PCD&F
Hirose DF22B Branch Adapter
DF22B branch adapter supports configurations rated to 30A per contact at 1000V AC/DC using a four-point contact structure and conductive materials. Provides straight, right-angle and in-line wire-to-board options with three housing styles offering keyed guides and color variations to avoid mis-mating in multi-connector assemblies. Includes a straight header version compatible with up to 10mm potting for harsh-environment installations. Designed for compact branching in semiconductor equipment, industrial robots, conveyors, mounting machines and service robots.
Hirose
Melexis MLX90637 SMD FIR Temperature Sensor
MLX90637 FIR temperature sensor provides noncontact thermal monitoring in a 3×3mm SMD package for automated PCB assembly in EV powertrain systems. Offers a 50° field of view, 0.02°C resolution and fast response for applications such as inverter and motor temperature tracking. Includes intrinsic galvanic isolation to separate high- and low-voltage domains and EMC behavior that avoids noise issues common to NTC wiring. Operates from −40° to 125°C with factory calibration, a 3.3V supply and an I²C interface with software-configurable addressing.
Melexis
Stackpole HCSK1216 Shunt Resistors
HCSK1216 four-terminal shunt resistor separates supply current and voltage-sensing paths to reduce power loss and remove lead-resistance error in current-measurement circuits. Uses an all-metal construction that supports high power handling at low resistance values in a compact footprint occupying roughly 75% less area than 2725 packages. Offered in 0.3, 0.5, 1 and 2mΩ values with tolerances to 1% and a 50ppm TCR for precision sensing applications.
Stackpole
CA
Essemtec Tarantula Dual Lane Dispenser
Tarantula Dual Lane dispensing system supports up to three valve heads and delivers up to 1.1 million dph in high-frequency paste jetting, averaging 350,000dph on complex boards, with up to 2 million dph for glue-jetting applications. Handles solder paste, glue, epoxy, thermal materials and specialty fluids for dam-and-fill, 3-D dispensing, cavity jetting, staking, shielding, microcoating, dielectric ink, liquid metal and edge-bond processes. Accommodates boards from 50×50mm to 560×500mm, or dual identical boards up to 560×275mm. Optional 2-D paste inspection with automatic correction. Includes integrated traceability.
Essemtec
Henkel Loctite TCF 14001 Gap Filler
Loctite TCF 14001 14.5W/m-K silicone gap filler is formulated for heat management in 800G and 1.6T optical transceivers used in AI data center systems. Low-volatility two-part construction minimizes outgassing and oil bleed to prevent optical interference in sensitive assemblies. Supports automated dispensing with stable flow and maintains interface adhesion and gap-variation tolerance across diverse chip geometries, sustaining thermal performance under high load and potential warpage.
Henkel
Machine Vision Products MVP 9.1 Software Release
MVP 9.1 software has a revised AI architecture built around a dedicated AI server for improved defect detection, adaptive learning and real-time decision support across MVP inspection systems. Adds an open AI platform that permits integration of select third-party AI engines within the inspection workflow. Back-end database stores images, metadata, inspection results and process parameters for filtering, querying and MES or yield-system connectivity. Supports deployment on Aura, Aurora, 900 Series and 2030 DWMS platforms with upgrade paths for existing installations.
Machine Vision Products
Master Bond MasterSil 800Med Silicone
MasterSil 800Med one-part moisture-curing silicone for medical device assembly meets ISO 10993-5 non-cytotoxicity requirements. Provides flow characteristics suitable for medical electronics, bonding, sealing, coating and form-in-place gasketing, and remains stable under dry-heat and sterilization conditions. Cures on exposure to humidity with tack-free times of 15–20min at 75°F and supports service temperatures up to 300°C while maintaining elongation of 250–350% and a Shore A hardness of 25–45. Offers electrical insulation with volume resistivity above 10¹³Ω-cm and bonds to metals, silicon, glass, ceramics, plastics and silicone rubber. Packaged in tubes for controlled dispensing.
Master Bond
Mek ISO-Spector X1 3D THT AOI
ISO-Spector X1 3D THT AOI uses bottom-up 3-D optics and projection to measure through-hole solder-joint volume and pin height. Captures data on volume, height and pin extension to support verification in wave and selective-solder applications. Provides inspection coverage for SMT and THT assemblies to support process monitoring.
Mek
Shenmao PF606-P279L Ultra-Fine Pitch Solder Paste
PF606-P279L solder paste is formulated for mini-LED production using Type 6 and Type 7 powders for uniform particle size and consistent printing through 60µm stencil apertures. Provides stable deposition with minimal voiding and supports strong die stability in fine-pitch assemblies. Compatible with future designs requiring Type 8 and finer powders for emerging mini- and micro-LED processes. Available in SAC 305 and multiple Sn-based alloys, including SnSb, SnBi and SnBiAg.
Shenmao
Solderstar WaveShuttle O₂ Verification Tool
WaveShuttle O₂ extends WaveShuttle platform by adding real-time oxygen measurement for wave soldering verification. Records seven parameters per run, including temperature profile, wave contact, wave height, line speed, inclination angle, vibration and oxygen concentration. Uses titanium contact sensors for wave height and conveyor speed tracking, along with a three-axis vibration sensor to identify mechanical instability from worn components or misaligned tooling. Inclination sensors capture PCB entry and exit angles at solder wave. Features ESD composite and titanium construction with custom production sizes available and integrates with SLX datalogger to distinguish machine variation from PCB-specific behavior.
Solderstar
Vision Engineering ProteQ VISO 3-D Digital Stereo Microscope
ProteQ VISO 3-D digital stereo microscope provides an integrated autostereo display that delivers true three-dimensional visualization on a flat screen without eyepieces or glasses. Uses twin cameras and eye-tracking software to generate depth-rich stereo images for inspection, rework, product design and prototyping tasks. Offers a 10:1 zoom range, live magnification display and adjustable viewing geometry to support long-duration microscopy work. Targets electronics assembly, PCB inspection, catheter and stent development, micro-molding and aerospace component evaluation.
Vision Engineering