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Element Solutions, Solstice Terminate Merger Agreement

MIAMI – Element Solutions and Solstice Advanced Materials have mutually terminated their proposed merger following shareholder feedback and discussions between the companies.

The companies’ boards determined that operating as separate businesses would better serve their respective shareholders. Neither company will make a termination payment under the agreement.

Element Solutions said it will continue its strategy centered on operational execution, capital allocation and product development. The company supplies specialty chemicals for semiconductor fabrication, computing, automotive, communications, aerospace and industrial applications.End of article content 

 

Calumet Opens $55M Organic Substrate Facility

CALUMET, MI – Calumet Electronics has opened its $54.7 million Center for Advanced Substrate Technology, a panel-level organic substrate manufacturing facility that the company says is the first dedicated operation of its kind in the United States.

The facility includes Class 1000 cleanrooms and combines semi-additive processing and embedded trace technologies on a single platform. It will produce advanced substrates for radar, electronic warfare, AI computing and 5G/6G communications.

The project was developed with more than 25 industry, government and education partners and is intended to expand domestic substrate production while reducing reliance on overseas suppliers.End of article content 

 

ICTC Philippines Opens Manufacturing Facility in Laguna

BIÑAN, PHILIPPINES – Interconnect Cable Technologies Corporation has opened a manufacturing facility in Laguna Technopark to expand its electronics manufacturing capacity in the Philippines.

Figure 2. ICTC Philippines’ new electronics manufacturing facility in Laguna Technopark.

ICTC Philippines provides cable and wire harness assembly, PCB assembly, box-build testing and product integration services for commercial and industrial applications. The facility will provide additional capacity and resources as customer requirements expand.

A formal inauguration is scheduled for Oct. 23 and will include members of ICTC’s global team, customers and industry partners.End of article content 

 

SEL to Invest $150M in Idaho Manufacturing Plant

NAMPA, ID – Schweitzer Engineering Laboratories plans to invest more than $150 million in a 103,000-sq.-ft. manufacturing plant in Nampa, with operations scheduled to begin in 2027.

The company expects the facility to create approximately 250 jobs initially while increasing production capacity and shortening lead times for products used to protect electrical grids and improve power-system reliability.

The Nampa operation will join SEL’s existing Idaho manufacturing facilities in Lewiston and Moscow and represents the company’s fourth major manufacturing expansion in two years.End of article content 

 

Ondas Acquires Gate, Bron Technologies for $205M

WEST PALM BEACH, FL – Ondas has acquired Gate Technologies and Bron Technologies for $205 million, expanding its electronic safe-and-arm and fuzing capabilities for defense applications.

Gate develops electronic safe-and-arm devices and fuzing technologies for UAVs, loitering munitions, missiles and rockets. Bron adds manufacturing and certification operations in Poland, giving the combined business a NATO-based production presence in Europe.

Ondas expects the acquired businesses to generate $65 million in revenue in 2026 and $180 million in 2028. The agreement includes up to an additional $185 million in performance-based consideration tied to financial targets through 2028.End of article content 

 

Syrma SGS, Elemaster Form India Manufacturing JV

BENGALURU, INDIA – Syrma SGS Technologies and Elemaster have formed a joint venture to establish an electronics manufacturing operation in Bengaluru.

Figure 3. Syrma SGS and Elemaster form a joint venture to establish an electronics manufacturing facility in Bengaluru, India.

The venture, Syrma SGS Elemaster Pvt. Ltd., will operate a 20,000-sq.-ft. facility in the Bommasandra Industrial Area with SMT, through-hole technology and box-build assembly lines.

The operation will serve railway, industrial and medical electronics customers, combining Syrma SGS’s manufacturing capabilities with Elemaster’s design expertise and European OEM relationships.End of article content 

 

Flex to Acquire EPC Power for $4.4B

AUSTIN, TX – Flex has entered into a definitive agreement to acquire EPC Power for $4.4 billion, adding power-conversion technologies for AI data centers, energy storage and grid applications.

EPC Power develops hardware, software and control systems supporting rectifiers, DC-DC conversion and next-generation 800V data-center architectures. The company has more than 15GW deployed across 62 countries and expects US manufacturing capacity to exceed 30GW in 2027.

