PCD&F
Hirose K.FL2 Micro RF Connector
K.FL2 series of micro RF connectors feature a profile of 1.2mm when mated. Come in two versions, an RF cable mating type and an FPC-to-board mating type, both supporting high-density mounting to save PCB real estate. Are said to deliver high-frequency performance and have low voltage standing wave ratios (VSWR) of 1.3 Max: 0-3GHz; 1.5 Max: 3-6GHz; 1.6 Max: 6-8GHz. Are compatible with pick-and-place mounting and are used in consumer applications, including laptop computers, smartphones, tablets, VR/AR glasses, routers and more. Use a tapered design for easy mating with significantly reduced insertion force, a polarity key for identification of the mounting direction and a clear tactile click to confirm proper mating. Robust, integrated plug design is said to prevent plug deformation during un-mating and nickel barrier at the shell and contact prevents solder wicking and flux penetration.
Hirose Electric
Keysight EDA 2025 Software Suite
EDA 2025 software suite uses AI, machine learning and Python integrations to reduce design time for complex RF and chiplet products. Enhances data manipulation, integration and control of simulators, for building efficient workflows seamlessly across multiple tools. Features AI-enhanced workflows and high-performance computing to reduce time-to-insight, as well as end-to-end component models and measurements that conform to digital standards for simulating fast digital interconnects.
Keysight Technologies
Kyocera AVX CR Resistor Series
CR series of high-power chip resistors now includes high-power 0603 size package said to enable the miniaturization of RF power amplifiers and improve thermal management, with a high-thermal-conductivity substrate and maximized heat sink grounding area. Rated for 0.3pF and up to 2.6W, and features proprietary thin-film resistive elements, aluminum nitride substrates and silver terminals. Features two standard resistive values (100Ω and 50Ω), a power handling capability of up to 250W, rated operating temperatures from -55° to +150°C, and resistive tolerance as tight as ±2%.
Kyocera AVX
RS DesignSpark PCB Design Software v.12
DesignSpark v.12 PCB design tool introduces features for free and paid subscriptions. New functions include pre-plot checks for correct layer selection, edit component options useful for high-pin footprints like BGAs, an angular precision setting for design units, dual units for the measurement tool and the ability to export components, including referenced symbols, from any library. Also now features a segment mode for shape and track editing, translate-to-PCB options designed to improve reference design conversion to PCB, the ability to save project-specific libraries, new component bin options like sort and filter for high-component-count designs, design rule check on current view and additional DRC options, like maximum vias allowed in each net, maximum stub route length allowed and check PCB-only nets.
RS
Schmid InfinityLine H+ Electroless Cu Line
InfinityLine H+ electroless copper system is designed for high-performance advanced packaging applications using mSAP and SAP processes. Is said to achieve highly uniform copper deposition and features enhancements such as an ozone module for pristine surface preparation, an advanced electroless copper module design and a three-point transport system that eliminates contact with active areas. Uses a horizontal process to treat each panel automatically under identical process conditions using efficient flood boxes that target treatment areas, enhancing the uniformity of copper thickness and providing superior performance in rinsing and drying substrate panels. Offers a smarter and more sustainable production solution through the Schmid Watch 3.0 HMI and process control system, which leverages the decentralized H+ bus system for active and passive components.
Schmid
Schmid TGV Etcher
The acidic-based through glass via (TGV) etching system is said to work with all common glass types with CTEs ranging from 3 to 9. Reportedly delivers six to eight times higher productivity than traditional alkaline etching methods and features a 35% reduction in power consumption to maximize efficiency while fostering sustainable manufacturing practices. Eliminates need for cassettes, reducing material costs and simplifying operation, and accommodates substrate sizes ranging from 100mm x 100mm to 600mm x 600mm. Comes in lab and high-volume manufacturing versions to meet requirements for research and development or large-scale production.
Schmid
Unigen DDR5 Memory Modules
DDR5 family of high-performance memory modules come in registered DIMM (RDIMM) capacities up to 64GB at 5600MT/s speeds in both standard height and very low profile (VLP) form factors. Are 18.75mm in height and permit vertical DIMM placement in 1U blade servers and other embedded systems.
Unigen
CA
Indium CW-807RS Flux-Cored Wire
CW-807RS halide- and halogen-free flux-cored wire improves wetting speeds and cycle times for electronics assembly and robot soldering applications. Is a no-clean formula designed to maximize solderability of a halogen-free cored wire solder flux and is an upgraded version of Indium’s CW-807 formula. Provides faster wetting speeds, clear residues for electronics assemblers that use high (>385°C) tip temperatures and tend to experience charring and tip build-up and improves cycle times in robotic soldering applications.
