PCD&F
Amphenol RF 2.92mm Solderless PCB Connectors
The 2.92mm solderless PCB connectors support high-frequency stripline and microstrip applications to 40GHz. Available as vertical PCB jacks, the connectors use a threaded interface to eliminate solder joint variability and maintain consistent connector-to-PCB contact. Support impedance control across different PCB stackups while allowing installation, removal and reuse during prototyping and validation. Constructed with passivated stainless steel bodies, gold-plated beryllium copper contacts and ULTEM insulators. For microwave, millimeter-wave, test and measurement, aerospace, defense and advanced communications applications.
Amphenol RF
Boardera Decode API Manufacturing Automation Platform
Decode API manufacturing automation platform supports integration of PCB fabrication, assembly and quoting workflows into ERP, customer-facing and manufacturing systems. Processes Gerber and ODB++ design packages to extract stackup, board dimension, drill, DfM and fabrication data while supporting BoM analysis, component sourcing, assembly planning and pricing. Returns structured manufacturing data for fabrication, assembly and turnkey production estimates. Includes SpeedDfM analysis, version-controlled JSON schema support, BoM sourcing automation and assembly planning capabilities for quoting and manufacturing workflows.
Boardera
Electroninks EI-1169 Conductive Ink
EI-1169 UV-curable silver conductive ink supports inkjet deposition for printed electronics, semiconductor packaging and additive manufacturing applications. Polymer-free metal-organic decomposition (MOD) formulation provides adhesion on copper, epoxy and polyimide substrates while supporting low-temperature processing and stable jetting performance across industry-standard printheads. Supports UV curing at 365nm and 395nm wavelengths and is lead-free and halogen-free. Combines long shelf stability, repeatable print performance and scalable processing for digitally manufactured electronics, EMI shielding and advanced interconnect applications.
Electroninks
Ignys RapidJig PCB Test Fixture Design Tool
RapidJig PCB test fixture design tool automates creation of bed-of-nails test fixtures from Gerber design files. Generates CNC-ready manufacturing packages including Excellon drill files, G-code, STL models and engineering documentation. Supports common spring probe types and automatically configures drill dimensions based on probe selection. Provides live cost estimation, bill-of-materials generation and local file processing to keep design data on the user’s machine. Compatible with RS-274X, X2 and X3 Gerber formats and operates directly in a web browser without installation.
Ignys
Keysight Pro XA6 SA6320A and Expert XA5 SA6210A Signal Analyzers
Pro XA6 SA6320A and Expert XA5 SA6210A signal analyzers support wideband wireless, 5G NR, WLAN, radar and millimeter-wave design validation. Pro XA6 SA6320A provides up to 8GHz analysis bandwidth, frequency coverage to 67GHz, full preselection and GPU-accelerated 5G NR demodulation. Expert XA5 SA6210A offers swept measurements to 32GHz, up to 2GHz analysis bandwidth and dual-channel RF analysis for MIMO, ultra-wideband and radar applications. Feature advanced error vector magnitude measurements, wide-resolution bandwidth support, dual-receiver architecture and compatibility with legacy X-Series SCPI command sets.
Keysight Technologies
Rohm AG16xFNxx Series 80V Mosfets
AG16xFNxx Series 80V automotive Mosfets support 48V vehicle power systems, including inverter control circuits, electric motors and electric water pumps. Come in compact HPLF5060 and DFN3333 packages to reduce board space requirements compared with conventional automotive MOSFET packages. Copper clip junctions are said to enhance heat dissipation and high-current operation. HPLF5060 devices feature gull-wing leads, while DFN3333 devices incorporate wettable flank technology for solder joint inspection and reliability. AEC-Q101 qualified.
Rohm Semiconductor
Stackpole TNC Series NTC Thermistors
TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Come in 0402, 0603 and 0805 case sizes with resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K and operating temperatures to 150°C. Utilize thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and increase resistance to cracking compared with multilayer thermistors. Feature thermal response, solderability, heat resistance and AEC-Q200 qualification.
Stackpole Electronics
Vishay IHDV Series Power Inductors
IHDV Series power inductors support automotive, energy and industrial applications requiring isolation voltages to 1.5kV. Available in automotive-qualified and commercial versions, the devices feature powdered iron alloy cores for soft saturation characteristics and continuous operation to 180°C. Offered in 0808 and 1008 case sizes for onboard chargers, battery charging circuits, power factor correction and high-voltage DC battery filtering. Automotive models are AEC-Q200 qualified, while all devices are RoHS-compliant, halogen-free and include support pins for shock and vibration resistance.
