EasyLogix PCB-Investigator V15.1 ECAD

PCB-Investigator V15.1 brings enhanced import/export functions, advanced analysis tools and a more user-friendly interface to streamline the PCB design process. Key features include enhanced import and export functions for various file formats and faster data handling, advanced thermal simulation and improved DfM checks, more UI options and improved reporting tools, and enhanced support for machine formats to streamline manufacturing processes.



Pasternack Impedance-Matching Pads

Impedance-matching pads for 50Ω and 75Ω transmission lines are said to provide seamless transition between the two types of lines. Ensure optimal performance across a variety of RF applications and feature BNC, F-type, N-type, and SMA connectorized designs, making them versatile for integrating into existing systems with ease. Facilitate 50Ω to 75Ω impedance matching as well as 75Ω to 50Ω, catering to a broad spectrum of transmission requirements. Feature configurations including 50Ω BNC to 75Ω F-type among various gender setups, and combinations like 50Ω N-type male to 75Ω F-type male, and 50Ω SMA male to 75Ω F-type female to solve diverse connectivity challenges.




Stackpole RNWA Thin Film Resistor

Stackpole’s RNWA is a thin -film chip resistor with wide terminations and is capable of tolerances to 0.1% and TCR as low as 25ppm. Is automotive grade, which provides an additional level of long-term stability and reliability as well as being resistant to sulfur.

Stackpole Electronics



Vishay Draloric AC05 WSZ and AC05-AT WSZ Resistors

Vishay Intertechnology’s Draloric AC05 WSZ and AC05-AT WSZ resistors feature a lead form permitting them to function as surface mount components. Serve as snubber and inrush current limiting resistors, and are said to be useful in automotive and industrial electronics, energy meters, and power supplies for white goods. Peak power capabilities up to 5kW for a 1µs pulse load and resistance range from 0.10Ω to 10kΩ. Also feature a robust, nonflammable silicone cement coating that meets UL 94 V-0 standards. Operate within a temperature range of -55° to +250°C and are withstand mechanical stress and thermal shocks at high temperatures. Conform to RoHS compliance, are halogen-free, and feature tin-plated terminations, ensuring compatibility with lead-free and lead-containing soldering processes.

Vishay Intertechnology



Zuken eCADSTAR 2024.0 ECAD

eCADSTAR 2024.0 PCB design system includes improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design. Introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs, and a shape comparison tool to aid in reverse engineering efforts by highlighting discrepancies in copper and routing patterns. Also includes new “Copy Complete Part” feature that allows designers to transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3-D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. Schematic updates include support for variant text, optimized drawing of nets and buses, and the introduction of new design rule checks (DRCs) to help identify potential problems early on and streamline the design process, reduce overall design time, and minimize the need for revisions.



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ASMPT Siplace CA2 Placement Machine

Siplace CA2 hybrid placement machine combines semiconductor and SMT production to integrate the production of SiPs (system-in-package modules) directly into the SMT line. Processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 50,000 dies or 76,000 SMT components per hour with a precision of up to 10µm at 3σ. Features a buffer storage module that works similar to a placement head and can hold 16 new dies (plus four on the flip unit) while the placement head itself is still placing SMDs. Also features full single-die-level traceability, which automatically logs for each die its pick-up and placement position on the board, as well as speedy program and product changeovers, placement program portability to any machine of the same type, and fast and comprehensive substrate mapping.




Aven High-Performance Diagonal Cutters

Aven’s diagonal cutters are crafted for cutting and longevity for a range of industrial tasks. Titanium diagonal cutter is made with high-grade titanium. Features an overall length of 150mm and a semi-flush blade type, an oval head with a 22mm width, and cuts low carbon steel wire up to 1.6mm in diameter and soft copper wire up to 2mm. Features a lightweight design and a comfortable plastic grip to reduce hand fatigue for extended use without discomfort.

304 stainless steel cutter is designed for various cutting applications and offers a semi-flush cutting edge able to cut low carbon steel wire up to 1.6mm in diameter and soft copper wire up to 2mm. Features ergonomic PP+TPR grip to ensure comfort during use, and oval head style and 200mm overall length are said to provide control and leverage.




