TTM Technologies to Build New Plant in NY

DEWITT, NY – TTM Technologies has announced plans to build a PCB manufacturing facility in upstate New York with an investment of up to $130 million over the next three years.

The proposed facility will be located next to TTM’s existing facility on a 24-acre property off Kirkville Road in DeWitt and will either match or exceed that plant’s 160,000 square-foot size, TTM said in a release.

The company said the plant will produce high-density interconnected printed circuit boards that will support national security requirements and is expected to create 400 “good-paying” manufacturing and engineering jobs.

The PCBs will primarily be used for US military applications and are critical to the U.S. semiconductor industry, which powers everything from data centers to the power grid to aerospace engineering, Sen. Chuck Schumer said in a statement.

“A global chipmaking hub is rising in Central New York,” Gov. Kathy Hochul said in a statement. “Companies like TTM are helping to strengthen New York’s reputation as a leader for growth, innovation, and national security.”

Groundbreaking on the site is expected in the first half of 2024, and additional expansion is also being considered for future phases of development, TTM said.

All Flex Solutions Acquires Facility in Minneapolis

NORTHFIELD, MN – All Flex Solutions plans to build a new flexible circuit manufacturing plant in a recently acquired building in Minneapolis.

The planned manufacturing plant will increase the company’s capacity to manufacture flexible circuits, flexible heaters, and CatheterFlex circuits – the company’s newest product line.

“We are initiating an acceleration this year,” said Kevin Jackson, president and CEO, All Flex Solutions. “Last year we focused on the merger of All Flex Flexible Circuits and Printed Circuits and the integration of two strong teams. Now, with a united All Flex Solutions team poised for growth, we look forward to this expansion.”

The new facility will also accommodate plating and final finishing processes, including ENIG, ENEPIG, EPIG, and hot air solder leveling (HASL), which are currently housed in a nearby facility. The move of these operations along with the new property buildout opens additional manufacturing capacity for the assembly of flexible circuits, rigid-flex circuits and flexible heaters, and CatheterFlex circuits, the company said.

“The investments we’re making now in capacity and technology will accelerate our throughput at higher yields and with greater technical capability than we’ve ever had,” added Jackson. “We are excited about the many ways this increased capacity will help us serve our customers in the years to come.”

DoD Awards $40M to Calumet Electronics for HDBU PCBs

WASHINGTON – The US Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics to enhance capabilities to produce high-density build-up (HDBU) substrates, which include high-density interconnect printed circuit board (PrCB) cores and HDBU build-up layers.

“The Biden Administration has prioritized the need to support and advance the domestic PrCB and advanced packaging industrial base,” said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. “These technologies are critical for modern weapons systems and will contribute to maintaining our warfighting edge over potential adversaries.”

The award will enable Calumet to scale up engineering, tooling, and manufacturing operations to establish domestic production capabilities for HDBU substrates. HDBU substrates and advanced packaging are critical enabling technologies for sixth generation systems and applications, including for radar, electronic warfare, processing, and communications. The company is located in Calumet, MI.

In calendar 2023, the DPAI Program has made 22 awards totaling $714 million. DPAI is overseen by the ASD(IBP)’s Manufacturing Capability Expansion and Investment Program (MCEIP), in the Office of the Deputy Assistant Secretary of Defense for Industrial Base Resilience. For more information on MCEIP, visit: https://www.businessdefense.gov/ibr/mceip/index.html.

Shennan Circuits to Build PCB Plant in Thailand

SHENZHEN – The board of directors of Shennan Circuits has unanimously approved a major investment to build a printed circuit board fabrication facility in Thailand.

The company, through its subsidiary Oboten Co., plans to spend up to RMB1.27 billion ($183 million) toward the new site in the Rojana Industrial Park in Ayutthaya.

Shenzhen-headquartered Shennan was founded in 1984 and has manufacturing facilities in Shenzhen, Wuxi and Nantong, Jiangsu, China.

About 40% of Shennan’s PCB revenue comes from customers outside China, a figure the company aims to increase.