Vishay Intertechnology
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CA
CE3S Vision LUXO Benchtop Magnifiers
Vision LUXO benchtop magnifiers provide magnification and task lighting for assembly, inspection, rework and production applications. Combine precision optics with Luxo’s K-arm positioning mechanism for distortion-free viewing, smooth adjustment and stable positioning during detailed manufacturing tasks. Five-year warranty. Intended for electronics manufacturing environments requiring enhanced visual inspection, operator comfort and workstation flexibility.
CE3S
ce3s.productionsupplystore.com
Collective Mind Vision AI Label Reader
Vision AI label reader automates label inspection, identification and data capture for goods-in and logistics operations. Uses AI-based image analysis to extract and interpret printed text, 1D and 2-D codes, and handwritten information across varying label formats, languages and code types. Powered by an IDS uEye CP industrial camera and engineered to handle reflective packaging, damaged codes and changing lighting conditions. Supports ERP integration, automated validation, traceability and inventory management workflows.
Collective Mind
Creative Electron TruView Prime SDX X-Ray
TruView Prime SDX benchtop x-ray inspection system combines 2-D x-ray, 2.5D imaging and SDX Planar CT capabilities in a compact platform for electronics manufacturing inspection. Features a 20″ × 20″ inspection area for large BGAs, stacked packages, bottom-terminated components and complex assemblies. AI-powered analysis tools automatically measure solder quality metrics including BGA and pad voiding. Supports quality control, process development and failure analysis with repeatable planar CT workflows and saved inspection parameters.
Creative Electron
Dow Dowsil TC-3120 Thermal Gel
Dowsil TC-3120 thermal gel is a silicone-based thermal interface material for optical modules, dense electronics and high-speed data applications. Provides thermal conductivity of approximately 12W/m·K while minimizing oil bleeding and condensed outgassing to maintain optical-grade cleanliness. Flowable one-part material supports bondline thicknesses as low as 200µm, fills large gaps and can be reworked after curing. Intended for 800G and 1.6T optical modules, telecommunications equipment, autonomous vehicles and electronic control systems.
Dow
Fuji Auto Kitting Station
Auto Kitting Station automates tape reel loading for SMT feeder preparation and integrates with Fuji NXTR A placement machines, Smart Storage systems, AMRs and automated warehouses. Automates reel removal, reel identification, tape preprocessing and feeder loading for 8mm tape components. Intended for high-mix, low-volume manufacturing environments where frequent product changeovers impact labor and efficiency. Supports integration of storage, transport, kitting and placement operations to advance automated SMT production workflows.
Fuji Corp.
Magnalytix OE in a Box Process Qualification Kits
OE in a Box Full Process Kit and OE in a Box High Density Kit support IPC J-STD-001 objective evidence generation and assembly process qualification for electrochemical reliability. Include test cards, taped-and-reeled components, SIR testing services and certificates of compliance upon successful completion. Support qualification of top- and bottom-side SMT assemblies, multiple soldering processes and conformal coating applications.
Magnalytix
Master Bond MasterSil 981-LO Low-Outgassing Silicone
MasterSil 981-LO low-outgassing silicone supports bonding, sealing, coating and encapsulation applications requiring optical clarity and flexibility. Two-component addition-cured system meets NASA low-outgassing specifications and is for aerospace, satellite, optical and optoelectronic applications. Features Shore A hardness of 20-30, elongation of 200-300%, operating temperatures from -65° to +400°F, dielectric strength of 450V/mil and volume resistivity greater than 10¹⁴ ohm-cm. Bonds to metals, glass, plastics, ceramics and silicone rubbers.
Master Bond
TM Soldering EmberX Selective Soldering Control Software
EmberX selective soldering control software supports programming, process control and monitoring for PHOENIX selective soldering platforms. Provides visual programming, onboard PCB image capture, HD video monitoring, customizable data collection and automated process validation tools. Supports wave height verification, nitrogen quality analysis, closed-loop preheating, maintenance tracking, fiducial correction and panelized board processing. Intended to reduce setup time and improve production consistency in manual and inline selective soldering environments.
TM Soldering Solutions
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