PCD&F
Binder M12-A Midmount PCB Connectors
M12-A angled panel-mount connectors feature a midmount design that positions the connector axis in the plane of the PCB to reduce assembly height in cylindrical housings. Available in four- and five-pin configurations with shielded or unshielded options and support PCB thicknesses from 1mm to 2mm. THR termination permits reflow soldering on existing SMT lines, while an integrated pickup surface supports automated processing. Rated to 60V and operate from -40°C to 85°C, with IP68 protection when mated and locked. For sensors, measuring transducers, fieldbus devices and other space-constrained electronics.
Binder
Kyocera AVX KGU Series RF MLCCs
KGU Series RF multilayer ceramic chip capacitors are available in an ultraminiature 0201 case size for high-frequency wireless and communications applications. Feature C0G (NP0) ceramic dielectrics, ultra-low ESR, high Q and high self-resonant frequencies, with ratings from 6.3V to 250V and 0.1pF to 100pF. Operate from -55°C to 125°C and feature tin/nickel-plated copper electrodes for solderability and high-volume automated assembly. For cellular base stations, WiFi networks, satellite communications and broadband wireless systems.
Kyocera AVX
Luxinar Aionis 515-50-Yb Femtosecond Laser
Aionis 515-50-Yb femtosecond laser delivers 50W of power, pulses below 350fs and pulse energy up to 100µJ. Provides up to five times more power than previous models and features advanced pulse control for increased throughput, cleaner processing and improved process stability. Uses a 515nm wavelength for tighter beam focusing, smaller feature production and reduced thermal impact. For semiconductor manufacturing, glass and brittle material processing, medical device production, photovoltaics and other precision manufacturing applications.
Luxinar
Nordic Semiconductor nRF93M1 Smart Modem Modules
nRF93M1 Cat 1 bis smart modem modules combine cellular connectivity with access to nRF Cloud services for device management, observability and firmware-over-the-air updates. GCF-compliant nRF93M1-LABA supports multiregional deployments, while pin- and software-compatible nRF93M1-LACA adds global-band coverage without requiring PCB or software redesign. Connect to host MCUs through UART or USB and support AT commands and PPP. Development kit includes an nRF54L15 host MCU, Onomondo SIM, LTE antenna and application examples. For fleet management, asset tracking, point-of-sale terminals, healthcare, gateways, smart energy and metering applications.
Nordic Semiconductor
Patriot Memory Viper Steel 5 Infinite RGB DDR5 Memory Kit
Viper Steel 5 Infinite RGB DDR5 memory kit includes two 16GB modules for a total capacity of 32GB. Reaches speeds up to 7600MT/s with a compatible ASUS ROG motherboard and enabled ROG Certified firmware setting. Supports Intel XMP 3.0 and AMD EXPO profiles at speeds up to 7000MT/s. Features selected memory ICs on a 10-layer PCB, a ROG-styled heat spreader and an Infinite Mirror addressable RGB light bar. Measures 43mm high. For gaming computers and other high-performance desktop systems.
Patriot Memory
ROHM BH65T41xxxF 650V EcoIGBTs
BH65T41xxxF Series fourth-generation 650V EcoIGBTs combine low conduction loss with high short-circuit withstand capability and are AEC-Q101 qualified for automotive applications. Available in multiple package configurations, with SPICE and PLECS simulation models available to aid circuit design. Additional compact and top-side-cooled package options are planned. For automotive electric compressors, high-voltage heaters, industrial inverters and power supplies.
ROHM
Stackpole Electronics RNAN Thin-Film Resistors
RNAN Series thin-film precision resistors feature aluminum nitride substrates for heat dissipation in high-power industrial electronics. Available in 0603, 0805, 1206 and 2512 sizes, with power ratings from 0.5W to 6W at 70°C. Provide tolerances to 0.1%, TCR as low as 25ppm/°C, resistance values from 50Ω to 30.1kΩ and operating temperatures from -55°C to 155°C. For industrial power supplies, motor drives, robotics, renewable-energy controls and test and measurement equipment.
