INEMI Publishes New Roadmaps for Laminates, Board Assembly

MORRISVILLE, NC – The International Electronics Manufacturing Initiative (INEMI) has released updated roadmaps addressing key challenges and technology advancements in board assembly, complex integrated systems and laminates. The updates reflect growing demands across industries such as high-performance computing, 5G/6G communications, autonomous vehicles, medical electronics and aerospace.

The PCB Roadmap now includes a new section on laminates, detailing future requirements and technology gaps, led by Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics).

The Board Assembly Roadmap, led by Jasbir Bath (Bath Consultancy LLC) and Paul Wang (MiTAC), highlights developments in SMT materials, rework, CPU sockets and press-fit connectors.

The Complex Integrated Systems Roadmap builds on a joint INEMI-IPC whitepaper to map technology needs for increasingly complex electronics.

Francis Mullany, INEMI’s director of Roadmapping, emphasized that advancing manufacturing for complex electronics remains a top priority as the industry faces challenges like miniaturization, faster switching and harsher environments.

(Mullany and INEMI’s Emma Hudson recently discussed the new roadmap activity on the PCB Chat podcast.)

Doosan Begins Flex Laminate Production at New Plant in Korea

SEOUL – Doosan Corp. in June launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable device segments. The facility, completed last September, reached full-scale operations in May.

The new production line complements Doosan’s ongoing copper-clad laminate business, which supports AI accelerators for customers like Nvidia. With quality tests underway for AI chips from Marvell and Amazon, Doosan is expected to secure additional CCL contracts later this year.

Under CEO Yoo Seung-woo, appointed earlier this year, the company is investing 96 billion won ($71 million) through 2027 to expand its CCL production lines.

Benchmark Expands in Guadalajara with New Manufacturing Facility

GUADALAJARA, MEXICO – Benchmark Electronics has opened a 321,000 sq. ft. manufacturing facility here, boosting its regional footprint by 50% to better serve the medical, industrial, advanced computing and communications sectors.

The facility, located in the Parque Industrial San Jorge, is designed to enhance efficiency, support highly regulated industries, and scale production for new and existing customers. Benchmark sees its expansion as a reflection of its commitment to regional growth, job creation and innovation in high-tech manufacturing.

“Our new facility in Guadalajara is the cornerstone of our investment in Mexico and supports our global growth strategy. This new facility increases our capabilities in the region with an optimized space to serve complex and highly regulated industries,” said Jeff Benck, president and CEO, Benchmark. “With over 300,000 square feet of manufacturing capability, this expansion will allow us to scale with new and existing customers who have come to us for our world-class product realization services provided by a specialty EMS partner who understands how to support this class of products.”

Jabil Announces $500M US Manufacturing Investment

PETERSBURG, FL – Jabil in June revealed plans to invest $500 million over the next several years to expand its manufacturing footprint in the Southeast US, supporting the growing needs of cloud and AI data center infrastructure customers.

The investment will fund large-scale manufacturing capabilities, capital equipment and workforce development, with operations expected to begin by mid-2026 at a site currently in final selection.

“This expansion ensures the hardware powering AI innovation is built domestically, supporting both economic priorities and national security,” said Matt Crowley, executive vice president, Global Business Units.

The move follows Jabil’s recent acquisition of Mikros Technologies, a provider of liquid cooling systems. CEO Mike Dastoor emphasized the initiative aligns with Jabil’s long-term strategy to diversify its commercial portfolio and enhance its US presence amid a shifting geopolitical landscape.

Teltonika to Triple Production Capacity with 4 New Manufacturing Sites

VILNIUS, LITHUANIA – Teltonika is set to launch four new manufacturing sites by the end of the year, the company said in June. The electronics manufacturing services company currently operates facilities in Vilnius and Molėtai, and the new factories are expected to triple Teltonika’s manufacturing output to 30 million from 10 million units annually.

Trial PCB production is scheduled to begin this summer, with full operations expected by year-end.

Teltonika president Marius Derenčius emphasized that the expansion will enhance product quality and reduce reliance on external suppliers. The new facilities also include dedicated lines for specialized defense-related electronics.

The company projects that 4,000 specialists will be employed across the Teltonika Group.

NCAB Finalizes Acquisition of B&B Leiterplattenservice in Germany

MITTWEIDA, GERMANY – NCAB Group has completed its acquisition of B&B Leiterplattenservice, following the initial agreement signed on April 23. The deal closed on June 3, integrating the German PCB supplier into NCAB’s expanding European operations.

