TTM Technologies to Acquire Epiq Solutions for $1.1B

SANTA ANA, CA – TTM Technologies has entered into a definitive agreement to acquire Epiq Solutions from an affiliate of Veritas Capital for $1.1 billion. The transaction is expected to close by the end of 2026, subject to regulatory approvals.

Epiq provides software-defined radios, embedded computing and other specialized radio technologies for commercial, government and defense customers. Its technologies serve signal intelligence, electronic warfare, unmanned systems and space applications.

Veritas acquired Epiq in 2022 and subsequently expanded the company through product development and the acquisitions of Xiphos Systems and Cyber Radio Solutions, adding space-based computing and high-performance RF capabilities.End of article content 

Victory Giant Plans $444M PCB Plant for AI Demand

HUIZHOU, CHINA – Victory Giant Technology plans to invest at least $444 million in a new PCB manufacturing facility in Huizhou as the company expands capacity for AI computing applications.

The company acquired a 100,000-square-meter industrial site for the facility, with at least $296 million of the planned investment expected to go toward fixed assets. Victory Giant has expanded its presence in GPU and AI accelerator supply chains in recent years, including through its HDI business.

NXP Breaks Ground on Malaysia Assembly and Test Factory

PETALING JAYA, MALAYSIA – NXP Semiconductors has broken ground on a 500,000-sq.-ft. assembly and test factory that will more than double the output of its Malaysian operations once fully operational.

The facility will increase NXP’s existing Petaling Jaya site to approximately 900,000 sq. ft., with production expected to begin ramping in the first quarter of 2028. The additional capacity will provide assembly and testing across NXP’s semiconductor portfolio.

DRAM Shortage Could Force Nvidia to Rethink Rubin Ultra Memory

TAIPEI – Tight DRAM supplies expected to persist through 2027 could lead Nvidia to reduce the HBM configuration of its next-generation Rubin Ultra AI platform, according to TrendForce.

Nvidia is evaluating 8-Hi and 12-Hi configurations using HBM4 and HBM4e as uncertainty surrounding DRAM wafer capacity and production yields complicates the originally planned 12-Hi HBM4e configuration. Other AI hardware developers are also reconsidering memory configurations as supply constraints persist.

TrendForce forecasts HBM bit shipments will rise 50% to 60% year-over-year in 2027 but remain insufficient to meet demand, maintaining availability and cost pressures for AI chip developers.End of article content 

NEOTech Acquires Virtex, Adds Five US Manufacturing Sites

STAMFORD, CT – NEOTech has acquired electronics manufacturing services provider Virtex, expanding its US manufacturing footprint and high-reliability electronics capabilities for defense applications. Financial terms were not disclosed.

Virtex operates five US facilities and provides PCB assembly, engineering and testing, cable and harness assembly, system integration, supply chain management and aftermarket services. The combined organization will operate 11 facilities and employ more than 2,500 people.

The acquisition also expands NEOTech’s capacity for complex, low- to medium-volume, high-mix electronics manufacturing and adds to its ITAR-registered domestic manufacturing footprint.End of article content 

RRP Electronics Moves to Acquire Vital Electronics

INDIA – RRP Electronics has signed a memorandum of understanding and term sheet to acquire electronics manufacturing services provider Vital Electronics as it looks to expand beyond semiconductor packaging into complete electronic system manufacturing.

RRP plans to acquire 100% of Vital Electronics in four tranches, reaching 50% ownership by March 2027 and completing the transaction by March 2028, subject to milestones and regulatory approvals.

Vital Electronics provides PCB assembly, SMT, electromechanical assembly, engineering, sourcing, testing and box-build services. RRP said combining those capabilities with its semiconductor packaging operations would create an integrated manufacturing chain from semiconductor packaging through PCB assembly and finished systems.End of article content 

CACI Opens Defense Electronics Manufacturing Center in New York

PITTSFORD, NY – CACI International has opened a 61,000-sq.-ft. Manufacturing Center of Excellence for Defense Electronics, increasing its manufacturing space by more than 300%.

