PCD&F
AGC Meteorwave ELL PCB Materials
Meteorwave ELL multilayer PCB materials are said to achieve low transmission loss and high thermal resistance. Contribute to higher capacity, higher transfer rates and lower power consumption of data communication, with reliability in high-temperature environments and UL-94 V0 certification. Come in a variety of prepregs and constructions and are for use in applications such as telecommunications, core routers, high speed switching/routing systems, cloud storage, aerospace, automotive, radar and AI.
AGC
Hirose FH75M FPC/FFC Connector
FH75M series flexible printed circuit/flat flexible connector supports MIPI D-PHY (1.5Gbps) and eDP1.3 (5.4Gbps) specifications in a miniature footprint. Features a 0.4mm pitch and 2mm height and uses a two-point contact design with two independent springs that provide a wiping action to prevent contact failure from dust, dirt and other contaminants. Operating temperature of up to 125°C. Meets automotive requirements for shock and vibration resistance, hydrogen and sulfur gases, humidity and corrosion. Uses a flip lock with FPC tab and housing side catches that offer a retention force of 51.4N and delivers easy FPC insertion while emitting a clear tactile click to confirm complete locking. User-friendly design has wide tapers that provide smooth FPC insertion, and comes in 100-position version that is halogen-free and RoHS compliant.
Hirose Electric
Hirose TF70 FPC/FFC Connector
TF70 two-piece FPC/FFC-to-board connector is designed for harsh environment applications including automotive. Features a center lock design that permits one-handed insertion and removal and a locking strength of more than 40N. Includes guide key to prevent misinsertion and a clear tactile click to indicate complete and proper mating. Pitch is 0.5mm and design reduces size and weight of end-products. Operating temperature is -40° to +105°C, and comes in right angle and straight angle connection methods.
Hirose Electric
InstaDeep DeepPCB Pro ECAD
DeepPCB Pro PCB design tool uses AI to automate, optimize and accelerate the design process from start to finish. AI automation is said to simplify complex PCB design tasks, such as placement and routing, using reinforcement learning techniques. Enhances design cycles to allow faster product development and quicker time to market. Is built on Google Cloud.
InstaDeep
Number One Systems Easy-PC v.28 ECAD
Easy-PC v.28 PCB design tool features more than 40 new enhancements. New features include an updated user interface that includes a “flat” look, improved toolbars and a utilities menu to simplify the design experience, plus enhanced tools for library creation and editing that now include support for .epl format files, improved symbol editing and access to over 15 million components. Other new features are flip vertical mode, rotate around center, and text cutout creation for copper layers, and upgraded geometry checks and a reorganized DRC dialog to for more accurate and stable designs. New tools for drill ident creation, automatic plot generation and enhanced via handling.
Number One Systems
Pulsonix 13.0 CAD
Pulsonix v.13.0 PCB design tool features improved ECAD/MCAD process along with other new features. Introduces bidirectional IDX collaboration interface said to enable seamless data exchange from ECAD to MCAD to provide incremental design exchange and eliminate the need for large design transfers each time a change is made. Allows changes to be tracked and reviewed with each action accepted or rejected. Enhanced 3-D engine provides photorealistic render of PCB design and enables additional parameters when designing rigid-flex boards. Dynamically calculates trace width based on impedance.
Pulsonix
TTM Xinger UWB Balun Transformers
XMB0220K1-50100G (0.18-1.9GHz) and XMB0465Z1-50100G (0.4-6.5GHz) balun transformers offer common-mode rejection ratio, for efficient signal conversion. XMB0220K1-50100G is for test and measurement, telecom and COTS mil-aero applications. Enables single-ended signals to be applied to differential ports on analog-to-digital and digital-to-analog converters and integrated RF chipsets used in radar to IoT sensors. XMB0465Z1-50100G is an 1008-sized, low-profile balun, for high-level integrations for 5G, LTE and aero radar, as well as L-, S- and C-Band in communications and mil-aero markets. Also enables single-ended signals to be applied to differential ports on integrated RF chipsets.
TTM Technologies
Vishay High-Rel Power Inductors
Commercial IHLL-1008AB-1Z and automotive-grade IHLP-1008ABEZ-5A inductors come in 2.5mm x 2mm x 1.2mm 1008 case size. Offer higher operating temperatures up to +165°C, a range of inductance values and lower DCR. IHLL-1008AB-1Z features terminals plated on the bottom only, enabling a smaller land patter, and offer inductance values from 0.33µH to 4.7µH. IHLP-1008ABEZ-5A features terminals plated on the bottom and sides, permitting formation of a solder fillet with strength against high mechanical shock while simplifying inspection. AEC-Q200 qualified, typical DCR as low as 12.0mΩ.
Vishay Intertechnology
Vishay 299 PHL-4TSI Capacitor
299 PHL-4TSI series of snap-in, four-terminal aluminum electrolytic capacitors now features 350V, 500V, 550V and 600V rated capacitors. Feature cylindrical aluminum case with pressure relief, insulated with a blue sleeve, for ripple current ratings from 1.9A to 7.6A. Have a 105°C temperature capability and useful life of >5000 hr. Can replace banks of large screw terminal capacitors connected by a busbar with smaller parts connected by a PCB, lowering construction costs and enabling soldering processing instead of manual mounting. Also limit the number of components required with larger can sizes than standard two-terminal snap-in capacitors – ranging from 35mm x 50mm to 45mm x 100mm.
