PCD&F
AllSpice.io DRCY AI Design Review Agent
DRCY AI-powered design review agent is for hardware engineering workflows and automates first-pass schematic and constraint checks. Parses datasheets at scale and cross-references schematics, documented constraints and component data to identify compatibility risks early in the design cycle. Detects issues including incorrect voltage references, pins operating outside specified limits, swapped signals, incorrect packages, reverse-polarity passives, mismatched voltage domains, insufficient drive strength and reset circuitry errors. Designed to surface actionable risks before layout and fabrication.
AllSpice.io
Hirose PO(M2) Series Coaxial Connectors
PO(M2) Series push-on lock coaxial connectors support multi-board RF applications with operating frequencies up to 6GHz. Uses a three-piece parallel board-to-board configuration with two plug receptacles and an interposer to connect adjacent PCBs in space-constrained layouts. Design supports positional displacement tolerances of ±0.4mm in X and Y directions and 1mm in Z direction to accommodate board misalignment. Supports cable connections using a plug receptacle and locking right-angle jack for mixed interconnect configurations.
Hirose
Luminovo ElectronicsGPT Procurement AI Agent
ElectronicsGPT AI-based tool, for electronics procurement workflows, provides access to component specifications, part alternatives, availability data and supply chain information through a conversational interface. Is based on Luminovo’s supply chain datasets and supports queries across millions of electronic components with weekly updates. Functions include datasheet retrieval, extraction of compliance-related technical details and background task execution such as availability monitoring and supplier risk alerts. Available for free.
Luminovo
Omron P6K Relay Socket for G6K Series
P6K surface-mount relay socket is compatible with Omron’s G6K PCB terminal-type relay series, including G6K-2P and G6K(U)-2P-Y models. Matches G6K terminal layout and mating structure to support PCB assembly and relay replacement without soldering. When paired with a G6K relay, supports repeated insertion and removal with no increase in contact resistance after 50 cycles.
Omron Electronic Components
Seica Valid SL ICT and Functional Tester
Valid SL in-circuit and functional test system is for high-channel-count electronics testing. Uses a cable-free architecture with 128-channel scanner cards, supporting configurations exceeding 4,480 channels. It supports single-stage and dual-stage test area configurations and multi-job operation through Seica’s latest VIVA software interface. Integrates streamlined internal hardware access and supports scalable automation for high-volume and high-reliability test environments.
Seica
Stackpole RMCA Automotive-Grade Thick-Film Chip Resistors
RMCA automotive-grade thick-film chip resistors are surface-mount components qualified to AEC-Q200 for automotive electronic applications. Are manufactured on dedicated automotive production lines using controlled materials and process parameters to support stable resistance performance under automotive operating conditions. Includes RMCA-HP and RMCA-UP variants with power handling approximately two to three times higher than standard RMCA devices of the same size. Come in multiple case sizes, resistance values and tolerance options.
Stackpole Electronics
Stackpole RNAN Thin-Film Chip Resistors
RNAN series thin-film precision chip resistor line uses an aluminum nitride substrate for higher thermal conductivity than alumina substrates, enabling increased power density in thin-film resistor designs. Supports power ratings of 0.5W in 0603, 1W in 0805, 2W in 1206 and 6W in 2512, with controlled hot-spot and terminal temperatures. Are intended for high-power, space-constrained applications requiring thin-film resistance characteristics.
Stackpole Electronics
Vishay VT171P and VT172U Transmissive Sensors
VT171P (single-channel) and VT172U (dual-channel) surface-mount transmissive sensors are for position sensing in industrial, consumer and telecom applications. Devices integrate an infrared emitter and phototransistor detector operating at 950nm and are housed in a 5.5mm × 4mm × 5.7mm package with increased dome height for added vertical clearance in turn-and-push and code-wheel designs. Typical output current is 1.5mA with a 3mm gap width and 0.3mm apertures, with rise and fall times of 14ms and 21ms. VT172U supports dual-channel detection for direction sensing, while both devices support motion and speed detection in encoders, automation systems, appliances and broadband equipment.
Vishay Intertechnology
Vishay 100V Gen 2 TMBS Rectifier Modules
Gen 2 TMBS rectifier module series consists of 100V trench MOS barrier Schottky devices for industrial power conversion. The modules are housed in a fully insulated, industry-standard SOT-227 package and feature forward voltage drops as low as 0.83V with negligible reverse recovery charge. Available configurations include dual-diode parallel modules rated at 100A, 200A and 400A, as well as a 150A single-phase bridge. Devices support operation up to +150°C and are used in high-frequency converters, industrial SMPS, welding equipment, telecom power systems, 48V battery-powered vehicles and battery blocking applications.