SP Manufacturing Expands Design Centers to US

SAN DIEGO – SP Manufacturing, a provider of electronics manufacturing services for mission-critical industries, has opened a design and development center here, the company announced.

The center will focus on providing engineering and development services for SP Manufacturing’s global customers. Services provided include product conceptualization, product design and engineering, prototyping, early supplier involvement, NPI, DFx and design for manufacturing, supply chain planning, and transition to mass production.

The company’s applications include industrial, medical devices, automotive and IIoT.

The center is led by a veteran engineering team with over 20 years of experience.

“With the capabilities and location of its new center, SP Manufacturing can collaborate more closely than ever with customers onshore in the United States, and support the entire product lifecycle from design to mass production at its global manufacturing sites in Indonesia, Malaysia, China, Germany and Poland,” the company said in a press release.

“We’re delighted to expand into the United States, where so many of our leading customers are located. Our new Design and Development Center allows us to collaborate with customers more closely than ever, providing onshore services and support for customers that must operate at unfailing standards of technical performance and delivery,” said Jackson Tan, global business development director, SP Manufacturing.

Philip Ong, CEO, SP Manufacturing, said: “We’re happy to unlock the next evolution of SP Manufacturing as a global manufacturing platform for mission-critical industries. We can now deliver our manufacturing expertise in medical, industrial and automotive electronics manufacturing across the entire product lifecycle, around the world.”

SP Manufacturing has mass production sites in Southeast Asia, China and Europe.

NCAB Group Acquires Spain’s Electronic Advanced Circuits

STOCKHOLM – NCAB Group has signed an agreement to acquire 100% of the shares in Electronic Advanced Circuits based in Madrid.

NCAB will pay SEK14 million ($1.25 million) with a potential earnout capped at a maximum amount of SEK4 million ($358,000). The transaction is scheduled to close in November.

Electronic Advanced Circuits expects net sales of SEK 19 million ($1.7 million) in 2023 with an estimated EBITA margin of about 15%. The company has two employees. The majority of sales comes from the telecom and industrial sectors and sourcing is made from manufacturing partners in China.

NCAB Spain had 13 employees and sales of SEK75 million ($6.7 million) in 2022. The acquisition is expected to be accretive to earnings in 2024. Synergies are expected in the areas of suppliers, payment terms and logistics.

NCAB Group is also establishing an entity in Portugal, NCAB Group Portugal, and two new employees have been recruited, both with extensive experience in the PCB industry.

In a statement, Benjamin Klingenberg, vice president, NCAB Europe, said: “With these two strategic actions, we gain highly skilled and experienced personnel, who will complement our existing capabilities and play a pivotal role in unlocking new growth opportunities and expanding our networks. We are taking steps forward in our expansion plans in Spain and Portugal. The Iberian Peninsula is of growing interest for the electronics market in Europe.”

EPA Seeks to Fine Fab for Alleged CWA Reporting Violation

WASHINGTON – The US Environmental Protection Agency on Nov. 9 issued notice of a proposed administrative penalty assessment for alleged violations of the Clean Water Act at a printed circuit board fabricator in upstate New York.

The complaint addresses violations of the general pretreatment regulations found at Standard Printed Circuits’ facility in Sherburne, NY. According to the complaint, Standard Printed Circuits failed to comply with reporting requirements in accordance with 40 C.F.R. § 403.12(e).

EPA is seeking a proposed penalty of $10,000. EPA has provided the respondent with a settlement offer of $2,000 in an effort to promptly settle this matter.

EPA is also providing notice of opportunity to comment on the proposed administrative complaint filed on Oct. 25 with the Regional Hearing Clerk.

Under 33 U.S.C. § 1319(g), EPA is authorized to issue orders assessing civil penalties for various violations of the CWA. EPA may issue such orders after the commencement of a Class I or Class II penalty proceeding. EPA provides public notice of the proposed assessment pursuant to 33 U.S.C. § 1319(g)(4)(A) and 40 C.F.R. § 22.45.

The deadline for submitting public comment on this administrative penalty proceeding is 40 days after issuance of the public notice.