Stackpole Electronics
Zuken E3.series 2027 Electrical Design Software
E3.series 2027 electrical design software adds E3.CloudView for browser-based access to project documentation, including 2-D electrical schematics and 3-D panel layouts. Generates complete 2-D Manufacturing Views of enclosures with a single command and adds configuration search, updated Variant and Option handling and simultaneous placement of multiple symbols. E3.3DPanelBridge converts mechanical panel models into native E3.panel design objects, while E3.3DTransformer 2027 adds topology-attribute editing, model-tree search and updated CATIA, Creo and JT format support. For wiring, wire harness, fluid and control systems design.
Zuken
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CA
ASMPT DEK TQ Automated Setup Changeover
Automated setup changeover option for the DEK TQ printer platform automates stencil and squeegee changeovers, reducing operator time at the printer from approximately 4 min. to 30 sec. Uses a prepared setup combining the stencil with a consumable cartridge containing the squeegees, while the print head automatically locates and picks up the squeegees and prepares the printing process. Supports automatic solder paste transfer during subsequent stencil changes and stencil identification and verification with the Camera Barcode Reader option. Includes a new print head, squeegees, consumable cartridge, adapter and software. Available for new DEK TQ printers and as a retrofit for existing systems.
ASMPT
Coherix 3-D GlassMaster Tracker Adhesive Dispensing Inspection System
3-D GlassMaster Tracker provides 100% inline, real-time inspection and adaptive process control for adhesive dispensing. Tracks part-to-part geometry variations during dispensing and automatically adjusts the robot path to compensate for changes in glass shape, battery-cover geometry, adhesive viscosity and other manufacturing conditions. Records and verifies the dispensing process for each part to provide traceability for quality audits, warranty investigations and regulatory compliance. For automotive windshield bonding, battery assembly and other safety-critical adhesive dispensing applications.
Coherix
Dymax BlueWave FX Line Emitters
BlueWave FX Line Emitters provide uniform linear UV/Visible curing for automated production applications. Deliver up to 4.2W/cm² intensity at a 25mm working distance and are available in 75mm and 150mm lengths with a 25mm curing width. Offered in 365nm, 385nm and 405nm wavelength options and integrate with FX-series controllers for dual-channel control and flexible wavelength configurations. Are CE and UKCA marked. For adhesive bonding, medical device assembly, printing, lacquers, paints and UV-curable coating applications.
Dymax
Göpel Electronic Multi Line AXI 3D-CT X-Ray Inspection System
Multi Line AXI 3D-CT X-ray inspection system provides 2-D, 2.5-D and 3-D inspection of PCBAs using microfocus X-ray technology and a high-speed flat-panel detector. Features an 810 × 535mm inspection area, PCBA clearance up to 105mm and transport capacity up to 25kg. Delivers CT imaging in less than 2 sec. with 8µm voxel resolution and supports void calculation and THT fill measurement. Integrates with PILOT software, MES and traceability systems and can operate inline, at-line or stand-alone.
Göpel Electronic
Hirose GT37 Series Automotive Ethernet Connector
GT37 Series wire-to-board connector supports 1000BASE-T1 automotive Ethernet connectivity for Gigabit data transmission over a single twisted-pair cable. Features a fully shielded design, impedance matching at the stripped-cable section and a two-position interface measuring 8.6 × 10.6mm. Sleeve design eliminates commercial copper tape during shield termination, while an optimized cable strip length and dual-lock mechanism simplify harness assembly and provide positive mating confirmation. Is compatible with standard automotive harnesses and requires no dedicated processing equipment.
Hirose
Inspectis Micro-Size Optical Probe Tip
Micro-Size Optical Probe Tip for the Inspectis BGA Inspection System provides detailed, noncontact inspection of solder joints beneath BGA packages with limited clearance. Features a 0.8mm-thick stainless-steel tip, 90° viewing angle, integrated illumination and improved optics for sharper images of BGA solder joints. Is fully compatible with the Inspectis BGA Inspection System. For electronics manufacturers, EMS providers and quality-control teams.
