PCD&F
AllSpice Actions Automation Engine
Allspice Actions enables hardware teams to automate manual checks, validations and releases of electronics designs. Provides framework to build workflows that run tests automatically. Automates almost any manual steps a hardware engineer faces, such as verifying library parts, checking for design errors and packaging releases. Common use cases include generating bill of materials artifacts, automating static checks and reviews, checking part availability, calculating cost of goods sold and verifying parts in APL.
AllSpice
Altair HyperWorks 2024 Simulation
HyperWorks 2024 design and simulation software delivers significant advancements in AI-powered engineering and business, mechanical and electronics systems design, and simulation-driven design and optimization. Deepens AI capabilities, accelerates design exploration and iterations with generative design capabilities in Altair HyperMesh, conducts thermal analysis in Altair SimLab through “what-if” studies using real-world data from Altair physicsAI models to make design of experiments more efficient, rapidly predicts behavior with generative design in Altair Inspire to maximize efficiency in both design and manufacturing while ensuring performance, and improves training times.
Altair
Hirose BM54 Series Connector
BM54 series board-to-board connector features the world’s smallest width class for its category and is for use in automotive applications. Has a small form factor, a 0.4mm pitch, and a stacking height of 3-4.5mm. Is for PCBs with multiple connector sets and offers a wide floating range of ±0.4mm in the x-y direction. Features a two-point contact design to ensure contact reliability and rugged performance in harsh automotive conditions. Has a heat resistance of 125°C, supports PCI-ex Gen4 (16Gbps) and MIPI D-PHY Ver. 2.1 and is said to be suitable for automotive front cameras, rear/side cameras, displays, millimeter wave radar, and LiDAR systems.
Hirose
Siemens Innovator3D IC Package Analysis
Innovator3D IC provides a consolidated cockpit for constructing a digital twin, featuring a unified data model for design planning, prototyping and predictive analysis of the complete semiconductor package assembly. Unifies power, signal, thermal and mechanical stress analysis tools to enable “what-if” exploration while identifying, avoiding and solving challenges prior to detailed design implementation. Is integrated with Xcelerator portfolio but has open architecture that supports integration with third-party point solutions. Supports industry standard formats such as 3Dblox, LEF/DEF, Oasis and interface IP protocols (such as UCIe and BoW). Is capable of planning and prototyping all leading and emerging semiconductor integration methodologies and platforms including interposers (organic, silicon or glass), ABF build-up, RDL based with chips first or last including support for Deca Technologies adaptive patterning process. Is also certified for panel-level packaging (PLP), embedded or raised silicon bridges as well as system-in-package (SiP) and modules.
Siemens Digital Industries Software
Stackpole CSFA SMD Jumpers
CSFA series automotive-grade high-current SMD jumpers are capable of handling currents up to 70.7A with overload current ratings reaching up to 158A. Is suitable for a range of high-current applications, providing enhanced reliability and reduced sensitivity to surge current events, and is AEC-Q200 qualified, anti-sulfur per EIA-977 and RoHS-compliant without exemption.
Stackpole Electronics
Stackpole HVCR Chip Resistors
HVCR is a high-precision, low-VCR chip resistor with high stability. Is 100% screened to ensure VCR is within spec, and is available in resistance values from 10M and 100M, with precise VCR of less than -5ppm for the 1206 size and less than -2 ppm for the 2512 size.
Stackpole Electronics
Ucamco Integr8tor v2024.06 Pre-CAM
Integr8tor v2024.06 includes extended QED Copper Areas section for top and bottom, extended Drill Tools section with a wall (or barrel surface) area for each tool individually, improved via-in-pad paste layer analysis, a QED section listing copper clearance information based on layer netlist rather than job netlist, and minimum clearance legend to pad for solder mask-defined pads. Also features checkpoint unit conversion, archive contents exclusion, reuse of incoming ODB++ pad type information, and configurable step names for DPMX import and ODB++ export.
Ucamco
Ucamco UcamX v2024.06 CAM
UcamX v2024.06 now features the ability for a visual check before clipping, get a copper coverage percentage by filling with tracks, and calculate copper areas for all sub jobs. Also features ATG Output that supports data sets with up to 150 layers, a new feature to edit contour text, new extended view options, extended Board Analyzer by count of drilled slot, and Gerber X2/X3 output now fully supports layer, aperture and object attributes.