Skychem Building Production Facility in Thailand

ZHUHAI, CHINA – Skychem Technology is planning a CNY100 million ($13.8 million) production plant in Thailand to establish overseas capacity and expand abroad.

The maker of electronic chemicals said nearly 30 companies based in the Chinese mainland, Taiwan and Japan have moved their printed circuit board factories to Thailand in recent years, and most are Skychem’s clients or potential customers.

The Zhuhai-based firm said overseas business would focus on Thailand and cover SE Asian regions including Malaysia and Vietnam.

Kaynes Technology to Build PCB Fab Facility in India

MYSURU, INDIA – Kaynes Technology will invest Rs 750 crore ($90 million) for a bare board printed circuit board plant here.

Kaynes SemiCon, a Kaynes subsidiary, also announced an investment of Rs 2,850 crore ($342 million) to develop an OSAT (outsourced semiconductor assembly and testing) facility in Hyderabad. The facility will also have an automatic test equipment (ATE) and reliability testing line.

In November, Kaynes held a groundbreaking ceremony for the facility, which will feature 13 lines for OSAT, one for ATE, and one for reliability testing. Additionally, Kaynes SemiCon will invest Rs 83.3 crore ($10 million) in a co-packaged optics research and development facility for Silicon Photonics in Mysuru.

Chinese PCB Fabricator Ordered to Pay $7.6M in Damages to US Distributor

FORT LAUDERDALE, FL – Jiangmen Benlida Printed Circuit Co., a Chinese PCB manufacturer, was ordered to pay US distributor Circuitronix nearly $7.6 million in damages after a federal jury found the company in breach of a distribution agreement.

Federal jurors in Florida found that Benlida exploited Circuitronix (CTX) once it hit rough financial straits, costing the distributor millions of dollars, capping off a years-long legal battle that began with Benlida filing its own breach of contract claims against CTX.

In 2012, Benlida and CTX entered into a manufacturing agreement under which CTX would send circuit board designs to Benlida for manufacturing. The finished products were then sent back to the US for distribution. In June 2021, Benlida accused CTX of skipping out on $13.7 million worth of circuit board invoices. CTX denied Benlida’s claims and countersued, arguing that it was Benlida that owed CTX millions of dollars.

In filings to the court, CTX argued that Benlida demanded advance payments for the circuit boards but failed to properly credit payments to its account. Additionally, Benlida had sent out shipments late, incurring late fee penalties that further spiked its outstanding debt, CTX claimed. Before the jury, CTX’s attorney, Stephen Rosenthal, argued that the debt stemmed from cash flow problems on Benlida’s part, saying the manufacturer had improperly relied on CTX to solve them.

Months before the trial, CTX asked the Florida federal court to dispose of Benlida’s suit, arguing that nearly half of the invoices belonged to an affiliate, Circuitronix (Hong Kong) Ltd. CTX claimed responsibility for the remaining invoices but argued that it had already settled those payments in full.

US District Judge Robert Scola Jr. sided with CTX, agreeing with CTX that it couldn’t be held accountable for services charged by CTX Hong Kong.

Israel Aerospace Industries Files for Integrated Circuit Assembly Patent

LOD, ISRAEL – Israel Aerospace Industries has filed a patent for an integrated circuit assembly featuring a base structure with an interposer board and interfacing dies, and a cap structure with an intermediating board and a panel of active elements.

The cap structure is attached to the base structure, allowing the active elements to be electrically coupled to the interfacing dies. The patent also covers a backend circuit board and a method of fabricating it, as well as an array of such tiles in cascade connection.

The patent application describes an integrated circuit assembly that includes a base structure and a cap structure. The base structure consists of an interposer board and a plurality of interfacing dies that are electrically connected to the interposer board. The cap structure includes an intermediating board and a panel of active elements, which form the top side of the integrated circuit assembly. The active elements are electrically connected to the intermediating board. The cap structure is attached to the base structure in a way that ensures each active element is electrically connected to at least one interfacing die.

The integrated circuit assembly also includes electric wiring and/or contact means that connect the interfacing dies to the interposer board. The interposer board has electrical contactors on one side, which are connected to the interfacing dies through the electrical wiring and/or contact means.

