FCT Expands EMS Ops to China

MINNEAPOLIS, MN – Flexible Circuit Technologies has expanded its electronics manufacturing and contract manufacturing services with the opening of FCT-Huizhou.

FCT-Huizhou, operating as inTFlex in Huizhou, China, merged FCT’s manufacturing services into a new facility featuring more than 900,000 sq. ft. of production space. The new facility features high-speed, fully automated SMT smart lines, plastics molding, membrane switches, CNC capabilities and fixtures, and permits FCT to continue providing EMS services to customers across the medical, automotive/EV, consumer and industrial markets, the company said.

“FCT is committed to expanding our resources to meet the needs of our customers,” said Ray Cottrell, executive vice president, FCT. “Our new manufacturing space coupled with bringing on a wealth of knowledge to our team, speaks to our commitment. Our continuous growth is a testament to the hard work and dedication of our team, and the loyalty of our customers. This growth enables us to serve our customers better and opens new opportunities for expanded innovation and research. We are excited about the future of FCT and look forward to continuing our growth!”

PE Group Carlyle Acquires Kyoden

TOKYO – Global investment firm Carlyle in November announced the acquisition of Kyoden, a leading Japanese manufacturer of printed circuit boards. Terms were not immediately disclosed.

Founded in 1983 and headquartered in Nagano Prefecture, Kyoden is a leader in the design and manufacture of PCBs and board assembly for electronics devices, with a focus on small-lot and high-variety products delivered in short turnaround times. The business employs about 2,100 employees, with manufacturing plants in Japan and Thailand and a regional sales presence across APAC. It has deep experience in electronics manufacturing services, providing end-to-end solutions for component design and manufacturing, procurement of materials and assembly of units and large-scale devices.

The company’s product suite spans a diversified set of industrial applications, including automated guided vehicles, semiconductor manufacturing equipment, amusement machines, wired and wireless equipment, and automotive devices.

ISU Petasys Says Looking at Possible Non-PCB Company Acquisitions

DAEGU, SOUTH KOREA – The parent company of printed circuit board fabricator ISU Petasys acknowledged reports in Korean business media that it is considering possible mergers and acquisitions to diversify its business portfolio.

Chosun Biz reported that ISU Group is considering acquiring JEIO, a carbon material developer for products like batteries.

The move, Chosun Biz said, is part of a broader strategy by ISU Group to diversify beyond PCBs.

New Vern Solberg Book Highlights PCB Design Techniques

SAN JOSE – Industry veteran Vern Solberg has released a new book on designing for SMT and ultra-high-density interconnect boards.

Design Guidelines for Surface Mount and Microelectronic Technology is a guide developed for printed circuit board design engineers focusing on SMT assembly processing; land pattern development; DfM for HDI and UHDI circuit boards; flexible and rigid-flex circuits; advanced semiconductor package technologies; and 2-D, 2.5-D, 3-D and hybrid bond interconnects.

The author, Vern Solberg, is an SMT design and assembly expert with over four decades of experience in surface mount, microelectronics and manufacturing technology. He has led multiple industry standards committees for land pattern development, BGAs and other areas.

XLR8, IMI Sign Alliance, Employee Transfer Deal

SAN CLEMENTE, CA – XLR8 EMS and Integrated Micro-Electronics Inc. have signed a deal to form a strategic alliance that includes the transfer of certain employees to XLR8. Financial and other terms were not disclosed.

The transaction, announced in November, noted an undisclosed number of IMI employees in Tustin, CA, will transfer to XLR8.

The alliance between IMI and XLR8 EMS brings together two complementary companies with strong, specialized expertise within EMS. By leveraging their capabilities and technology, the partnership aims to offer their respective customers a broader range of services.

Jabil Looks to Expand India Investments

ST. PETERSBURG, FL – Jabil in November signed a memorandum of understanding with India’s Gujarat state government to permit the company to explore long-term goals, opportunities and support in the state.

The signing comes after another MoU signing with the Tamil Nadu state in September.

“Jabil is committed to expanding in India to meet and grow with the future needs of our customers in the Intelligent Infrastructure segment, which covers our capabilities across cloud, compute, storage, networking, telecommunications, semiconductor capital equipment, and data center infrastructure, among other end-markets,” said Fred McCoy, executive vice president, operations. “The planned expansion also opens up opportunities for Jabil’s customers in the automotive and transportation industry to consider manufacturing in India.”

Asteelflash Opens Polish Production Facility

SAINT-CLOUD, FRANCE – Asteelflash opened a $19 million production facility near Wrocław, Poland, enhancing its box-build and high-level assembly capabilities in the automotive and industrial sectors.