Indium Corp.
Mycronic MYPro A40SX and A40LX Placement Machines
A40SX and A40LX placement machines are equipped with new MX7 high-speed heads. Can place components as large as 45mm x 45mm x 15mm or 150mm x 40mm x 15mm and as small as 0.4mm x 0.2mm (01005). Feature top speeds of 29,000cph (SX) and 18,000cph (LX). Also feature up to 224 feeder positions, can place a full range of components in one machine, allow on-the-fly changeovers, can handle short tapes and nonstandard carriers and enable electrical verification of resistors, capacitors, diodes and transistors with full traceability. Also includes a newly designed GUI to simplify training and pick-and-place operations.
Mycronic
Saki 3Xi-M200v3 AXI
3Xi-M200v3 x-ray automated inspection system is part of the 3Xi-M200 AXI series, achieving a reported three times the resolution of its predecessors while reducing inspection times by up to 50%. Features a large, highly sensitive detector that captures high-contrast images of ultra-thin materials and enhanced CT computation capabilities to improve resolution while cutting inspection times in half, permitting precise separation of multilayer components within complex power modules. Is designed to optimize overall production efficiency and features dedicated operator judgment software tailored for power module inspection to streamline final inspection processes. Is fully compliant with SEMI SECS/GEM standards and supports automation and workforce reduction initiatives.
Saki Corp.
Shenmao PF606-P Solder Paste
PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls. Is said to offer printability and solderability, with a specially designed flux for voiding control, minimizing void formation and avoiding short defects caused by ball volume expansion due to voids.
Shenmao America
Vishay D2TO35M Resistor
D2TO35M automotive grade surface-mount thick film power resistor combines multi-pulse capabilities with high power dissipation of 35W at 25°C. Is said to provide higher power dissipation and reliability for multiple and repetitive pulse use than standard devices in the TO-263 (D2PAK) package, and offers a maximum drift of 2% after 1000 pulses at 25°C and a drift less than 5% after 100,000 pulses. Features turn-on time of 500ms, turn-off time of 11 sec. and pulse energy of 18.9J, withstands 1,000 cycles of rapid change of temperature (RCT) testing and offers a load life of 1000 hr. Also features a resistance range from 10Ω to 10kΩ – with tolerances of ±2%, ±5% and ±10% – thermal resistance of 4.28°C/W, TCR of 150±ppm/°C, and an operating temperature range from -55° to +175°C. Is RoHS compliant and solder reflow secure at 270°C/10 sec.
Vishay Intertechnology
Vishay Siliconix SiJK140E MOSFET
Siliconix SiJK140E 40V MOSFET is said to reduce on-resistance by 32% while offering 58% lower on-resistance than 40V MOSFETs in the TO-263-7L. Minimizes power losses from conduction to increase efficiency while improving thermal performance with a low RthJC of 0.21°C/W typical. Allows designers to utilize one device instead of two in parallel to achieve the same low on-resistance, improving reliability and mean time between failures. Features a bond-wireless (BWL) design that minimizes parasitic inductance while maximizing current capability, and offers a continuous drain current up to 795A for increased power density while providing a robust SOA capability. Occupies an area of 120 mm2 in the PowerPAK 10×12 package, saving 27% PCB space compared to the TO-263-7L while offering a 50% lower profile. Is for synchronous rectification, hot swap switching and OR-ing functionality, with typical applications being motor drive controls, power tools, welding equipment, plasma cutting machines, battery management systems, robotics and 3-D printers. Offers a threshold voltage of 2.4Vgs, is RoHS-compliant and halogen-free, and is 100% Rg and UIS tested.
Vishay Intertechnology
Vishay VOR1060M4 Solid-State Relay
VOR1060M4 solid-state relay offers a 600V load voltage and isolation voltage of 3750VRMS in the low-profile SOP-4 package. Features a turn-on time of 0.3ms typical and low leakage current of 2nA. Is designed to provide isolated switching in inverters, motor controls and battery management systems (BMS) in energy storage systems (ESS); industrial motor drives, power tools and controls; security and automation systems and instrumentation. Is RoHS-compliant, halogen-free and Vishay Green.
Vishay Intertechnology