The interfacing dies consist of operating components that control the operation of the active elements. Each group of interfacing dies includes at least one control module that controls the operation of the operating components in that group. There is also a main control unit that controls the operation of all the control modules.

The intermediating board has coupling components that electrically connect each active element to at least one interfacing die. The interposer board and the intermediating board are implemented in wafers, and the interfacing dies and the active elements are connected to their respective wafers through wire bonding.

The method of constructing the integrated circuit assembly involves electrically connecting the interfacing dies to the interposer wafer and the active elements to the intermediating wafer. The cap wafer, which includes the active elements, is then attached to the base wafer, positioning the active elements at the top side of the integrated circuit assembly.

Overall, this patent application describes an integrated circuit assembly that allows for efficient electrical coupling between active elements and interfacing dies, enabling the control and operation of the active elements by the interfacing dies. The construction method outlined in the patent application ensures proper connectivity between the different components of the integrated circuit assembly.

Jabil Opens New Plant in Mexico

CHIHUAHUA, MEXICO – Jabil has opened a new production facility at its site here, with the 250,000 sq. ft. plant joining the two other factories already onsite.

The new plant will play a critical role in supporting Jabil’s customers across the energy, automotive and transportation, healthcare, digital print, and retail industries, the company said in a release.

“We are thrilled to announce the opening of our third manufacturing building in Chihuahua, which reflects our commitment to excellence and innovation in Latin America,” said Victor Brizuela, Jabil’s vice president of operations for Latin America. “This expansion will allow us to serve our customers better, create more jobs and opportunities for our talented workforce, and contribute to the economic and social development of the region.”

In the past year, Jabil’s Chihuahua workforce has grown from 8,000 to around 10,000 employees.

“This new facility will enhance our operational efficiency and flexibility, as well as our ability to deliver high-quality products and services to our customers across different industries and geographies,” added Sándor Kékesi, operations director at Jabil’s Chihuahua site.

Northrop Grumman Commits $200M to New Electronics Site

WAYNESBORO, VA – Northrop Grumman will invest more than $200 million to establish a new advanced electronics manufacturing and testing facility here, where more than 300 jobs will be created during the next five years as the state-of-the-art facility is fully established.

“Northrop Grumman’s expanding Virginia footprint sends a powerful message that the Commonwealth is a magnet for investment underpinned by a next-generation workforce,” said Governor Glenn Youngkin. “This global leader’s cutting-edge facility in Waynesboro will provide job opportunities that attract and retain high-quality talent and create a transformational ripple effect for the entire region.”

“This new facility will increase capacity to manufacture and test advanced electronics and mission solutions to meet our customers’ growing needs,” said Kathy Warden, chair, chief executive and president, Northrop Grumman. “We are pleased to expand our technology presence in the Commonwealth and look forward to welcoming more people to our mission-driven team.”

Jabil Makes Multiple Peripheral Acquisitions

ST. PETERSBURG, FL – Jabil will take over the manufacture and sale of Intel’s current Silicon Photonics-based pluggable optical transceiver product lines and the development of future generations of such modules, one of three deals the EMS/ODM announced in November.

Jabil also announced the acquisition of Retronix, a provider in the reclamation and refurbishment of electronic components, and specialized procurement firm ProcureAbility, giving it a footprint in the procurement sector.

The deal with Intel “better positions Jabil to cater to the needs of customers in the data center industry, including hyperscale, next-wave clouds, and AI cloud data centers,” said Matt Crowley, senior vice president of cloud and enterprise infrastructure, Jabil. “This deal enables Jabil to expand its presence in the data center value chain.”

Through its photonics business unit, Jabil empowers organizations to reduce the complexities of developing and deploying enhanced optical networking solutions by offering complete photonics capabilities, including component design, system assembly, and streamlined supply chain management.

Retronix specializes in component recovery, reballing, retinning and component authenticity testing services, and its acquisition adds exclusive technologies to Jabil’s portfolio and also maintains security, quality and certification standards, the company said in a release.

Jabil said the acquisition also adds to its current circular economy services, including reverse supply chain management, medical device reprocessing, recycled packaging and emission reductions.

