PCD&F
Cadence OrCAD X 25.1 ECAD Software
OrCAD X 25.1 enables seamless collaboration between internal and external design teams with direct feedback, markup and review accessible via desktop and browser. Integrates Sigrity X SI and PI analysis earlier in the workflow to identify and resolve performance and reliability issues before late-stage rework. Adds PCB layout enhancements including true type font support, improved property panels and auto-define differential pairs for greater precision. Flexible licensing for single users across up to five machines and expands OrCAD X OnCloud features to simplify data sharing for distributed teams.
Cadence
Flux AI Design Agent
AI Design Agent automation tool converts text prompts into complete PCB designs. Interprets natural language instructions, plans multistep workflows and automates schematic generation, component sourcing, net connections and board routing. Built on machine-learning models trained on hundreds of thousands of layouts. Evaluates constraints, validates against engineering rules and refines results iteratively. Learns user preferences for future projects. Supports multi-board orchestration for parallel design execution. Fully integrated into Flux’s collaborative eCAD platform.
Flux
Vishay SMDY1 Capacitors
SMDY1 automotive-grade AC line-rated ceramic disc safety capacitor comes with a Y1 rating in a surface-mount package. Rated at 500VAC and 1500VDC with capacitance values up to 4.7nF. Targets EMI and RFI suppression in high-humidity environments including on-board chargers, traction inverters, battery management systems, e-compressors and AC/DC converters. Qualified to AEC-Q200 with PPAP support. Meets Class IIB humidity standards under IEC60384-14 and passes 85/85/1000h reliability test. Offered in C case (10mm creepage distance) and D case (14.5mm creepage distance). Encapsulated in flame-resistant epoxy resin (UL 94 V-0) with a copper-plated ceramic disc. RoHS-compliant and halogen-free.
Vishay
Vishay DLA 04051 Series Capacitors
DLA 04051 vPolyTan surface-mount chip capacitors are engineered to meet Defense Logistics Agency 04051 specifications for aerospace, military and space systems. Feature ESR down to 25mΩ for performance in power supplies, radars, radios, transponders and energy storage modules. Capacitance values from 4.7μF to 680μF and voltage ratings from 2.5V to 63V. Reliability validated through 2000 hr. of testing at 125°C. Mechanical performance includes 500g shock resistance, MIL-STD-202-204 Level D vibration compliance and 10 thermal shock cycles per MIL-STD-202-107.
Vishay
Vishay LTA 50 Power Resistor
LTA 50 AEC-Q200-qualified 50W thick film power resistor comes in a TO-220 package designed for direct mounting on a heatsink. Withstands temperatures up to +175°C, humidity, vibration and electrical stress for operation in harsh automotive environments. Offers resistance values from 0.010Ω to 450kΩ with tolerances down to ±1 %. For use as a precharge or discharge resistor in on-board chargers, battery management systems and motor controls for EV, HEV and PHEV applications. Features dielectric strength of 1500Vrms and limiting element voltage of 500V. RoHS-compliant and non-inductive.
Vishay
XJTAG XJExpress Series Flash Programmers
XJExpress and XJExpress-FPGA provide fast, flexible in-circuit flash programming for development, debug and production. XJExpress is a directly connected SPI flash programmer with intelligent erase, program and verify algorithms that reduce cycle times. Supports a wide range of SPI NOR flash devices in serial, dual and quad SPI modes with termination protection and multi-image support. Operable via GUI or command line. XJExpress-FPGA extends programming to FPGA and FPGA SoC environments through the JTAG port, achieving speeds typically limited only by the flash device. Configured for specific FPGA and flash combinations. Both integrate with the XJTAG ecosystem for use in bench testing or high-volume production.
XJTAG
CA
BTU Aurora 125N Reflow Oven
Aurora 125N convection soldering reflow oven combines flexible zone configurations, thermal control and optimized gas flow for uniform heating in high-mix electronics manufacturing. Enhanced accessibility simplifies maintenance, while the optional Aqua Scrub flux management system supports extended uptime and sustainable operation.
BTU International
Dymax 9773 Ruggedized Adhesive
9773 ruggedizing and staking adhesive secures and protects PCB components in satellites, missiles and other space-based systems. Certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Cures on demand under UV/visible light, eliminating delays from traditional two-part epoxies. Non-slumping for up to 72 hr. on vertical surfaces and compatible with jet dispensing for ruggedizing, staking or encapsulating. One-part, solvent-free and halogen-free formulation supports sustainability while maintaining performance.
