Flex, IC Substrates Demand Give Cheer to Japan PCB Market
TOKYO – Printed circuit board production in Japan in February fell 9.3% from a year ago, falling to 757,000 sq. m. It was the 25th straight month of decline.
Sales fell 11.4% to 44.3 billion yen ($286 million), down the 16th month in a row. The year-over-year drop has reached double digits in 12 straight months.
The data include production of rigid and multilayer boards, flexible circuits and IC substrates, and are tabulated by the Japan Electronics Packaging Circuits Association (JPCA).
Rigid PCB production fell 13.9% from a year ago to 594,000 sq. m., the 24th consecutive month of decline, and revenue dropped 3.9% to 28.6 billion yen ($182.6 million), down for the 18th straight month.
Flex circuit production, a bright spot, rose 9.1% to 118,000 sq. m., reversing nine months of declines. Sales were up for the second straight month, rising 8.8% to 2.62 billion yen ($16.7 million).
IC substrate fabrication jumped 23% to 45,000 sq. m., the fifth consecutive rise. Sales were down for the 11th straight month, dropping 26.6% to 13.1 billion yen ($83.6 million).
Through February, PCB production in Japan was down 13% to 1.4 million sq. m., and sales were off 15.4%, at 83.7 billion yen ($534.4 million).
Rigid board production was down 17%, offset in part by a 4.2% increase in flexible demand and an 18% jump in IC substrates.
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