Dymax UVCS V3.0 LED Conveyor

UVCS V3.0 LED conveyor is an enhanced version of the Dymax UVCS conveyor curing systems. Includes high-contrast 8″ touchscreen for managing speed, operation modes, and LED emitters installed in the conveyor. Is fully programmable for belt speed and intensity and features a static curing oven mode in addition to high-speed conveying through the conveying tunnel, and a PLC can also be used to activate and operate the system. Features 12″-wide belt, automated part sensing and reversible operation. Fully enclosed design enhances safety with UV leak protection, and high-power exhaust system minimizes noise, light and heat emissions. Is said to reduce chamber temperature even with high-power curing systems, for temperature-sensitive parts, and includes stainless steel components near the belt to limit ESD.




Emil Otto Zinnin Green Pastes

Zinning Green pastes do not require zinc chloride, are not subject to hazard labeling, and can be used for soft soldering and tinning. Come in three variants with different alloys: Zinnin Green I with the alloy Sn100, Zinnin Green II with the alloy Sn96.5 Ag3.0 Cu0.5 (SAC305) and Zinnin Green III with the alloy Sn97Cu3. For use in both industrial and craft applications and come in various packaging sizes.

Emil Otto



Indium Durafuse HR Alloy

Indium’s Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications. Is engineered to withstand 3,000-plus thermal cycles at -40°/125°C across different PCB finishes and component types, and reportedly outperforms SAC 305 with bottom-terminated component voiding. Also offers reduced solder joint cracking and increased shear strength. Is compatible with most SAC 305 reflow profiles and standard PCB surface finishes, including ImSn, OSP, and ENIG.

Indium Corp.



Master Bond UV15DC80-1Med Epoxy

UV15DC80-1Med is a one-component, no-mix epoxy that offers a dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. Addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn’t receive sufficient UV exposure, making it suitable for intricate parts and complex geometries, and meets ISO 10993-5 cytotoxicity standards, demonstrating biocompatibility for medical device applications. Is said to resist radiation, liquid sterilants and autoclaving. Has a moderate viscosity of 20,000-40,000cps for versatile dispensing and delivers strong bonds to various substrates, including metals, glass, ceramics, and many plastics, with a tensile strength exceeding 5,000psi at 75°F. Offers a wide service temperature range from -80° to +350°F (-62° to +177°C) and a glass transition temperature of 125°-135°C, and maintains optical clarity with a refractive index of 1.52 at 589nm. Exhibits minimal sensitivity to oxygen, and initial UV cure/tack can be achieved in seconds with UV light (325-365nm) at a minimum UV radiation intensity of 20-40mW/cm2 while areas with limited UV access need to be subsequently cured with heat at 80°C within 40-60 min. Post-cure at 80°C for 2-4 hr. or 125°C for 30-60 min. is recommended for maximum performance.

Master Bond



Polar Instruments GRS550 Flying Probe Tester

GRS550 flying probe test system is designed for fault diagnosis in prototype construction, new product launches, small series and applications for which a traditional in-circuit test or multi-pin flying prober is too expensive. Offers extensive testing options with short preparation times and low costs through the extensive use of CAD data in combination with proven fault diagnosis technology. Is suitable for all component technologies and features a maximum fly height of 100mm. Includes two live video cameras, with one camera for programming and inspection and the second for live monitoring of the probing position, which enables diagnosis of faults in all component technologies such as SMT, PTH and BGA, with the system automatically positioning test points on accessible areas of the nets.

Polar Instruments



Shenmao PF918-P250 Solder Paste

PF918-P250 thermal fatigue-resistant solder paste is formulated with high-strength solder material, designed for long-service life electronic products with stringent reliability requirements. Incorporates high-reliability lead-free alloy PF918, which boasts a tensile strength performance 1.4 times greater than the typical SAC 305. Is said to reduce voids, have good printability and demonstrate thermal cycling reliability.




TopLine Braided Solder Columns

Braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components. Are said to be suited for cryogenic environments and next-generation applications, and provide improved reliability and thermal properties over competing technologies. Are non-collapsible, RoHS compliant and lead-free, and designed to absorb destructive strain caused by differences in CTE of materials between large-sized heterogeneous 2.5-D packages and FR-4 PCBs.



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