Siemens Launches PartQuest Design Enablement

MUNICH – Siemens Digital Industries Software in August introduced the PartQuest Design Enablement portfolio, a new digital environment aimed at enhancing how electronic component manufacturers connect with customers. Designed to streamline operations and deliver personalized digital experiences, the platform integrates product discovery, BoM intelligence, collaboration tools and digital support into one cohesive ecosystem.

Microchip Technology is among the first to adopt the platform, demonstrating its value during the Microchip MASTERs event. Siemens showcased how PartQuest Design Enablement, combined with Celus design automation and Microchip components, can accelerate the design process.

Siemens says the platform enables manufacturers to engage more deeply with engineers while improving operational efficiency and decision-making.

DSBJ to Launch High-End PCB Site

SUZHOU – Dongshan Precision Manufacturing (DSBJ), the parent of Multek, announced plans in August to invest up to $10 billion in a high-end printed circuit board campus designed to support next-generation computing and artificial intelligence applications. The initiative marks a push to enhance the company’s capabilities in advanced PCB manufacturing, crucial for high-performance AI chipsets and data infrastructure. The company didn’t disclose the site location, capacity or expected completion date.

The investment will go toward state-of-the-art facilities capable of producing complex, high-density PCBs tailored for demanding AI workloads. This move comes as China sees demand for advanced computing hardware, especially in light of US restrictions on Nvidia AI chip exports, which has fueled a secondary market for repair and maintenance.

DSBJ aims to position itself at the forefront of the AI supply chain by delivering the reliable, high-spec components needed for evolving technology stacks. While project specifics are still under wraps, the development is expected to boost local innovation, generate employment and reinforce the company’s role in the global electronics ecosystem.

Ventec Breaks Ground on Thailand Facility

AYUTTHAYA, THAILAND – Ventec International Group has officially broken ground on its first Southeast Asian manufacturing plant here. The 35,000-sq. m. site is expected to begin trial production in the first quarter of next year and reach mass production by the second quarter.

The site is located near Bangkok’s port and airport, and will produce copper foil substrates and adhesive sheets for high-performance applications, including automotive, aerospace and AI computing.

Chairman Yu-Tzu Wang emphasized that the Thai facility will “optimize the company’s global supply chain layout” and “significantly enhance production capacity and service capabilities.” The move builds Ventec’s presence in a key electronics hub and supports customers across Thailand, Southeast Asia, Europe and the US.

Avary Holding Greenlights Huai’an Park Expansion for PCB Capacity and AI

HUAI’AN PARK – Zhen Ding Technology said Avary Holding’s board in August approved a Huai’an Park expansion, committing roughly $1.1 billion (RMB 8 billion) through 2028 to boost high-end PCB capacity aimed at AI infrastructure.

The plan includes two new fabs and advanced equipment to scale MSAP, HDI and high-layer-count (HLC) production for servers, optical communications, humanoid robotics, smart vehicles and edge AI devices.

Avary is a subsidiary of ZDT. The Huai’an investment is an element of the group’s capex strategy and targets mid-to-long-term demand for high-precision, high-layer boards across the AI server and connectivity stack.

Kaynes Circuits Launches PCB Project in Tamil Nadu

THOOTHUKUDI, TAMIL NADU – Kaynes Circuits India has announced an investment of ₹49.95 billion ($570 million) to establish an electronic component manufacturing facility in Thoothukudi, Tamil Nadu. It marks the state’s first major foray into high-end PCB production.

The facility will produce advanced 74-layer PCBs, HDI and flexible boards, high-performance laminates, camera modules and wire harness assemblies. Projected to create around 4,700 jobs, the plant will help make Thoothukudi a hub for electronics and electric vehicles, situated near VinFast’s upcoming EV plant.

Industry experts say this anchor investment reflects a larger shift in India’s electronics strategy, moving from assembly toward deep-tech component manufacturing. It also aligns with the country’s growing component production initiatives under the government’s ₹22.9 billion investment plan.

Wright Industries Acquires Exception PCB

ANDOVER, ENGLAND – Wright Industries in August announced its acquisition of Exception PCB, returning the high-reliability printed circuit board manufacturer to British ownership. The company, now part of the Connexion Technologies group, means to reinforce the UK’s domestic manufacturing base.

“Bringing Exception PCB back from Asia into UK ownership strengthens our national manufacturing resilience,” said Craig Wright, chairman and CEO, Connexion Technologies. “It aligns with UK Government objectives and opens new opportunities to innovate, invest and lead.”

“This is a proud moment for British engineering,” added Kamal Berberi, general manager, Exception PCB. “Joining Connexion Technologies will allow us to expand our strategic capabilities and customer offerings.”

