Cern Releases Open Source KiCad Component Library

GENEVA – Cern released its complete KiCad component library under an open source license, making more than 17,000 electronic component symbols and footprints available to PCB designers worldwide.

The library supports KiCad, the open source PCB design software suite, and includes the same component resources used internally by Cern hardware designers. Cern said the release aligns with its broader open science and open hardware initiatives.

The organization added that engineers can now access, modify and redistribute the library within open PCB design workflows.End of article content 

PTC Integrates Onshape with Altium for Cloud PCB Collaboration

BOSTON – PTC integrated its Onshape CAD platform with Altium to improve cloud-based collaboration between electrical and mechanical engineering teams.

The connector enables PCB designs created in Altium to transfer directly into Onshape while synchronizing updates between both platforms in real time. PTC said the integration eliminates manual file transfers and format conversions traditionally required in ECAD-MCAD workflows.

The system supports browser-based access and is intended to improve enclosure verification, design review and engineering change management throughout product development.End of article content 

Doosan Invests $135M in Thailand PCB Materials Facility

ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new copper clad laminate production facility in Thailand to support growing AI infrastructure demand.

The 73,000sqm site will produce CCL materials used in PCB manufacturing for high-performance computing and semiconductor applications. Construction is expected to begin this year, with mass production targeted for the second half of 2028.

Doosan said the investment will expand production capacity for PCB materials as AI data center demand accelerates globally.End of article content 

Ventec Evaluates US Manufacturing Expansion for PCB Materials

PINGZHEN CITY, TAIWAN – Ventec International Group is evaluating the potential establishment of a US manufacturing facility focused on high-performance laminate and prepreg materials for mission-critical PCB applications.

The proposed facility would support aerospace, defense, industrial and medical markets while strengthening regional supply chain resilience and localized manufacturing capabilities. The evaluation is part of Ventec’s broader “China + Taiwan Plus One” strategy aimed at diversifying production and improving supply continuity.

Comments from industry sources suggest that the laminates maker is strongly considering Arizona for the site.

The company said any final investment decision remains subject to board approval.End of article content 

ASE, Wus to Team on Advanced Packaging Manufacturing Plant

KAOHSIUNG, TAIWAN – Advanced Semiconductor Engineering (ASE) and Wus Printed Circuit in May announced a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park here. The two companies plan to jointly deploy resources to expand advanced manufacturing capacity that will reinforce Taiwan’s critical position in the global semiconductor value chain.

The new facility will focus on advanced packaging processes, including fan-out chip on substrate (FOCoS) and flip chip ball grid array (FCBGA) technologies to serve the emerging AI, cloud computing and autonomous driving applications. The facility will also integrate automation and smart manufacturing processes, the companies said in a joint release.

“This landmark agreement is a strategic collaboration between ASE and WUS to improve land use efficiency and allow ASE to expand our manufacturing capacities to meet market demands,” said Mike Hung, executive vice president, ASE. “We are also excited to establish a new benchmark for future collaborative industrial development.”End of article content 

Flex to Spin Off AI Infrastructure Business, Targets 75% Growth

AUSTIN, TX – Flex announced plans to spin off its cloud and power infrastructure segment into a standalone public company focused on AI data center infrastructure, power management and thermal technologies.

The new company, referred to as SpinCo, will focus on digital and electrical infrastructure systems for AI and mission-critical applications, while Flex continues operating as an advanced manufacturing provider serving healthcare, automotive, industrial, communications and lifestyle markets.

Flex said the transaction is expected to close during the first quarter of calendar 2027. Revathi Advaithi will become CEO of SpinCo while remaining chairman of Flex during a transition period, with Michael Hartung set to take over as CEO of Flex.

The company is targeting approximately 65% to 75% revenue growth for SpinCo in fiscal 2027, accelerating to more than 80% in fiscal 2028 as AI infrastructure spending continues to rise.End of article content 

Wislab EMS Buys Fremont Headquarters for $61M

FREMONT, CA – Wislab EMS purchased its headquarters and manufacturing facility in Fremont for $61 million, expanding its long-term manufacturing presence in Silicon Valley.

Property records filed May 5 show the EMS provider acquired the 126,000 sq. ft. facility through an all-cash transaction. The company said it currently employs at least 125 workers at the site and is actively hiring across engineering, procurement and manufacturing operations.

Wislab manufactures PCBs and electronics products supporting mission-critical computing, networking, storage and communications applications.End of article content 

Industry Coalition Pushes Congress to Extend Semiconductor Tax Credit

WASHINGTON, DC – A coalition of 18 business and trade groups led by the Semiconductor Industry Association is urging Congress to extend and expand the Advanced Manufacturing Investment Credit beyond its scheduled 2026 expiration.

The groups called for the semiconductor production tax credit to also support semiconductor design and research and development activities. The coalition represents industries spanning semiconductors, AI, aerospace, cloud computing, wireless communications, medical technology and manufacturing.

Industry organizations said extending the incentive would encourage additional domestic investment, strengthen supply chain resilience and reinforce US competitiveness in advanced technologies.End of article content