PCEA Announces UHDI Forum at PCB East

PEACHTREE CITY, GA – PCEA’s first UHDI & Substrates: Design to Package Forum will be held on June 5, in conjunction with PCB East in Boxborough, MA.

UHDI, or ultra high-density interconnect, describes lines and spaces of less than 25 microns on a printed circuit board. Among the presentations are talks on standards, electrohydrodynamic (EHD) printing, direct imaging for less than 15 microns, a new mSAP process, a new replacement for ABF (Ajinomoto Build-Up Film), planning a new UHDI facility, and new materials for UHDI.

Each presentation will be 30 minutes. The program will close with a panel discussion.

The forum is chaired by Gene Weiner of Weiner International Associates. Peter Bigelow, president of FTG East, and Alun Morgan, technology ambassador of Ventec and president of the European Institute for the PCB Community (EIPC) are vice chairmen.

“Rapid technical progress and major dollar commitments are being made in the US and Europe to establish sustainable, secure sources of organic substrates and UHDI circuitry for advanced electronics packaging,” said Weiner. “This forum is designed to present new design, process, material, and equipment capability information that delegates can immediately put to use.”

“The industry has begun to recognize the need for – and challenges of – UHDI technology,” added Mike Buetow, president of PCEA and conference chair of PCB East. “Gene Weiner and his colleagues have put together an outstanding program that will look at the state-of-the-art and the requirements for implementation.”

PCEA Training Announces Spring PCB Design Classes

PEACHTREE CITY, GA – PCEA Training is offering two upcoming five-day training classes starting in April and June for printed circuit engineers, layout professionals, and other individuals currently serving in the design engineering industry or seeking to get into it. The classes include an optional certification exam recognized by the PCEA.

Upcoming class dates include:

• Class 1: April 5, 12, 19, 26, and May 3
• Class 2: June 14, 17, 21, 24, 28

These instructor-led classes cover the gamut of printed circuit design engineering, from layout, place and route to specifications and materials to manufacturing methods. Schematic capture, signal integrity and EMI/EMC are also part of the comprehensive program.

There are no prerequisite requirements to enroll. Upcoming classes will be held online. All courses are led by experienced instructors.

Registration fees include the 400-page handbook, Printed Circuit Engineering Professional, authored by Michael Creeden, Stephen Chavez, Rick Hartley, Susy Webb and Gary Ferrari.

For information about the instructors of the course and authors of the course material, visit pceatraining.net/instructors-authors.

For information about the course overview, class format, and materials to prepare in advance for the class, visit pceatraining.net/course-overview.

To apply, visit pceatraining.net/registration for the next available class or contact Mike Buetow at pceatraining@pcea.net for additional information.