AMD to Sell ZT Systems Manufacturing Business to Sanmina for $3B

SANTA CLARA, CA – AMD has entered into a definitive agreement to divest ZT Systems’ US-based data center infrastructure manufacturing business to Sanmina for $3 billion in cash and stock, including a potential $450 million contingent payment.

As part of the agreement, Sanmina becomes AMD’s preferred new product introduction (NPI) manufacturing partner for rack-scale and cluster-scale AI infrastructure. AMD will retain ZT Systems’ design and customer enablement teams to continue supporting rapid deployment and high-quality AI solutions for cloud providers.

The transaction, expected to close by the end of the year pending regulatory approval, fulfills AMD’s stated intent from its 2024 ZT Systems acquisition to partner out the manufacturing portion of the business.

Siemens to Acquire Wevolver

MUNICH – Siemens Digital Industries Software announced its intent to acquire Wevolver, a move that will enhance its previous acquisition of Supplyframe platform by extending its global reach, adding to its content capabilities and strengthening digital marketing and campaign execution. Terms of the acquisition were not disclosed.

Supplyframe, acquired by Siemens in 2021, delivers real-time insights into design intent, demand, supply, and risk factors for the electronics industry. The addition of Wevolver brings a broader audience of hardware and software engineers to the platform, fostering a deeper connection with professionals involved in early-stage product research and innovation.

“The future of product development starts with smarter design decisions – and that means meeting engineers where innovation begins,” said Steve Flagg, CEO and founder, Supplyframe. “By joining forces with Wevolver, we’re not just expanding our reach; we’re accelerating a new era of design-to-source intelligence that’s collaborative, data-driven and built for the speed of tomorrow’s manufacturing.”

Syrma to Add Bare Board Manufacturing

MUMBAI – Syrma SGS Technology in May approved the incorporation of two wholly owned subsidiaries to manufacture electronic components, bare printed circuit boards, component assembly and manufacturing interface cards and other electronic components.

The measure marks an expansion of the company’s traditional EMS focus.

Syrma’s revenue for the fiscal year ended March 31 was 2.3 million rupees ($269 million), up 23% year-over-year.

MKS Breaks Ground on $40M Thailand Facility

ANDOVER, MA – MKS Instruments has begun construction on a $40 million chemical manufacturing facility and technical center near Bangkok.

The new site aims to support Southeast Asia’s PCB and advanced packaging sectors.

The 27,000 sq. m site will offer chemical production, plating technologies, labs and regional service, with operations expected in 2027

Lacroix to Exit North American Market by End of Year

SAINT-HERBLAIN, FRANCE – Lacroix announced plans to fully exit its North American electronics operations by the end of the year as part of a shift toward higher-potential activities in Europe and environmental solutions.

The company will explore options for its North American operations, including sale, shutdown or liquidation. It will also seek to pare its dependence on the automotive sector.

The exit follows sustained losses and worsening conditions at Lacroix Electronics, which operates in Juarez, Mexico and Grand Rapids, MI.

Cofactr Acquires Hardware Sourcing Provider Cogbase

NEW YORK – Cofactr has acquired Cogbase, a hardware sourcing platform with a network of over 450,000 suppliers, to strengthen and scale supplier options for US manufacturers. Terms were not disclosed.

The acquisition will permit Cofactr to automate sourcing for complex parts while reducing the average time spent on vetting suppliers.

Cofactr will integrate Cogbase’s automated sourcing capabilities, including 2-D/3-D drawing uploads, specification matching and supplier outreach.

Celanese to Divest Electronics Business

DALLAS – Celanese is preparing to sell its Micromax electronic inks and paste unit as part of a broader push to cut debt and raise cash. The business, housed within its engineered materials division, is expected to bring in over $300 million in revenue this year.

The company aims to generate $1 billion from divestitures over the next 30 months, with Micromax positioned as the first in a series of sales.

The company was developed by DuPont and acquired by Celanese during its $11 billion buyout of DuPont’s mobility and materials segment in 2022.

TechSearch Warns of Substrate Shortage by 2029

AUSTIN, TX – A supply shortage of build-up substrates is looming, starting in 2029, with tight conditions emerging as early as 2028, according to a new report from tech research firm TechSearch International.