Wright Industries’ move highlights a broader trend toward reshoring industrial capacity to the UK. The deal is also expected to support skilled jobs and long-term economic value in the region.

Polymatech Completes PCB Fab Plant in Estonia

CHENNAI – Polymatech Electronics last month announced the commissioning of its state-of-the-art printed circuit board manufacturing facility in Estonia.

The new facility features a roughly 10,000-sq. ft. cleanroom equipped with cutting-edge machinery, capable of producing up to 50,000-sq. m of multilayer high-density interconnect (HDI) PCBs annually.

The site also has capacity for building flex circuits, SLPs, HDI PCBs, rigid-flex, IC substrates, RF PCBs, and high-density modules.

“Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,” said Eswara Rao Nandam, CEO, Polymatech Electronics. “This facility underscores our commitment to innovation, quality and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.”

The Estonia facility underscores Polymatech’s evolution from a component supplier to a product-centric solutions provider. “Since incorporating the Company on Nov. 18, 2024, and commencing operations on Aug. 8, this facility exemplifies our dedication to quality, reliability, and customer-centric innovation,” said Tarja Rapala, director, Polymatech Electronics and head of PCB Business. “With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe.”

Dr. Allen Nejah, chief innovation officer, Polymatech Electronics, added, “This facility is a remarkable achievement that enhances our ability to deliver sophisticated PCB solutions for Europe’s technological and defense sectors. This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multilayer configurations – up to 48 layers – designed for high-end electronics.”

Wipro Launches Electronic Materials Division

NEW DELHI – Wipro Infrastructure Engineering (WIN) has unveiled a new business division, Wipro Electronic Materials, aimed at manufacturing high-performance base materials for PCBs. The move marks a strategic expansion into the electronics manufacturing space.

As part of this initiative, WIN will invest approximately $60 million to build a copper-clad laminate (CCL) facility in Karnataka. The plant is expected to generate around 350 jobs and will have the capacity to produce over 6 million sheets of copper-clad laminates and associated pre-impregnated materials annually.

The investment aligns with India’s growing push for electronics manufacturing self-sufficiency and represents a step toward diversifying its advanced materials capabilities.

VVDN Expands with New UAE EMS Facility

FREMONT, CA – VVDN Technologies has announced the establishment of a new manufacturing facility in the United Arab Emirates, expanding its global footprint to serve customers across the United States, Europe and the MENA region. The site, scheduled to become operational within four weeks, reinforces the company’s backward integration strategy.

The UAE facility will support PCB assembly, automated product assembly, mechanical manufacturing and testing and validation, covering sectors including telecom, MedTech, automotive, cameras and industrial automation. By adding capacity in the region, VVDN aims to accelerate time-to-market.

Gourab Basu, senior vice president, manufacturing commercials, said the UAE expansion reflects VVDN’s commitment to meet rising global demand. “Positioned as a gateway between the East and West, the UAE enables seamless access to diverse markets,” he noted. “This expansion reflects VVDN’s dedication to bringing manufacturing closer to its global clientele while meeting the increasing demand for high-quality, commercially competitive solutions with a quick-turnaround.”

VVDN Acquires GGS Engineering

FREMONT, CA – VVDN Technologies has acquired GGS Engineering Services, expanding its engineering research and development (ER&D) portfolio across the automotive, MedTech and aerospace sectors. GGS brings more than two decades of expertise in mechanical design, analysis, simulation and technical publications.

The acquisition grows VVDN’s capabilities in innovative product development, cost optimization and scalable engineering talent. VVDN aims to address industry demands ranging from vehicle electrification and cabin design to medical device precision engineering and aerospace component development.

GGS will continue to operate under the VVDN umbrella, with its leadership team remaining in place. VVDN CEO Puneet Agarwal emphasized that the acquisition strengthens the company’s global value proposition and positions it to expand aggressively in the multi-billion-dollar ER&D market.

Cicor Finalizes MADES Acquisition, Expands A&D Reach in Europe

BRONSCHHOFEN, SWITZERLAND – The Cicor Group has completed its acquisition of MADES SAU, a Málaga-based electronics manufacturer formerly owned by the Latecoere Group.

With this move, Cicor builds its presence in the European aerospace and defense (A&D) sector, while making its strategic entry into the Spanish market. MADES, which employs around 100 people and generated EUR 29 million ($23 million) in revenue last year, brings additional capabilities in mission-critical electronics and industrial applications. Cicor emphasized that the acquisition will not affect its yearly sales guidance of CHF 620 million to 650 million ($754 million to $774 million) and is not expected to be impacted by recent US tariff changes.