Inspectis AB
Mek PowerSpector JSAz 350 Desktop AOI System
PowerSpector JSAz 350 desktop AOI system features a fixed PCB stage for increased mechanical stability during inspection. Includes Selective 3-D Laser Measurement Technology for repeatable component and object height measurements. Can be configured with up to nine cameras, including a high-resolution top camera and eight angular side cameras, with multi-angle LED lighting and Diffused On Axis Light. Supports SMT and THT inspection throughout production and integrates with Mek Catch System for process control and traceability. Features a compact chassis based on the PowerSpector JSAz 550 platform for a reduced footprint.
Mek
Overton Instruments Scorpion-II Fault-Finder Automated Test System
Scorpion-II Fault-Finder automated test system combines test-development components in an integrated desktop package. Features an Intel-based single-board computer with standard peripherals and memory resources and supports Windows and Linux operating systems. Integrates with the company’s smart instrument modules and controls connected instruments through an embedded USB hub module. Includes a bed-of-nails test platform available in multiple sizes for PCBAs and other technologies. Includes a Python-based test executive for custom application programming.
Overton Instruments
PVA DeltaFlex Coating and Dispensing Platform
DeltaFlex large-format coating and dispensing platform is designed for oversized, complex and high-reliability manufacturing applications. Combines the flexibility of the company’s Flex Cell platform with a motion architecture that supports larger assemblies and heavier process equipment. Features a ruggedized gantry, dual-driven Y-axis, linear encoder positioning and high-speed motion capability. Is available with standard 800mm and 1,200mm workspaces, increased Z-axis travel and custom oversized configurations. For aerospace, defense, electric vehicle battery manufacturing, telecommunications, industrial electronics and electronics manufacturing services applications.
PVA
Saki 3Xi-ZS1EX Automated X-Ray Inspection System
3Xi-ZS1EX automated X-ray inspection system provides 3-D inspection of XXL PCB assemblies up to 1,000 × 690mm. Features automatic board warpage correction, high-resolution 3-D CT imaging and AI-based image analysis for detecting small voids and hidden defects. Delivers approximately 1.6 times higher takt time compared with previous Saki models while accommodating large boards within a compact footprint. For AI server, data center and other large, complex PCB assembly inspection applications.
Saki Corporation
Tekpak Automation TD3/R Series Pick-and-Place Cell
TD3/R Series three-axis robotic pick-and-place cell loads or stacks products into trays, cases, cartons, thermoformers or flow-wrapper infeeds. Features robot positional accuracy of ±0.1mm and vision-controlled position tracking, along with rapid size changes and a quick-change gripper for multiple formats. Compact design is suited for cleanroom and space-constrained environments and includes touchscreen controls, gentle product handling and integrated safety functions.
Tekpak Automation
TM Soldering Solutions Phoenix Selective Soldering Platform
Phoenix selective soldering platform adds configurable options including a programmable nitrogen de-bridging knife with 360° rotation, 6-in. dynamic solder wave assembly, automatic nozzle tinner and integral N₂ purity analyzer. Dynamic solder wave enables conversion between selective and 6-in. wave soldering processes, while the purity analyzer integrates real-time nitrogen measurements into EmberX software. Available in batch and inline configurations. For PCB assembly and selective soldering applications.
TM Soldering Solutions
ULT 200.1 Mobile Extraction Unit
ULT 200.1 mobile extraction and filtration unit features an expanded filter surface area for increased pollutant storage capacity and extended filter service life. Has a 4m² panel prefilter, up from 0.5m², and an 8kg activated carbon capacity, up from 1kg. ISO 16890-compliant prefilter captures 80% of particles smaller than 1µm, followed by H14 HEPA and activated carbon filtration for gases and odors. Supports up to four extraction elements and features constant negative-pressure control that automatically adjusts extraction performance based on operating conditions and filter loading. For laser processing, engraving, cutting and other high-pollutant applications.
ULT
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