NCAB paid $12.5 million, with a potential earnout of up to $2.6 million, and expects the acquisition to be accretive to earnings this year.

B&B Leiterplattenservice, founded in 1996, reported net sales of approximately $14 million in 2024. The company employs 25 people, with 20 based in Mittweida, Germany, and five in China. Its customer base primarily includes clients in the industrial and power sectors within Germany, with some sales extending into Italy. B&B sources PCBs predominantly from China and a European partner.

Scanfil Acquires Majority Stake in ADCO Circuits

SIEVI, FINLAND – Scanfil is acquiring 80% of US-based ADCO Circuits, a move aimed at strengthening its position in the Americas and the aerospace & defense sector, according to a company announcement released Jun. 10.

The deal puts the enterprise value of ADCO at $25 million, with Scanfil expected to pay $15.5 million (EUR 13.6 million) for the 80% stake. ADCO’s production facility is excluded from the transaction.

ADCO had 2024 sales of about $40 million (EUR 30.6 million), EBIT of $4 million and EBIT margin of 11.4%.

Located in the Greater Detroit area, ADCO generates 37% of its revenue from Aerospace & Defense clients and provides complex electronics and box-build manufacturing. The company’s high-mix, low-to-medium volume production model aligns with Scanfil’s existing capabilities. Its proprietary ADCOproto platform will be integrated into Scanfil’s service portfolio.

“This acquisition allows us to significantly expand our footprint in the USA and the aerospace and defense industry,” said Christophe Sut, CEO, Scanfil. “Combined with our investments in the Atlanta plant, we can more than double our turnover in the Americas.”

Amtech Launches US Tax Credit Petition

TROY, MI – The CEO of Amtech Electrocircuits, a provider of electronics manufacturing solutions, has initiated a petition urging policymakers to implement a 10% tax credit for OEMs sourcing from US electronics manufacturers. The initiative aims to bolster domestic manufacturing, enhance national security, and stimulate technological innovation by incentivizing OEMs to prioritize US-based suppliers.

“Our manufacturing industry is the backbone of the American economy, providing quality jobs and driving technological advancements,” said Jay Patel, CEO, Amtech Electrocircuits. “However, unfair trade practices and overseas competition have led to a decline in our industry. By introducing a 10% tax credit for OEMs that source from US companies, we can revitalize domestic manufacturing, safeguard jobs and strengthen our national security.”

The petition highlights the challenges faced by US electronics manufacturers, including financial burdens imposed by unfair trade practices, and proposes the tax credit as a solution to incentivize domestic sourcing. By encouraging OEMs to partner with US suppliers, the policy aims to create a more resilient and secure supply chain for critical technologies.

Amtech Electrocircuits invites industry stakeholders, policymakers, and the public to support this initiative by signing the petition and advocating for policies that promote the growth and sustainability of US manufacturing.

Mycronic Unit Acquires Surfx Technologies

STOCKHOLM – Mycronic announced on Jun. 3 that its Global Technologies division has acquired Surfx Technologies, a US-based provider of atmospheric plasma solutions used in advanced electronics manufacturing.

Mycronic previously held a 7.5% minority stake in Surfx, acquired in 2020. The company currently employs 34 people across the US and Taiwan, with projected net sales between $25 million and $30 million.

“Surfx has a unique plasma cleaning solution that is gaining traction in 3-D semiconductor die stacking, which is one of the critical enabling technologies behind the AI revolution,” said Magnus Marthinsson, senior vice president, Mycronic Global Technologies. “With this acquisition, Mycronic invests in leading manufacturing equipment for the semiconductor industry.”

Following the transaction, Surfx will operate as a new business line under the Global Technologies division.

GBM Expands AI Product Line with Lincstech Acquisition

TAIPEI – Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, has finalized its acquisition of Lincstech, a Tokyo-based PCB fabricator, from Polaris Capital Group.

The move enhances GBM’s PCB capabilities in AI servers and semiconductor applications and expands its production in Singapore and Malaysia.

GBM chairman Yu-Heng Chiao highlighted that the deal positions GBM to diversify into more stable high-tech markets, reducing reliance on price competition with Chinese manufacturers. The company plans upgrades to the Loyang facility in Singapore, focusing on efficiency and AI server product sophistication, as Singapore benefits from favorable US trade ties.

Integration of Lincstech has already helped lift AI-related sales to nearly 20% of GBM’s revenue. The group will center its PCB strategy on Singapore and Malaysia, with additional capacity in Taiwan and Japan, to sustain growth in emerging technology sectors amid global supply chain shifts.