture in specific manner with a commercial UV-curable dielectric improves mechanical and thermal properties of the final dielectric compared to the dielectric without the CNT mixture, including a significant decrease in coefficient of thermal expansion, while keeping excellent electrical properties. (Journal of Surface Mount Technology, July 2024, https://doi.org/10.37665/5ng0w157)
Quantum Computing
“Time-tronics: From Temporal Printed Circuit Board to Quantum Computer”
Authors: Krzysztof Giergiel, et. al.
Abstract: Time crystalline structures can be created in periodically driven systems. They are temporal lattices which can reveal different condensed matter behaviors ranging from Anderson localization in time to temporal analogues of many-body localization or topological insulators. The potential practical applications of time crystalline structures have yet to be explored, however. Here, the authors pave the way for time-tronics where temporal lattices are like printed circuit boards for realization of a broad range of quantum devices. The elements of these devices can correspond to structures of dimensions higher than three and can be arbitrarily connected and reconfigured at any moment. Moreover, the authors’ approach allows construction of a quantum computer, enabling quantum gate operations for all possible pairs of qubits. The authors’ findings indicate that the limitations faced in building devices using conventional spatial crystals can be overcome by adopting crystalline structures in time. (arXiv, June 2024, https://doi.org/10.48550/arxiv.2406.06387)
Reverse Engineering
“Synthetic Data for Semantic Segmentation: A Path to Reverse Engineering in Printed Circuit Boards”
Authors: Adrian Phoulady, et. al.
Abstract: The authors present an innovative solution to the challenge of part obsolescence in microelectronics, focusing on the semantic segmentation of PCB x-ray images using deep learning. Addressing the scarcity of annotated datasets, the authors developed a novel method to synthesize x-ray images of PCBs, employing virtual images with predefined geometries and inherent labeling to eliminate the need for manual annotation. The authors’ approach involves creating realistic synthetic images that mimic actual x-ray projections, enhanced by incorporating noise profiles derived from real x-ray images. Two deep learning networks, based on the U-Net architecture with a VGG-16 backbone, were trained exclusively on these synthetic datasets to segment PCB junctions and traces. The results demonstrate the effectiveness of this synthetic data-driven approach, with the networks achieving high Jaccard indices on real PCB x-ray images. This study not only offers a scalable and cost-effective alternative for dataset generation in microelectronics but also highlights the potential of synthetic data in training models for complex image analysis tasks, suggesting broad applications in various domains where data scarcity is a concern. (Electronics, June 2024, https://doi.org/10.3390/electronics13122353)
Wearable Electronics
“Permeable, Three-Dimensional Integrated Electronic Skins with Stretchable Hybrid Liquid Metal Solders”
Authors: Qiuna Zhuang, et. al.
Abstract: The development of wearable and on-skin electronics requires high-density stretchable electronic systems that can conform to soft tissue, operate continuously and provide long-term biocompatibility. Most stretchable electronic systems have low-density integration and are wired with external printed circuit boards, which limits functionality, deteriorates user experience and impedes long-term usability. Here, the authors report an intrinsically permeable, 3-D integrated electronic skin. The system combines high-density inorganic electronic components with organic stretchable fibrous substrates using 3-D patterned, multilayered liquid metal circuits and stretchable hybrid liquid metal solder. The electronic skin exhibits high softness, durability, fabric-like permeability to air and moisture and sufficient biocompatibility for on-skin attachment for a week. The authors use the platform to create wireless, battery-powered and battery-free skin-attached bioelectronic systems that offer complex system-level functions, including the stable sensing of biosignals, signal processing and analysis, electrostimulation and wireless communication. (Nature Electronics, July 2024, https://doi.org/10.1038/s41928-024-01189-x)