The facility will support development, testing, assembly and delivery of electronic warfare technologies for the US military. It will also support CACI’s Terrestrial Layer System Brigade Combat Team Manpack program with the US Army, for which the company received a nearly $400 million contract modification in 2025.

Velocity Group Triples Capacity with Ohio Manufacturing Plant

CAMBRIDGE, OH – Velocity Group has opened an 80,000-sq.-ft. manufacturing facility in Cambridge, consolidating three previous facilities and tripling its production capacity.

The plant adds more than 25,000 sq. ft. of production space for high-mix, low- to mid-volume manufacturing of electronic and electromechanical products. New capabilities include insert molding, overmolding, large-part injection molding and precision machining.

Velocity Group said the facility will also more than double its subassembly and assembly capacity and includes injection molding capabilities within an FDA Class 7 clean room for medical device manufacturing.End of article content 

Norautron Acquires Jaltek to Expand UK Manufacturing

HORTEN, NORWAY – Norautron has acquired UK-based electronics manufacturing services (EMS) provider Jaltek, expanding its manufacturing footprint into the United Kingdom.

Jaltek has more than 35 years of experience in electronics design and manufacturing for aerospace, defense, medical technology and industrial electronics. Its capabilities include new product introduction, PCB assembly layout, manufacturing, testing and final system assembly.

Jaltek will continue operating from its existing facilities under its current management team while gaining access to Norautron’s international manufacturing network and technical resources.End of article content 

Foxconn Unit Acquires Mexico Land for $20M

TAIPEI – Foxconn subsidiary FII AMC Mexico has acquired approximately 2.6 million sq. ft. of land in El Salto, Jalisco, Mexico, for approximately $20 million.

The property, purchased from FARUBA, was appraised at approximately $20.6 million. Foxconn said its board approved the transaction Aug. 18 for operational needs.

The acquisition adds to Foxconn’s existing manufacturing presence in Mexico as the electronics manufacturing services provider maintains significant production operations in the country.End of article content 

Dixon Technologies Forms Smartphone Manufacturing Venture

NOIDA, INDIA – Dixon Technologies is establishing a subsidiary to support its electronic device manufacturing business, including smartphones, through a joint venture with Vivo Mobile India.

Dixon will hold a 51% stake in Advistor Electronics India through an initial investment of approximately $295,000. India’s Ministry of Electronics and Information Technology has approved Vivo Mobile India’s proposed investment in the venture.

The joint venture will expand Dixon’s smartphone manufacturing capacity, with revenue from the business expected to begin contributing during the October-December quarter.End of article content 

Quectel Opens Brazil R&D Center for PCB Design, IoT Engineering

MANAUS, BRAZIL – Quectel Solutions has opened its first South American R&D center in Manaus, expanding its engineering presence in Latin America.

The facility, Quectel’s ninth global R&D center, will focus on smart modules, cellular and short-range communication modules, PCB design and ODM customization services. Engineering teams will support industrial IoT, utilities and asset-tracking applications.

Unichem Moves to Acquire Loomia Technologies

BROOKLYN, NY – Unichem has signed a term sheet to acquire flexible electronics company Loomia Technologies for up to $6 million, with plans to extend its technology into robotics, automotive, medical and other applications.

Loomia develops an ultra-thin flexible electronic circuit structure that integrates into materials such as leather and textiles to provide heating and pressure and temperature sensing. Unichem plans to combine the technology with its materials manufacturing capabilities to develop large-area electronic skin for humanoid robots.

Potential applications also include medical devices, wearables, automotive interiors and thermal sensing in AI data centers. Unichem plans to retain Loomia founder Madison Maxey and key R&D personnel, with its Brooklyn operation serving as a North American R&D and market development hub.End of article content 

GSI Group Acquires Aven Tools

MAHWAH, NJ – GSI Group Holdings has acquired Aven Tools, adding the precision tool and microscopy equipment provider to its portfolio of laboratory and industrial workflow brands.

