Is Thinner Core Technology Ahead for Tomorrow’s CPU Substrates?
AUSTIN, TX – Larger substrate sizes for AI, network switch and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat.
That’s according to TechSearch International’s latest Advanced Packaging Update. The 100-page report examines these trends and includes a section on thermal interface materials (TIMs) under development for large-body packages.
The update also examines substrate material shortages, including glass fiber for the core and bismaleimide triazine (BT) resin for a variety of substrate types. Underlying causes for shortages are discussed, along with alternatives for these materials.
An update on glass-core substrates examines progress and highlights challenges in developing the technology. A particular advantage of glass core is the potential for a thinner core than existing glass-cloth materials offer. Still, a core thickness of 1.0mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and to date, only three or four build-up layers on each side have been fabricated in test vehicles. Little reliability data have been published for glass-core substrates, and the cost compared to alternatives is unavailable.
TechSearch’s annual survey on substrate design rules features coverage of laminate flip-chip BGA and CSP substrate suppliers worldwide. Design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported and substrate finish.
Hot Takes
The DDR4 market is set to remain in a persistent state of undersupply and strong price growth through the second half of this year, and rigid server orders are crowding out supply for the PC and consumer markets, forcing PC OEMs to accelerate DDR5 adoption. (TrendForce)
Revenue among publicly listed Taiwanese-based PCB fabricators in July rose 8% year-over-year. (TPCA)
Some 88% of US electronics supply chains rely on foreign inputs, with significant upstream exposure to Chinese sub-components across allied trade routes. (Altana)
Global TV shipments reached 92.5 million units in the first half, up 2% year-over-year, driven by tariff-related uncertainties and China’s “trade-in” subsidy program. (TrendForce)
Worldwide tablet shipments grew 13.1% year-over-year in the second quarter, totaling 38.3 million units. (IDC)
Only 26% of job candidates trust AI will fairly evaluate them, even though 52% candidates believe AI screens their application information. (Gartner)
Global notebook shipments, excluding detachable models, outperformed expectations in the second quarter, rising 11.8% quarter-on-quarter. (DigiTimes)
First-half M&A deals among North American EMS and PCB companies this year are tracking closely to 2024, with seven reported EMS deals, versus eight in 2024, and two PCB deals, same as a year ago. (GP Ventures)
OLED monitor shipments will reach 2.66 million units in 2025, an 86% year-over-year, driven by demand for new gaming devices. (TrendForce)
Worldwide silicon wafer shipments increased 9.6% year-on-year to 3.33 billion sq. in. (MSI) from the 3.04 billion MSI recorded during the same quarter of 2024. (SEMI)
The 90-day moving average North American EMS shipments in July fell 4.1% and shipments declined 5.1% sequentially. Bookings rose 7.9% from last year and increased 13.4% from June. Year-to-date shipments are down 0.6% and bookings are up 1.5%.(GEA)
In July North American PCB shipments rose 20.7% year-over-year and increased 11.3% sequentially. Bookings climbed 22.2% from a year ago and fell 5.5% from June. Year-to-date shipments are up 7.6% and orders are up 17.2%. (GEA)