PCD&F
Adafruit SnapBoard Prototyping Frame
SnapBoard modular prototyping frames offer reusable, snap-fit solution for securely holding multiple PCBs during development and testing. Designed for tool-less installation. Enables fast module swaps without soldering or screws. Interchangeable mounts support various board sizes. Built for 3-D printing with standard FDM printers. Ideal for rapid iteration workflows.
Adafruit Industries
Hirose BK11 Series Connectors
BK11 series multi-power hybrid FPC-to-board connector delivers a footprint up to 46% smaller than conventional designs. Supports two main power contacts at 4A per pin, four sub-power contacts at 2.5A per pin and 10 signal contacts. Flexible power configurations suit variety of portable electronics. Fully armored housing, wide self-alignment range and molded plug-and-receptacle design. Has 0.35mm pitch, 1.9mm width, 5.33mm length and 0.6mm stacking height.
Hirose
Kyocera AVX 6780-000 Series Connectors
6780-000 Series IP20 T1 industrial single-pair ethernet (SPE) connectors and cable assemblies enable data and power transmission over a single twisted pair via PoDL technology. Compact design reduces wiring and saves 45% board space compared to RJ45 connectors. Rated for 1Gb/s at 40m and 10Mb/s at 1,000m. Meet IEC 63171-6 and IEEE 802.3 standards. Applications include industrial automation, smart grids and transportation systems. Come in standard and custom cable lengths with IDC technology for assembly.
Kyocera AVX
Lexar BG Series DDR5 RDIMMs
BG Series DDR5 RDIMMs are certified for compatibility with AMD’s Ryzen Threadripper PRO 9000WX-Series processors. Support up to 6400Mbps data rates and is optimized for bandwidth-heavy workloads like 3D rendering, AI model training and 8K video editing. Come in 32GB to 128GB capacities and 2R×4/2R×8 configurations. Deliver low-latency performance and ECC support for workstation-class reliability. Suitable for 24/7 high-load environments, including Jedec compliance and thermal and stress testing.
Lexar Enterprise
SF Circuits PCB Stackup Calculator
PCB Stackup Calculator is an online tool for designing and visualizing multilayer PCB stackups from 4 to 14 layers. Users can select copper weights, dielectric materials and via options. Offers view of layer-by-layer breakdown aligned with IPC-6012. Enables flexibility in layer counts, provides standard copper foil and prepreg thicknesses and supports blind and buried vias. Clear stackup tables offer instant visualization for review and manufacturability.
San Francisco Circuits
Vishay IHDM Series Inductors
IHDM-1107BBEV-2A and IHDM-1107BBEV-3A edge-wound, through-hole inductors are for high-current, high-temperature automotive power applications. Feature powdered iron alloy core technology, devices maintain stable inductance and saturation from -40° to +180°C with low DCR down to 0.22mΩ.
Deliver up to 30% higher rated and saturation currents than ferrite-based alternatives, with predictable inductance decrease independent of temperature. Customizable in inductance, DCR, current and voltage ratings, and available in multiple mounting styles. AEC-Q200 qualified, RoHS-compliant, halogen-free and Vishay Green. Isolation voltage rating up to 350V. Soft saturation current up to 422A.
Vishay Intertechnology
CA
Aven Inspector UV Magnifying Lamp
InspectorUV magnifying lamp combines 5-diopter (2.25x) magnification with dual-mode LED lighting – standard white light and ultraviolet – for conformal coating inspection. Integrated high-definition camera captures and streams crisp images and video directly to a PC via USB, for documentation, training, remote collaboration, and quality control. Designed for cleanroom applications, forensics, and other detail-critical industries, Features 6″ glass lens and smooth articulating arm for ergonomic comfort and flexible positioning. ESD-safe construction.
Aven
Indium WS-910 Flip-Chip Flux
WS-910 water-soluble flip-chip dipping flux is said to be compatible with molded and capillary underfill. Offers high tackiness for a flip-chip flux, for holding large die in place during reflow, and minimizes non-wet open defects and cold joints. Promotes solderability onto a range of surfaces, and ensures yields through consistent dipping performance over extended periods. Cleans with pure room-temperature deionized water. Is designed for Pb-free applications and suitable for all high-Sn solders. Compatible with a variety of conventional ultrafiltration and modified ultrafiltration.
Indium Corp.
Metcal BH-4000 and BH-8000 Board Holders
BH-4000 and BH-8000 board holders provide adjustable support systems for PCB positioning during rework and assembly. Designed for directional flexibility and three height levels. BH-4000 holds boards up to 10″ x 10″ (258 x 258mm). BH-8000 supports sizes up to 15″ x 16.5″ (378 x 418mm). Both models feature 3.3lb. (1.5kg) of clamping force, integrated locking mechanisms and compatibility with PT4-series preheaters. Suitable for PCB thicknesses between 0.02″ and 0.12″ (0.5–3mm), each unit ships with a screwdriver and grounding wire.
Metcal
SCS G4 Spin Coater
G4 Spin Coater has touchscreen interface, removable control panel for fume hood/glove box use and optional Bluetooth connectivity. Supports storage of up to 30 programs with 20 steps each. Enhances control for R&D and small-scale production of photoresists, dopants, polyimides and metallo-organics.
Specialty Coating Systems
ViTrox V510Ai AOI
V510Ai DST, V510Ai ST and V510Ai R Smart 3D AOI platforms are use dual-sided, AI-powered and robotic vision technology for back-end PCB assembly inspection.V510Ai DST hosts top-and-bottom inspection for SMT and THT processes. V510Ai ST inspects components up to 100mm tall. Both include angular vision cameras and AI-driven features like smart programming and auto-populate. V510Ai R adds fully robotic inspection for conformal coating and final assembly. CAD-less programming and generative AI further simplify deployment in high-mix, low-volume environments. All systems support integration with ViTrox’s V-ONE smart factory platform.
ViTrox
Yincae TM 150LM TIM
TM 150LM liquid metal thermal interface material (TIM) is said to offer improved printability, thermal stability and reliability in high-power electronics. Features high viscosity at room temperature for consistent stencil or syringe application. Maintains form at elevated temperatures, minimizing pump-out and bleed. Works for CPUs, GPUs and power modules, offering thermal conductivity and compatibility with automated dispensing. Profile bridges the gap between performance and processability in liquid metal TIMs.
Yincae