Aven supplies digital and stereo microscopes, LED illumination systems, cameras, tweezers, magnifiers and other precision tools used in industrial electronics, medical device and research applications.

GSI said the acquisition expands its presence in industrial electronics and medical device workflows while adding Aven’s dealer network and customer base of more than 1,000 customers. Aven joins GSI brands Globe Scientific, AmScope, Euromex and GenesisBPS.End of article content 

Components, Electronics Production Surging in Taiwan

TAIPEI – Taiwan’s Ministry of Economic Affairs announced the domestic electronic components production index hit a new high in July, ahead of the coming peak season for consumer electronics.

The electronic components production index was 154, up 23% year-over-year. The IC production index was 175, up 27%, while the computer, electronic products, and optical products production index was 458, up 96%.

The second half is the peak season for consumer electronics production, but July’s manufacturing data showed no significant order buying surge yet. AI servers continue to drive manufacturing growth. (more)

High-Power Thermal Management: Two-Layer IMS Design Considerations

As power electronics become more compact and power-dense, two-layer IMS PCB designs are helping improve thermal management, reliability and EMI performance in high-power applications.
by Chris Parker

As electronic systems become more compact and power-dense, effective thermal management has emerged as a primary bottleneck to performance, efficiency, and long-term reliability. These increasing thermal demands are exposing the limitations of conventional FR-4 materials and accelerating the adoption of advanced substrate constructions, such as two-layer insulated metal substrates (IMS), in high-power applications.

Although FR-4 remains a cost-effective and widely used solution for low-power designs, its inherently low thermal conductivity and reliance on dense thermal via networks limit its suitability for advanced power systems based on gallium nitride (GaN) and silicon carbide (SiC) semiconductors. While GaN and SiC power transistors can withstand higher junction temperatures than traditional silicon devices, this capability offers little benefit unless the rest of the PCB assembly can reliably operate under the same conditions.

In contrast, two-layer IMS PCB constructions integrate a thin, thermally conductive dielectric with a metal baseplate, enabling efficient heat transfer directly beneath power components. This architecture lowers junction temperatures, enhances mechanical stability, and supports electromagnetic shielding and space-efficient routing strategies.

Flex DfM Guidelines, Part 2

Proper flex PCB outline design, shielding and stiffener placement help improve manufacturability, durability and long-term reliability in demanding applications.
by Akber Roy

Following Part 1‘s discussion of internal layout and drilling, this section covers the final design considerations needed to prepare a flex PCB for production. It explains how boards are separated from their panels using either high-volume punching or high-precision laser cutting, then examines the use of shielding films, stiffeners and other protective layers. It also outlines key spacing and alignment guidelines that help prevent edge tearing, reduce electromagnetic interference and improve connector durability.

Outline punch. Die punching is typically used in high-volume FPC production. Accurate tooling hole placement ensures alignment during punching and improves dimensional precision. Board features must maintain safe clearance from board edges to prevent damage during die punching.

PCB Designers Earn More, Do More: The 2026 Compensation Picture

The 2026 PCD&F Salary Survey examines compensation, workloads, career satisfaction and the evolving role of PCB designers across the electronics industry.
by Ryann Howard

If your paycheck reflects how your employer sees you, printed circuit board designers are looking pretty good right now.

A decade ago, the percentage of designers who made six figure salaries was low; those who pulled in $150,000 or more were basically nil. Fast forward to today, however, and compensation once reserved for certain engineers is now becoming widespread among layout personnel.

That’s according to the 2026 PCD&F Salary Survey, which found many respondents earning salaries well into six figures. A notable share now earns more than $150,000 annually, reflecting the value employers continue to place on experienced design talent.