ProcureAbility offers strategy and procurement transformation services, managed services such as category management support and sourcing execution, and digital solutions including analytics-as-a-service and spend and market intelligence analytics. It also offers staffing and recruiting services to help businesses scale their procurement departments as needed.

“Together we’re revolutionizing the procurement landscape and how we deliver solutions to organizations to help them drive transformative change and create value,” said Frank McKay, chief supply chain and procurement officer at Jabil.

Incap Opens 3rd India Factory

TUMKUR, INDIA – Incap India has started full-fledged production at its newest plant here, marking the company’s third factory in the country.

The new factory includes two SMT lines with an x-ray machine, two wave soldering machines, a dry heat chamber, stuffing lines, and finished goods storage. Around 300 employees will work in the facility, and combined with the company’s other two factories in the country, Incap India now has a total of 26,500 sq. m. of floor space.

“The third factory expansion highlights our commitment to supporting our customers’ growth. By increasing our production capacity and integrating advanced technology, we are positioned to deliver even greater value and support to our customers worldwide,” said Murthy Munipalli, managing director of Incap India.

Incap India’s factories are all located in Tumkur, near Bangalore. In India, Incap specializes in manufacturing electronics and box-build products, having long experience, particularly in power electronics. The factory produces inverters and UPSs, PCBs for fuel and cash dispensers, power supply units, rescue devices, solar inverters, drives, and medical devices, as well as devices for other electronic industrial products. The company’s customers are globally operating electronic device manufacturers who may be established in Europe but have production facilities in Asia.

Dixon Technologies Acquires 100% Stake in Dixtel Infocom

NOIDA, INDIA – Dixon Technologies has acquired a 100% stake in Dixtel Infocom.

The contract electronics manufacturer bought shares of Dixtel for a cash consideration of Rs 1 lakh ($1,200), per an exchange filing in early November.

Dixtel has been incorporated as a wholly-owned subsidiary of Dixon Technologies as of Sept. 20, the company said.

“The wholly-owned subsidiary has been incorporated with an object to undertake electronic manufacturing services and wholesale/trading of electronic equipments thereof,” the filing said.

Emerald EMS Takes Shine to Ascentron

SALEM, NH – Emerald EMS, a contract electronics manufacturer, in November announced the acquisition of Ascentron, based near Medford, OR. This strategic move reinforces Emerald EMS’ dedication to expanding its capabilities and geographic presence, enabling the company to better serve its customers and foster continued growth.

Ascentron has an extensive customer base within the life sciences and aerospace sectors, and is FDA-registered. This acquisition broadens Emerald EMS’ customer base and adds expertise in the specialized fields of life sciences and aerospace.

Emerald named Amanda Brewer to lead the newly acquired operation.

In a statement, Brewer expressed her enthusiasm for this new chapter, saying, “Ascentron has established a strong reputation and a highly regarded team in the Pacific Northwest. I am humbled and honored to be part of this esteemed group and to have this revered team join the Emerald family. Together, we anticipate exciting opportunities, and I am eager to uphold our tradition of delivering exceptional service and quality to our valued customers.”

Ascentron CEO Hartmut Liebel emphasized, “This addition to the Emerald family of companies expands our geographical footprint through the addition of a facility in southern Oregon, thereby reinforcing our commitment to serving our customers in the western United States.”

Emerald EMS has engineering services and manufacturing facilities in California, Michigan, New Hampshire, Shenzhen and Penang.

IKT Expands EMS Sites to Bulgaria

CHERNIHIV, UKRAINE – IKT Group has opened a contract electronics assembly factory in Plovdiv, Bulgaria. The new plant is the EMS company’s third in Europe.

The company said it chose the location for its proximity to customers in the European Union and Israel, and to lower risks associated with production in its native Ukraine. After considering several countries in Eastern Europe, Bulgaria was selected for its investment climate, vibrant electronics sector and growing economy.

The company has procured lines from Juki, PBT Works, and Olamef, among others, for the new plant, which is called IKT Electronics.

IKT also has sites in Israel and Ukraine.