Vishay Intertechnology
Zuken OrCAD to eCADSTAR Migration Module
OrCAD to eCADSTAR migration module converts PCB layouts, schematics and libraries from Cadence OrCAD into Zuken’s eCADSTAR PCB design environment. Supports automated conversion of complete PCB projects, including associated design libraries, to enable continued development without recreating legacy designs. Comes at no cost to licensed eCADSTAR users and includes documentation and technical support provided by LogicSwap Solutions.
Zuken
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CA
Bold Laser Automation LTX1260A 3-D Inspection and Measurement System
LTX1260A noncontact 3-D inspection and measurement system, for high-precision and delicate components, combines Keyence LJ-X8020 3-D scanner with TMX-5006 profile measurement platform to support automated inspection of surface condition and geometric profiles. Supports dual-station operation for 3-D contamination detection and profile measurement and includes semi-automated fixturing with rotary and linear stages. Integrated data capture supports CSV and Excel export, with an automation-ready architecture for production environments.
Bold Laser Automation
Inovaxe InoHD Ultra-High-Density Smart Storage System
InoHD is an ultra-high-density smart storage system for SMT and electronic components. Uses servo-driven mobile shelving with integrated sensing and pick-to-light guidance to eliminate fixed storage aisles. Supports storage densities of up to 310 SMT reels per square foot and accommodates more than 10,500 reels within a 4′ × 8′ footprint. Provides guided access with real-time inventory verification and supports integration with MES and ERP systems.
Inovaxe
Inspectis F40/F40s Full HD Digital Microscope
F40/F40s is a full HD digital microscope system for high-resolution optical inspection. Uses an upgraded image sensor with a motorized 40:1 zoom lens and supports full HD video at 60fps with low latency. Features include enhanced sensor sensitivity and dynamic range, fast autofocus, a 7-blade aperture and a free working distance of 226mm. Provides up to 30:1 optical zoom with 1.3× digital zoom and supports integration with Inspectis utility and metrology software.
Inspectis
Master Bond EP54TC Electrically Insulating Epoxy
EP54TC two-component, electrically insulating epoxy is for heat sink bonding and thermal management applications. Delivers thermal conductivity exceeding 6W/(m·K) and uses a 5-30µm filler to support thin bond lines and void filling, achieving thermal resistance of 5-7×10⁻⁶K·m²/W. Exhibits a tensile modulus above 1 million psi at room temperature and operates from -73° to +204°C. Supports a recommended cure of 2 hr. at 80°C with a 2-4 hr. post cure at 90°-125°C and comes in ounce through gallon kit sizes.
Master Bond
Shenmao PF606-P266J Jet Dispensing Solder Paste
PF606-P266J high-speed jet dispensing solder paste supports noncontact solder deposition and maintains process stability across a range of jetting parameters. Halogen-free flux system. Supports solder powders from Type 5 through Type 7. Available alloy options include SAC 305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.
Shenmao
Sono-Tek SelectaFlux 3 Ultrasonic Fluxing System
SelectaFlux 3 selective ultrasonic flux spray system, for selective soldering applications, is offered as a retrofit compatible with major selective solder platforms. Optional flow monitoring module provides noncontact flux volume measurement with ±15% accuracy, per-board flux volume recording, data logging and flow alarms when rates fall outside defined limits. Supports process monitoring and traceability in selective solder operations.
Sono-Tek Corp.
TRI TR7600FB SII 3-D AXI
TR7600FB SII 3-D automated x-ray inspects fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Newly developed x-ray imaging structure positions x-ray tube close to board surface without structural interference to support detailed internal inspection. Integrates AI-based inspection algorithms with metrology-based measurement and supports AI smart programming.
Test Research Inc.
VJ Electronix Summit LT150 Rework System
Summit LT150 rework system for large, high-density electronic assemblies supports components up to 150mm and PCB sizes up to 24 × 36″, with optional support for larger formats. Features large field-of-view vision system for full component visibility and scaled top and bottom heating with dual PID control. Provides increased clearance for tall connectors, heat sinks and power modules while maintaining uniform thermal performance during rework.
VJ Electronix
VJ Electronix XQuik V X-ray Component Counter
XQuik V component counter and inventory verification system uses high-resolution x-ray imaging with increased source power and includes automatic load drawer for reel handling. Integrated barcode camera associates reel identification with count data. Supports inventory control workflows requiring accurate component counts and traceability.
VJ Electronix
Yamaha Motor YRH10W Hybrid Placer
YRH10W wide-type hybrid placement system supports semiconductor die bonding and surface-mount component placement on a single platform. Accommodates 12″ wafers and printed circuit boards up to 510 × 460mm. Combines bare-die handling and SMT placement, supporting bare-chip placement speeds of up to 14,000cph with placement accuracy of ±15µm.
Yamaha Motor
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