Heat Staking vs. Ultrasonic Welding for PCB Assemblies

Both processes form a permanent thermoplastic joint without fasteners or adhesives. For a populated board, the deciding factor is usually not which forms a stronger head – it is where the process energy ends up.
by Alex Spurgeon

Mechanically fastening plastic to a printed circuit assembly is a routine but consequential step. Boards are retained in plastic housings, light pipes and bezels are located to displays, EMI shields and connectors are captured, and standoffs are formed in a single operation. When designers want to avoid screws, snap fits and adhesives, two thermoplastic joining methods dominate the conversation: heat staking and ultrasonic welding. Both melt and reform plastic to lock parts together, and both are fast and free of consumables. They are not, however, interchangeable on a populated board.

This article compares the two processes specifically for PCB assembly work. The thesis is stated up front, because it should drive the decision: the most important difference for a board is not joint strength but how each process delivers energy. Heat staking conducts heat into a localized boss; ultrasonic welding couples high-frequency mechanical vibration through the assembly. On a board carrying vibration-sensitive components and mixed materials, that distinction usually decides the process before throughput or cost enter the discussion.

How each process forms a joint. A heat-staked joint is formed by an external heat source. A temperature-controlled tool, a stream of hot air, or an impulse-heated thermode raises a plastic boss above its softening point. The softened boss is reformed into a head that captures the mating part, then cooled – ideally under pressure – so it solidifies in the formed shape before the tool retracts. The heat is conductive and stays largely within the boss. Thermoplastic staking can be performed with thermal tooling, a hot punch, hot-air/cold-upset tooling or cold forming, and the process readily joins plastics to dissimilar materials, including metal and PCBs¹.

Contamination Control in Robotic Electronics Manufacturing

As robotic systems become more advanced, effective cleaning and contamination control are increasingly important for ensuring long-term reliability and manufacturing consistency.
by Elizabeth Norwood

Robotic systems are becoming increasingly common across industrial automation, logistics, healthcare and manufacturing environments. Whether used for assembly operations, materials handling, inspection or collaborative applications, today’s robotic platforms rely on sophisticated electronic assemblies to process information, control movement and communicate with other systems.

The rapid expansion of the robotics sector is creating demand for more advanced electronic assemblies. According to the State of Robotics 2026 report, the global robotics market reached $38 billion in 2026, growing 34% year-on-year. As manufacturers continue to develop more capable robotic systems and deploy them across a wider range of applications, greater emphasis is being placed on the quality and consistency of the electronics used within them.

At the heart of these machines are printed circuit board assemblies (PCBAs) responsible for power management, sensor interfaces, communications and control functions. To deliver greater functionality, designers are incorporating more components into smaller spaces, resulting in higher-density assemblies and increasingly challenging board layouts.

In Case You Missed It

Microwave Communication

“A Room-Temperature Cavity-Magnonic Source of Correlated Microwave Magnon Polariton Pairs”

Authors: Qiuyuan Wang, Aravind Karthigeyan, Chung-Tao Chou and Luqiao Li

Abstract: Correlated microwave photon sources are required for the development of quantum-limited sensing, signal amplification and communication. The devices typically have a millikelvin operating temperature, which limits their broader application. Here, the authors report a hybrid magnon–photon platform that is based on a printed-circuit-board microstrip resonator coupled to a yttrium iron garnet film and emits strongly correlated microwave signals at room temperature. The authors’ approach achieves non-degenerate excitations by coupling magnon modes simultaneously with two cavity photon modes. Through the magnon–photon interactions in the corresponding linear and nonlinear regimes, one input microwave photon splits into a pair of magnon polaritons that have distinct frequencies and maintain strong intermode correlations. The nonlinear magnon polariton dynamics exhibit true randomness and robust multichannel correlations, and the authors use the system to demonstrate microwave communication with reliable signal transmission through two noisy channels. (Nature Electronics, Aug. 19, 2026, https://www.nature.com/articles/s41928-026-01689-y)