In its latest Advanced Packaging Update, TechSearch says a surge in artificial intelligence hardware, particularly for training and inference workloads, is accelerating demand for high-bandwidth memory stacks and pushing substrate body sizes larger across server CPUs and high-end network switches.

The report, which includes a detailed capacity and demand analysis, emphasizes how this trend will affect the global supply chain for advanced packaging.

Epec Acquires Roca Printed Circuits

DALLAS – Epec Engineered Technologies’ NetVia Group division has acquired Roca Printed Circuits, a move aimed at enhancing both companies’ printed circuit board offerings.

Barry Finberg, president of Dallas-based Roca, said the partnership comes in response to global economic shifts and supply chain pressures: “Epec was the clear choice to uphold the standards of quality, pricing and delivery that Roca customers have come to expect.”

Epec has expanded its manufacturing facilities across the US, UK and Asia. Since acquiring NetVia in 2020, the company has doubled production capacity and now adds Roca’s operations to its Dallas-based footprint.

Kaynes Technology Acquires August Electronics

CALGARY, AB – Kaynes Technology India Limited has announced the acquisition of Canada-based August Electronics through its subsidiary, Kaynes Canada Ltd. The transaction was expected to close by the end of May, pending regulatory approvals.

August will continue to operate under its existing structure, with CEO Tanya Korenda remaining in her role, while Co-Founders Jack Francis and Peter Wilson will step away.

“There is a tremendous alignment between August and Kaynes in terms of culture, capabilities and customer focus,” said Korenda.

Taiwan’s PCB Industry to Grow 6% to $40B in 2025

TAIPEI – Taiwan’s PCB industry is projected to reach $39.9 billion this year, growing 5.8% year-over-year, according to a joint report released in May by the Taiwan Printed Circuit Association (TPCA) and ITRI’s Industrial Economics and Knowledge Center. Last year, the industry recorded $37.7 billion, an 8.1% rise fueled by strong demand for AI server applications.

The materials segment saw a significant boost, growing 13.4% to $10.7 billion last year compared to the year prior. Rigid board materials accounted for more than half of this, with high-end copper-clad laminates (CCL) and low-loss materials leading demand for use in 800G switches and AI/HPC servers.

Flexible PCB materials are gaining traction in emerging technologies like smart glasses, which are expected to grow this year. Taiwan is developing low-loss substrates and transparent PI to support this shift. The flexible materials market is projected to grow 8.5% this year compared to last year, reaching $11.6 billion. (more)

Bluetooth Circuit Board Design Guidelines

Six steps for limiting interference and data loss.
by Andrew Gonzales and Jason Metzner

Printed circuit boards (PCBs) utilizing Bluetooth technology can encounter issues like interference, lost data and poor signal integrity if certain precautions aren’t taken. This guide outlines essential rules and guidelines for selecting Bluetooth technology for various applications and, more specifically, for integrating it into circuit boards.

A variety of applications utilize Bluetooth, including:

• Beacons used in shopping malls
• Eddystone frames for industrial sensing applications
• Headsets and audio/stereo products
• Remote peripheral devices such as video game controllers or computer mice/keyboards
• Home automation systems
• Wireless consumer electronics applications, including cameras, printers and phones.

Each application incorporates the same common Bluetooth technology but adapts it based on connection types. Design engineers must apply fundamental principles to optimize signal integrity and enhance overall device effectiveness.

Fundamentals of PCB Stack-up and Signal Integrity

A summary of how to order layers to achieve target impedance values.
by Akber Roy

Printed circuit boards are becoming highly dense, hosting all kinds of high-speed interfaces. The bandwidth of the clock frequencies reaches hundreds of GHz, leading to complex issues related to EMI interference, crosstalk, reflections, jitter and losses.

These new challenges impact all processes involved in design, analysis, manufacturing and testing. Manufacturers employ advanced and complex technologies and methods to accommodate the higher density of functionalities packed into smaller components. To manage losses and achieve desired functionality at higher speeds, research into new materials is leading and revolutionizing this industry. The PCB is at the center of issues related to signal integrity, power integrity, electromagnetic interference, crosstalk, mechanical, thermal and more. It also plays an integral role in solutions for each of these challenges.