Ucamco
Würth 2-Channel Digital Isolator
Digital isolators series now features a two-channel version in a SOIC 8WB package (5.85 x 11.5 x 2.8mm). Has an isolation voltage of 5kVRMS, which is important for devices operating in environments exposed to high voltages and EMC interference. Is suited for applications up to a data rate of 150Mbps and features high common mode transient immunity (CMTI) to system noise of ±150kV/µs.
Würth Elektronik
CA
Indium Au-Based Precision Die-Attach Preforms
Indium’s high-reliability gold-based PDA preforms offer a high level of precision to reduce defects, control bondline thickness, and deliver high-yield performance and reliability in critical die-attach applications. Features include highly accurate thickness control, precise edge quality, optimized cleanliness, and default waffle pack method. Are available in the following alloys: primary – 80Au/20Sn, 79Au/21Sn; development – 78Au/22Sn, 77Au/23Sn, 76Au/24Sn, 75Au/25Sn, 88Au/12Ge, 96.8Au/3.2Si, 82Au/18In.
Indium Corp.
Indium PicoShot NC-6M Solder Paste
PicoShot NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector. Is chemically compatible with Indium8.9HF series of solder pastes and is said to have been extensively tested to provide fine-dot jetting performance. Delivers dot volume of 1.6nl/dot, 230µm diameter, precision deposit (x,y targeting), long usage (stencil life more than 8 hr.), and minimal satellites.
Indium Corp.
Kyocera AVX KAM Series Automotive MLCCs
KAM Series automotive MLCCs now include 20 new components. Come in extensive range of case sizes, capacitance values and voltage ratings optimized for use in small, densely packed automotive circuits with fast processing speeds. Are compliant with AEC-Q200 Stress Test Qualification for Passive Components standard, manufactured in IATF, QS9000, and VDA 6.4-approved facilities, and tested in quality assurance laboratories using methods such as 100% visual inspection, increased sampling for accelerated wave soldering, and lot-by-lot reliability testing. Are RoHS-compliant and designed to be operated below the rated voltage. Come in four case sizes (0201, 0402, 0603, and 0805) with thicknesses extending from 0.33mm to 1.45mm, NiSn terminations, two dielectrics (X7R and X7T), four voltage ratings (4, 6.3, 10, and 16V), capacitance values extending from 0.1–22µF (±10%), and 7″ reels loaded with paper or embossed plastic tape.
Kyocera AVX
Master Bond Supreme 11AOHTLP Epoxy
Supreme 11AOHTLP is a two-component epoxy featuring thermal conductivity and electrical insulation. Features a working life of 60-90 min. at room temperature for a 100g batch, making it suited for demanding situations where more time for fixturing is needed. Has reliable electrical insulation properties with a volume resistivity exceeding 1014ohm-cm at 75°F. Also exhibits thermal conductivity of 3-5BTU·in/(ft²·hr·°F) [0.5-0.7W/m/K]. Provides high bond strength properties with a lap shear strength of 3,200-3,400psi, tensile strength of 7,000-8,000psi, compressive strength of 20,000-22,000psi and T-peel strength of 15-20pli. Is designed to withstand thermal cycling and offers a wide service temperature range from -112° to +400°F (-80° to 204°C). Cures at room temperature in two to three days, and faster with heat, in 2-3 hrs. at 200°F. Is said to bond to a wide variety of substrates including metals, ceramics, glass, rubbers, and many plastics.
Master Bond
Mek ISO-Spector S3 SPI
ISO-Spector S3 series of 5-D solder paste inspection systems offers a comprehensive suite of advanced features. Is a progression from the Mek S2 SPI system, utilizing multiple projector technology to calculate solder height information. Uses a 360° ring light to accurately extract the outline of solder paste on PCBs and ensure precise inspections. Z Axis auto-focus technology measures PCB warpage during inspection and automatically adjusts camera height. Offers live SPC data for printing trends and distribution histograms to enable swift diagnosis of printing issues, is fully compatible with the Mek Catch system and facilitates closed-loop integration with stencil printers and pick-and-place machines. Features custom resolution options, plus an adjustable touchscreen that can be moved up to 10° upwards and 25° downwards for ergonomics. Can create inspection programs from Gerber data in as few as 3 min. and uses offline programming software to achieve part number registration using mount data. Accommodates PCBs up to 510 x 510mm, with ample clearance on both top and bottom sides.
Marantz Electronics