Vishay Intertechnology
CA
CheckSum ILS-X2 Multi-Tester
ILS-X2 dual panel automated test system is said to effectively double parallel test output by supporting the handling and testing of two panels simultaneously. Enables more tests to be performed in parallel, integrating ICT, ISP and parallel functional tests like LIN, CAN, BIST, current, voltage and others.
CheckSum
Emil Otto EO-B-016 Fluxes
EO-B-016 flux series now includes versions with different solids content. EO-B-016A features 2% solids, EO-B-016B has 3% solids and EO-B-016C has 4% solids. Are all high-efficiency no-clean fluxes based on alcohol with di-carboxylic acid activator complex and synthetic resin, and can be used in wave, selective and hand soldering processes as well as in dip soldering and strand tinning. Applicable using all standard application methods except foaming and are said to be versatile and OPS-compatible.
Emil Otto
Inspectis Extended Reach BGA-XL Stand
BGA-XL stand allows inspection of ultra-low clearance BGAs, and optional new XM lenses provide up to 285X screen magnification. Is designed for small standoffs, e.g., 200µm, and very small ball arrays. When coupled with new extended reach BGA-XL stand for larger boards, provides greater reach, power and capability. Consists of a lens (standard or XM) plus a probe tip (standard or small), and new XM higher power lens is compatible with standard and small probe tip, which features a 27% smaller footprint. Side-view BGA inspection system comes with built-in high-power lighting and high-resolution 90° viewing angle. Mechanical improvements to BGA camera stand make the platform more stable and improve the mechanism that reduces risk of prism damage.
Inspectis
ITW EAE Centurion Reflow Heavy Board Option
Vitronics Soltec Centurion 1240 reflow soldering oven now includes new heavy board options. Enhance CT 1240’s capabilities by handling of heavier boards while boosting throughput of dense and heavy assemblies. Meet stringent industry requirements without increasing footprint, rather than extending oven length.
ITW EAE
MacroFab FabIQ Quoting Tool
FabIQ quoting tool provides accurate quotes in real time and automatically suggests engineer-reviewed alternates for unavailable parts. Is said to instantly price over 95% of assemblies with no human interaction and identify process changes and tooling that can save customers thousands of dollars automatically. Supports custom stackups up to 32 layers, various copper weights and surface finishes.
MacroFab
Master Bond EP3HT-LO Epoxy
EP3HT-LO is a single-component, non-premixed and frozen, heat-cured epoxy with an unlimited working life at room temperature. Passes ASTM E595 tests for NASA low outgassing. Features a lap shear strength of 1,600-1,800psi, a tensile strength of 5,000-6,000psi and a tensile modulus of 250,000-300,000psi. Withstands 1000 hr. of 85°C/85% RH exposure and features a Dk of 3.9 at 60Hz and a volume resistivity of greater than 1014Ω-cm at room temperature. Withstands a variety of chemicals such as water, oils, fuels, acids and bases and is serviceable from -60° to +400°F (-51° to 204°C). Cures with heat, polymerizing in as few as 5-10 min. at 300°F (~150°C), and is said to bond to metals, glass, composites, ceramics and many plastics.
Master Bond
Metcal MircroFine Soldering Products
MicroFine product line includes soldering handpieces and cartridge tips for use under microscopes. Come with soldering and tweezer handpiece configurations and are compatible with the Metcal MX Series and Connection Validation Series soldering systems. Offer fixed temperature process control featured in Metcal’s SmartHeat products, but in significantly smaller, lighter formfactors.
Metcal
MRSI-175Ag Epoxy Dispenser
MRSI-175Ag epoxy dispenser is an ultra-high-speed, flexible solution with multiple dispensing methods and materials. Can dispense silver-filled epoxies, conformal coating, sintering paste, thermal grease and UV adhesive, among others. Is said to be configurable for complex applications, such as microwave modules, optical modules, hybrid circuits, multichip modules, advanced packaging and semiconductor packaging. Also offers process control and is 35% more energy efficient than previous systems.
MRSI Mycronic
Shenmao PF719-P250A Solder Paste
PF719-P250A high-reliability lead-free alloy is said to provide anti-thermal fatigue performance. Is halogen-free (ROL0) with no halogen intentionally added, for compliance with RoHS, RoHS 2.0 and REACH regulations. Also reportedly offers voiding performance and resistance to multiple reflows while maintaining solderability and printability.
Shenmao
TRI TR7700QC SII AOI
TR7700QC SII 3-D AOI features user-friendly programming for easy setup, flexible IPC-A-610 inspection algorithms and optional AI-powered solutions. Also features a 12MP high-speed camera and offers four factory-setting configurations ranging from 10μm to 15μm. Can inspect THT components, and interactive 3-D models help review detected defects such as lifted BGA components, IC leads, connectors, switches and other mounted devices. Inspects tall (up to 40mm) and short components during same inspection. Supports IPC-CFX and Hermes.
Test Research, Inc