These issues begin at PCB stack-up design, since a well-designed stack-up forms the foundation of a strong and stable PCB. It acts as the fundamental backbone of the PCB design structure that impacts signal integrity, power distribution and signal impedance. A sound and properly designed stack-up minimizes the circuit’s vulnerability to external noise and helps improve the electromagnetic compatibility of the product (Figure 1).

AI in Electronics Manufacturing: What’s Working Now, What’s Not (But Should Be)

Artificial intelligence is superb at corralling volumes of data but still lacks the flexibility needed for many engineering tasks.
by Ryann Howard

AI is transforming electronics design and manufacturing, making significant strides in everything from procurement to PCB design, and even defect detection. But while there’s a lot AI can do today, there’s still a whole lot it can’t (yet). Here’s what’s really happening on the ground according to experts in the field.

The easy consensus among those we spoke with is that AI automates the repetitive stuff. At Celus, André Reggiani, AI product manager, highlights that AI is really shining when it comes to “retrieving tons of information from datasheets” and helping engineers “find the right components for their circuits.” No more scouring datasheets, crossing fingers that you’re not missing something important. It’s like having an incredibly efficient assistant, but with fewer coffee breaks.

Similarly, Zachary Feuerstein from Breadboard points to AI’s prowess in automating data extraction – think BoMs, RFQs, POs and supplier communications. “It can clean up unstructured data, extract part numbers and even handle back-and-forth emails with suppliers,” he says. This doesn’t just save time; it slashes the annoying admin work that no one signed up for in the first place.

Factors Contributing to Solder Ball Formation: A Guide

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes.
by Md. Imtiaz Uddin

Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the leads or pads of surface mount components. Ranging from just a few micrometers to a couple of hundred micrometers in diameter, these balls form from issues in the soldering process.

If solder balls appear, they can affect the overall functionality of the circuit board. Small solder balls are unsightly and can move components slightly off mark. In the worst cases, bigger solder balls can fall off the surface and deplete the quality of the component joints. Worse, balls can roll onto other board parts, leading to shorts and burns.

Typically, solder balls are located on the side of chip components (Figure 1). Solder balls, which are typically between 0.2mm and 0.4mm in diameter, can occasionally be observed surrounding the pins of ICs and connectors.

Mechatronics Assembly Techniques You Should Be Using in 2025

Ten techniques to ensure a smooth end-to-end process.
by Neil Sharp

From medical devices to monitoring systems, products are becoming smaller, smarter and more complex to manufacture, making mechatronics assembly the bedrock of innovation for forward-thinking OEMs. Modern mechatronics manufacturing no longer focuses solely on mechanical integration; it now fuses electronics, sensors, software and control systems in ways that demand tighter tolerances, smarter testing and leaner processes. Although core techniques remain relevant, recent developments in mechatronics assembly – such as the integration of Industry 4.0 technologies, automation and AI – means more modern techniques are emerging.

To meet the high level of skill, precision, accuracy and consistency that today’s mechatronic assemblies demand, here are 10 advanced mechatronic assembly techniques that ensure a smooth end-to-end process.

Antenna Design

“Flexible Metasurface Loaded Felt Substrate Built Wearable Antenna with Tri-band and High Gain Features for WBAN Applications”

Authors: Dheeray Nagar, Prashant Ranjan and Atanu Chowdhury

Abstract: A low-profile tri-band wearable antenna is presented. The unique features of the proposed antenna design are as follows: 1) With the assistance of dual U-formed printed lines, the proposed wearable antenna works in three different frequency bands; i.e., 2.4GHz, 3.5 GHz and 5.5 GHz; and 2) the single metasurface placed on the backside of the antenna reduces specific absorption rate (SAR) by more than 90% and improves antenna gain (4.55dBi) in all three operating bands. The designed aerial and metasurface have total size of 46.12 × 51.8 × 1.3mm³ and 90 × 90 × 1.3mm³, respectively. Experimental results confirm that the designed aerial operates at 2.4-2.59GHz, 3.15-3.76GHz and 5.1-5.9GHz. Furthermore, the radius of curvature was shown to have no effect on the functioning of the developed antenna, which makes it ideal for on-body measurements. Additional studies on low-cost felt substrate-based antennas for wireless body area network (WBAN) applications may be motivated by this concept. (Journal of Electronic Materials, April 12, 2025, https://doi.org/10.1007/s11664-025-11910-x)