Dymax
ioTech io600 CLAD System
io600 inline continuous digital laser material deposition (CLAD) system deposits up to 7.2 million dots per hour with a 600 × 600mm active work area, 50µm resolution and ±10µm positional accuracy. Nozzle-free, noncontact laser design is said to reduce clogging and maintenance for continuous operation and lower ownership costs. Supports polymers, solder pastes, conductive inks, metals and ceramics. Enables complex multilayer geometries and seamless scaling from prototyping to mass production.
ioTech
ITW EAE Electrovert EcoWave Wave Soldering System
EcoWave wave soldering system integrates two patented technologies a compact design that enhances wave soldering by improving topside hole fill and reduced bridging defects. Lowers dross production, shortens maintenance cycles and supports sustainability for cleaner, more efficient manufacturing.
ITW EAE
ITW EAE Vitronics Soltec Centurion Reflow Oven
Centurion Reflow Oven with CoolClean improves process reliability by removing contaminated gases from the cool zone, reducing flux residue and extending maintenance intervals. Optional Process Guard provides real-time thermal profiling, alarm thresholds and Cpk calculations to ensure tighter control over process capability.
ITW EAE
Shenmao PF602-P241M-HS LTS
PF602-P241M-HS low-temperature Sn-Bi solder paste is for assembling heat sinks and cold plates in AI server cooling systems. Soldering below 200°C minimizes warpage and ensures strong mechanical bonding for low-void joints. Lead-free and halogen-free formulation provides wetting on copper, aluminum and Ni-plated surfaces. Compatible with stencil printing and dispensing. Enhances cooling efficiency and thermal reliability in air- and liquid-cooled server designs.
Shenmao
Solderstar Vapour Phase Verification Suite
Vapour Phase Verification Suite pairs VP10 thermal profiler with VP Shuttle Verification Fixture to validate machine performance and board-specific behavior. VP10 features a 37mm profile and 10 measurement channels for broad thermal coverage, minimizing blind spots and profiling runs. Integrated with SLX Datalogger, it supports vacuum-stage operation and extended processes with high accuracy. VP Shuttle tests oven temperature uniformity across 12 points to separate machine variations from PCB-specific factors. Together, they provide a unified verification system for qualification, calibration and production checks.
Solderstar
Telit Cinterion deviceWISE Intelligence Suite
deviceWISE Intelligence Suite AI-powered platform enables autonomous factory control. Intelligent agents autonomously observe, analyze and act across machines, sensors and workflows. Integrates with PLCs, robots, CNCs and enterprise systems. Supports fault detection, workflow guidance, process insights and real-time information retrieval. Features self-mapping factory capabilities, anomaly detection without manual training and MCP server/client functionality for multi-agent coordination.
Telit Cinterion
Viscom vAI ProVision Inspection Software
vAI ProVision is an AI-driven feature within the vAI platform that automates and optimizes 3-D AOI and 3-D AXI program generation. Embeds AI directly into the vVision environment to cut programming time to minutes from hours. Enables nearly autonomous program creation with inspection coverage, image quality and consistent results.
Yamaha YSUP-PG Programming Software
YSUP-PG upgraded program generator accelerates NPI for surface-mount lines. Features enhanced user interface and advanced automation for faster data conversion from formats such as ODB++. Provides real-time component-placement image updates, clickable task lists and automated workflows. Enables AOI libraries to be created directly from CAD data, allowing mounter and inspection programs to be developed in parallel. Enhanced Gerber image and CAM conversion tools produce accurate simulated board images with automatic PCB layer compositing. Combines Gerber and CAD data to digitally determine push-up pin positions.
Yamaha Robotics
Yincae UF 66L Underfill
UF 66L optical clear underfill, for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules and advanced flip-chip assemblies, withstands five reflow cycles at 260°C without cracking, delamination or adhesion loss. Maintains over 95% light transmittance between 400–800nm with non-yellowing stability under thermal exposure. Adheres to silicon, glass and substrates. Features controlled modulus that reinforces delicate structures while minimizing stress and warpage.
Yincae