The transaction is expected to close in the fourth quarter, subject to regulatory approvals. EPC Power will join Flex’s Cloud and Power Infrastructure segment, which Flex plans to separate into an independent publicly traded company in early 2027.End of article content 

 

Microscreen Opens Connecticut SMT Stencil Facility

OXFORD, CT – Microscreen has opened an 8,000-sq.-ft. manufacturing facility in Oxford to expand SMT solder stencil production and service capabilities in the northeastern United States.

Figure 4. Microscreen’s new 8,000-sq.-ft. SMT solder stencil manufacturing facility in Oxford, CT.

The facility offers 24-hour stencil turnaround and places customers from Maine to Philadelphia within one-day ground shipping range. Equipment includes a Tannlin T11 laser capable of cutting approximately 10,000 to 15,000 apertures per hour and a Watt Laser SE12 Pro for inspection, step welding and aperture measurement.

The site manufactures multiple frame and foil systems, including VectorGuard, Apshen, QTS Wizard and rework stencils.End of article content 

 

Kitron Plans New Denmark Manufacturing Facility

HORSENS, DENMARK – Kitron plans to build an 8,850-sq.-m. electronics manufacturing facility in Horsens to support anticipated growth and demand for localized production.

The company-owned plant will replace Kitron’s existing Horsens operation and feature a manufacturing layout designed to improve production efficiency and workflows for regulated and high-reliability markets.

Construction is expected to begin in January 2027, with operations scheduled to start in early 2028. Kitron plans to increase staffing at the location from approximately 150 to 250 employees once the plant is fully utilized.End of article content 

 

TFE Acquires Tekena USA

SCHAUMBURG, IL – TFE has acquired Tekena USA, expanding its North American portfolio of particle-removal and surface-cleaning technologies for precision manufacturing.

The acquisition adds sheet and web cleaning systems, contact-cleaning equipment, adhesive rolls, manual products, consumables and related services. The technologies remove dust, fibers and other contaminants that can affect product quality, process consistency and yield.

Applications include PCB manufacturing, SMT, coating, lamination, battery production, printing and solar manufacturing. Tekena customers and distributors will receive continued product and technical support through TFE’s existing teams.End of article content 

MBK, FormFactor Complete $661M FICT Acquisition

LIVERMORE, CA – A consortium led by MBK Partners has completed its acquisition of Japanese PCB manufacturer FICT from Advantage Partners in a transaction valued at approximately $661 million.

MBK acquired an 80% interest in FICT, while FormFactor invested approximately $60 million. Formerly a Fujitsu subsidiary, FICT manufactures high-density printed circuit boards for high-speed data transmission, semiconductor and high-performance computing applications.

The investors expect FICT to benefit from increasing demand for AI data centers, advanced packaging and high-speed communications. FormFactor said the investment will also secure access to technologies used in advanced probe cards.End of article content 

 

NCAB Expands into Australia with IMP Acquisition

ADELAIDE, AUSTRALIA – NCAB Group has agreed to acquire the operations of IMP Electronics Solutions, expanding the PCB supplier’s presence into Australia and New Zealand.

The transaction includes IMP’s 12 employees in Australia and China and is expected to close in the fourth quarter. Founded in 1964, IMP supplies printed circuit boards to industrial and defense customers and generated approximately $9 million in sales during its 2026 financial year.

NCAB will pay an initial $4 million plus a performance-based earnout. The acquisition is expected to contribute positively to the company’s results in 2027 through supplier, logistics and sales synergies.End of article content 

 

TM Soldering Solutions Opens Process Development Lab

SPOKANE VALLEY, WA – TM Soldering Solutions has opened a Selective Soldering Process Development Lab at its 10,000-sq.-ft. manufacturing facility in Spokane Valley.

Figure 1. TM Soldering Solutions’ new Selective Soldering Process Development Lab in Spokane Valley, WA.

The lab will allow customers to test circuit boards, troubleshoot manufacturing challenges and develop selective soldering processes with support from former ACE Production Technologies engineers, builders and technicians.

TM initially operated as a parts and service provider specializing in replacement parts, repairs and refurbishment for KISS Gen 1 and Gen 2 selective soldering machines. Its team has collectively designed, built, installed and supported more than 1,200 machines.End of article content