recognition
CIRCUITS ASSEMBLY in late January announced the 2023 New Product Introduction Award winners for electronics assembly equipment, materials and software.
The 16th annual NPI Awards recognized leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients. The awards were presented during a ceremony in San Diego.
The 2023 winners are:
Scienscope Automation Tools (5100c III X-Ray Component Counter)
Surfx Technologies Cleaning Equipment (STA-10 Automated Plasma System)
Europlacer Component Placement – Accessory Technologies (Freeform Feeder)
ASYS Group Component Storage (Reel-Magazine)
ITW EAE Dispensing Equipment (ITW Camalot Prodigy Advanced Tilt and Rotate)
Selectech ESD (SelecTile ESD Interlocking Flooring)
Aven Tools First Article Inspection (Mighty Vue Inspector)
Koh Young Process Control Tools (Neptune C)
ASMPT Screen and Stencil Printing (DEK TQ L Printing Platform)
Stentech Screen/Stencil Printing Peripherals/Consumables (Advanced Nano Stencil Coating)
Koh Young Software – Process Control (KPO Printer Software)
ASYS Group Software – Production (Extended ASYCAM Software)
Smartsol Soldering – Alternative (SMarTsol Soldering Robots)
Weller Tools Soldering – Hand Tool (WXair Rework Module)
ECD Soldering – Process Control (MOLE EV6 Thermal Profiler)
SASinno Americas Soldering – Selective (Unit-i1 Selective Soldering Machine)
ITW EAE Soldering – Wave (Auto Exit Wing)
Indium Cored Wire (CW-818 Fast Wetting, No-Clean Cored Wire)
Shenmao Solder Paste (PF918-PW216 Solder Paste)
Saki Corp. Test and Inspection – AOI (3Di Series)
Magnalytix Test and Inspection – Functional Test (OE-300)
Henkel Thermal Interface Materials (Bergquist Liqui Form TLF 10000)
“Printed circuit assemblies are getting smaller and tighter,” said Mike Buetow, president, Printed Circuit Engineering Association, in announcing the awards. “The judges this year focused on tools with the flexibility and accuracy needed to support this ongoing trend.”
“As a materials supplier, our belief that materials science can change the world is present in every one of our products,” said Robert McKerrow, senior product specialist for Indium Corp.’s Wave Soldering and Flux-Cored Wire products. “By earning this recognition for its unique combination of soldering speed and spread combined with overall cleanliness, we’re eager for CW-818 to make its mark on the industry as a proven product.”
“We are thrilled to receive this prestigious annual award from CIRCUITS ASSEMBLY in recognition of our innovative work in automated optical and x-ray inspection technology,” said Craig Brown, newly appointed general manager of Saki America. “Our R&D team works tirelessly to develop unique solutions that meet the need for fast precision inspections of rapidly evolving component technologies. We believe this award is not only a testament to their dedication but also serves as a reminder of Saki’s commitment to providing reliable and innovative solutions for our customers around the world.”
For more information on the CIRCUITS ASSEMBLY NPI Awards, click here. 
