PCD&F
SnapChip AI-Powered Search Engine
X-Refs.com AI-powered cross-reference search engine for electronic components ensures up-to-date part suggestions and seamless integration. Leverages proprietary engine to generate real-time, original cross-references by analyzing specifications, packaging and compliance data for over 50 million components. Provides fresh, accurate results by accessing the latest data directly from distributors, manufacturers and datasheets.
SnapChip
Vishay VEML6046X00
VEML6046X00 first AEC-Q100-qualified RGBIR color sensor comes in 2.67 × 2.45 × 0.6mm package. Integrates photodiode, low-noise amplifier and 16-bit ADC, enabling color temperature calculation and operation behind dark cover glass. Ambient light range up to 176 klx and sensitivity of 0.0053 lx/ct ensures accurate measurements without daylight saturation. For automotive applications. Supports I²C communication and operates at temperatures up to +110°C.
Vishay
Vishay LTO 150H Thick-Film Power Resistor
LTO 150H resistor handles higher pulse energy for protection in high-stress environments. Absorbs up to 75J/0.1s and dissipates at 150W at 45°C, with low thermal resistance for stability. Supports resistance values from 1Ω to 2.2 kΩ and operates at up to 175°C in EV, industrial and telecom systems.
Vishay
CA
AGC Silicone Tape
Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes. Heat-resistive silicone adhesive coating provides versatile, cost-effective option for securing small components like FPC to carrier jigs. Offers high dimensional stability, maintaining its properties at temperatures up to 260°C. Can be reused multiple times without leaving adhesive residue. Comes in various adhesion levels, for a range of applications in electronics manufacturing and assembly processes.
AGC Multi Material
BEST StencilQuik
StencilQuik custom stencil is for ball grid array (BGA) and chip-scale package (CSP) placement. Made from polyimide film with high-temperature, residue-free adhesive. Is said to ensure secure alignment and integrate seamlessly into PCB assemblies. Addresses solder mask damage, permitting direct placement over affected areas without additional repairs. Tested to IPC-7711 standard. Meets surface insulation resistance requirements.
BEST Inc.
CE3S Millice StripAid X Series
CE3S Millice StripAid X series biodegradable solvent removes WaferGrip and TrueGrip adhesives. Suitable for wafer thinning, ultrasonic agitation and high-temperature debonding. Enables safer, cleaner semiconductor processes with simplified storage.
CE3S
Cetec ERP Version 4.16–4.18
Cetec ERP versions 4.16, 4.17 and 4.18 introduce tools to streamline shop floor scheduling, optimize inventory use and improve communication. New drag-and-drop Gantt charts enhance flexibility in production planning. Historical demand reports help eliminate obsolete inventory and reduce carrying costs. Split Helper tool simplifies work order divisions to support schedule adjustments. Inspection failure reports detect quality trends to drive corrective actions. Work location demand reports track material usage by station to prevent bottlenecks. Real-time status updates align teams across departments and improve workflow visibility.
Cetec ERP
Count On Tools ASM Surface Mount Gripper Technology
Gripper technology designed for ASM surface mount machines enables component handling ranging from 2.0-6.0mm. Securely grasps and places delicate, irregularly shaped or nonstandard components that traditional vacuum-based pick-and-place heads struggle with. Is said to prevent component damage while maintaining fast, accurate placement across various applications.
Count On Tools
Count On Tools OEM Replacement Nozzles
Nozzles for Juki 460 Cube and Seho PowerSelective/SelectLine selective soldering machines are designed to improve solder flow and reduce maintenance. Are machined to enhance operational efficiency and the lifespan of soldering equipment.
Count On Tools
Master Bond UV15-7HP Adhesive
UV15-7HP low viscosity, easy to apply, one-part, UV curable adhesive cures rapidly with a minimum intensity of 20-40mW/cm2 using a UV light source emitting at a wavelength of 320-365nm. Also curable in sections up to 0.125″ thick under appropriate conditions, for bonding, sealing, coating and encapsulation. Features tensile strength of 6,000-7,000psi and tensile modulus of 250,000-300,000psi at room temperature. Resists thermal cycling and offers elongation of 5-10%. Is electrically insulative, with a volume resistivity greater than 1014ohm-cm. Optically clear with a refractive index of 1.54 at 589nm, is not oxygen inhibited and contains no solvents or diluents. Bonds well to glass, ceramics, metals and many plastics. Operating temperature range is -80° to 300°F.
Master Bond
ULT LAS 260.1 MD.14 Fume Extractor
LAS 260.1 MD.14 laser fume extraction system is designed for quiet operation and energy efficiency. Features MD.14 EC fan and proprietary power consumption reduction technology said to cut power by up to 60% while maintaining high airflow. Supports range of laser processes across materials like metal, plastic and glass. Multistage filtration system – including pre-filter, HEPA filter and activated carbon filter – ensures separation efficiency, with optical signals indicating filter status. Contamination-free filter replacement. Plug-and-play installation, customizable communication interfaces and a variety of accessories.
ULT
Robotas Mascot Systems Through-Hole Assembly System
Mascot Systems manual through-hole assembly system replaces axial, radial and DIP insertion machines. Features include 360° clinching, laser-guided assembly, and optional camera verification to reduce rework.
Robotas Technologies
Saki 3Xi-M200 AXI Software
3Xi-M200 AXI has upgraded software that improves solder joint defect detection for power modules, including those with thick baseplates and heat-dissipating finned structures. Adjusts for brightness fluctuations resulting from structural height variations within a module, for clearer, more stable imaging, particularly in complex modules.
Saki Corp.
Yamaha YSUP-PG Programming Module
YSUP-PG programming module now features automated programming capabilities said to streamline program generation for all surface-mount processes, including dispensing, printing, placement and inspection. Optimizes programs without the need for producing test assembles to verify correct settings. Generates programs for each machine, using standard data sources such as PCB Gerber file, assembly CAD data and component libraries, accelerating beginning of production. Presents unified framework and graphical environment for programming, optimizing and monitoring Yamaha equipment. Enables line customization for each process, including optional features such as dispensing head, placement head and inspection camera resolution.
Yamaha Robotics SMT Section
