In Case You Missed It
Additive Manufacturing
“Three-Dimensional Printing of Nanomaterials-Based Electronics with a Metamaterial-Inspired Near-Field Electromagnetic Structure”
Authors: Jian Teng, et al.
Abstract: Three-dimensional (3-D) printing can create freeform architectures and electronics with unprecedented versatility. However, the full potential of electronic 3-D printing has so far been limited by the inability to selectively anneal the printed materials, especially on temperature-sensitive substrates. Here, the authors achieve highly selective and rapid volumetric heating of 3-D-printed nanomaterials and polymers in situ by focusing microwaves using a metamaterial-inspired near-field electromagnetic structure (Meta-NFS). In contrast to previous work, the Meta-NFS achieves the spatial resolution and power density needed to 3-D-print freeform microstructures, enabling local programming of electronic and mechanical properties even within optically opaque materials. By broadening the material palettes compatible with 3-D printing, near-field microwave 3-D printing with Meta-NFS enables classes of electronics that are otherwise challenging to create. (Science Advances, Feb. 6, 2026, vol. 12, no. 6, https://www.science.org/doi/10.1126/sciadv.adz7415)
“Combined In-Solution and On-Surface Synthesis of a Fully Fused Cross-Shaped Phthalocyanine Pentamer”
Authors: Luis M. Mateo, et al.
Abstract: Scientists are getting closer to building materials one molecule at a time, a long-standing goal that could reshape electronics, energy systems, and sensing technologies. At the heart of this effort are flat, carbon-rich molecules known for their ability to move electrical charge efficiently. These structures already appear in devices like solar cells and chemical sensors, but researchers have been searching for ways to push their performance even further.
One promising idea is to connect multiple molecules into larger networks so they behave like a single, more powerful system. In theory, this extended structure can improve how electrons flow, which is critical for faster and more efficient devices. In practice, though, making these larger assemblies has been a major obstacle. As molecules grow, they often stop dissolving in liquids, which makes them difficult to synthesize using standard chemical techniques. (Angewandte Chemie International Edition, Dec. 18, 2025; scitechdaily.com/scientists-build-five-in-one-super-molecule-for-next-gen-electronics)
Materials
“Sustainable Polyurethane-based dielectric composites from Industrial and E-waste for High-voltage Insulation Applications”
Authors: Vinoth Kumar Selvaraj, et al.
Abstract: The growing demand for sustainable materials in electrical and electronic applications has led to the reuse of industrial and electronic waste in high-performance polymer composites. In this study, rigid polyurethane foam waste (WRPU), recycled tire waste (RTW), and printed circuit board (PCB) scraps were incorporated as fillers into a polyurethane matrix using methylene diphenyl diisocyanate (MDI) as a binder. The composites were fabricated via mechanical stirring followed by hydraulic compression. Response surface methodology (RSM) using a central composite design (CCD) was employed to optimize the filler composition for dielectric performance. The optimal formulation – 15.94 wt% WRPU, 3.0 wt% RTW, and 10.0 wt% PCB – achieved a dielectric constant of 4.45. Confirmation experiments and simulations using COMSOL Multiphysics yielded values of 4.33 and 4.50, respectively, with minimal error margins. FTIR confirmed functional group integration, HR-SEM revealed uniform filler dispersion and strong interfacial bonding, and TGA indicated improved thermal stability. The results highlight the dielectric potential of recycled polymer composites as environmentally friendly dielectric materials, although further studies are needed on breakdown strength, dielectric loss and resistivity for assessing high-voltage insulation applications, such as battery cell separators and power systems. (Scientific Reports, Apr. 6, 2026, https://doi.org/10.1038/s41598-026-38515-6)
“Intrinsically Stretchable Complementary Circuits Based on Direct Photo-Patternable Polymer Semiconductors”
Authors: Qianhe Liu, et al.
Abstract: Intrinsically stretchable electronics have shown potential in applications ranging from wearable health monitors to soft robotics. However, despite recent developments in material design, processing techniques and bio-integration, the fabrication of complementary circuits using scalable methods remains challenging. Here, the authors report intrinsically stretchable organic complementary circuits that are solution-processed and based on direct photo-patternable polymer semiconductors. By covalently embedding a high-performance n-type polymer semiconductor inside an elastomer matrix, the authors fabricate fully stretchable transistors with electron mobilities of 0.28cm2 V−1 s−1 under 100% strain. Furthermore, with a covalent functionalization strategy on the p-type polymer semiconductor layer, the authors demonstrate successive, direct photo-patterning of n-type polymer semiconductors without electrical degradation on the existing p-type. The authors use this approach to fabricate intrinsically stretchable logic gates and ring oscillators with stable performance up to 100% strain at a low operating voltage of 2V. (Nature Electronics, Apr. 15, 2026; https://doi.org/10.1038/s41928-026-01599-z)End of article content