Asteelflash, a member of USI, celebrated the grand opening of the 14,000 sq. m. facility in late October. The factory features 6,655 sq. m. of state-of-the-art clean room production space, which will enable the company to better meet the demands of its European clients, it said.

“Our expanded facility here in Wroclaw ensures we can meet the needs of our clients as the market grows, providing them with the advanced manufacturing capabilities and capacity they need to succeed,” Asteelflash CEO Nicolas Denis said at the opening ceremony. “Our commitment also extends to responsible growth. This facility was designed with sustainability in mind, incorporating energy-efficient systems and environmentally friendly practices to reduce our footprint. We are growing in a way that respects the environment and the future of the communities we serve. With this expansion, we aim to set new standards for our industry and hope to inspire others to invest not only in technology but also in the environment and society.”

Cicor Expanding into Sweden, Talks to Add German EMS

BRONSCHHOFEN, SWITZERLAND – Cicor Group has acquired Swedish development company Nordic Engineering Partner AB and established a significant presence in the Nordics.

Additionally, Cicor is in advanced negotiations to acquire another German EMS provider.

The acquisition of NEP gives Cicor a presence in Sweden, one of Europe’s leading markets for advanced electronics in the healthcare technology, industrial, and aerospace and defense sectors. Its four engineering offices in the Stockholm area offer custom development services and prototype production for complex electronic systems. NEP, whose customers are in Cicor’s target markets, has 45 employees and generated sales of SEK52 million ($4.7 million) in the financial year ended June 30. Post-closing, NEP will continue to its sites in Sweden with existing staff.

SP Manufacturing Expands Asian Operations

SINGAPORE – SP Manufacturing in November announced the acquisition of the Asia operations of Ideal Jacobs, a Hong Kong-based EMS provider.

“IJA is thrilled to join the SP Manufacturing group,” said Ben Meng, chairman of IJA. “The leadership of IJA remains committed to growing our customers and our business, and we’re excited about building the next chapter of growth together with SP Manufacturing. Partnering with SPM gives us important access to a broader range of capabilities, geographies and scale to serve our customers more deeply over time.”

IJA specializes in high-performance printed electronics and human-machine interface (HMI) solutions for the medical, industrial, semiconductor and communication industries. Its customers are primarily in the US and Europe.

Zollner to Acquire Thai EMS Bluechips Microhouse

ZANDT, GERMANY – Zollner Elektronik is expanding its Asian business capabilities by acquiring Bluechips Microhouse, a contract manufacturer based in Thailand.

The German-owned Bluechips has around 650 employees, mainly at its Chiang Mai, Thailand, headquarters. It provides electronics services ranging from PCBAs to full box-build products in industries that include automation, transportation and medical. It has customers in the European, American and Asia-Pacific markets.

“It was important to us to offer our employees a secure future,” Bluechips founder and managing director Thomas Zimpfer said about the alliance. “Through the partnership with Zollner, we are confident that our team and our company will have the best environment to grow into the opportunities that lie ahead. Our shared goals and values ​​form the basis for an exciting partnership.”

Electronic Source Co. Acquired by PE Firm

LOS ANGELES – EMS provider Electronic Source Company has been acquired by private equity firm Sverica Capital Management, which aims to lead the company through its next stage of growth.

ESC is a provider of high-reliability electronics components for demanding environments, primarily in the aerospace and defense and space industries. The company offers services from circuit card assembly through complex box build, as well as engineering services, prototype assembly, new product introduction, test services and supply chain solutions.

Jabil, Cyferd Launch AI-Driven Supply Chain Platform

ST. PETERSBURG, FL – Jabil has announced a joint venture with AI company Cyferd to introduce ID8 Global, a GenAI-driven autonomous supply chain and procurement platform.

By combining Jabil’s experience across the global supply chain with Cyferd’s advanced platform capabilities and self-learning AI engine, ID8 Global’s customizable software will allow teams to autonomously manage their supply chains while addressing disruptions, optimizing procurement processes and responding to market changes in real time, the companies said in a release.

“By merging Jabil’s industry expertise with Cyferd’s cutting-edge AI capabilities, we’re not just improving the supply chain; we’re reimagining it,” said Frank McKay, chief procurement and supply chain officer at Jabil. “This platform will help organizations scale faster and adapt to global demands. We’re at the forefront of something truly transformative that will strengthen Jabil’s relationships with its customers and suppliers.”

Electronics Companies Spurring US Construction Boom

BANNOCKBURN, IL – Manufacturers are investing in new facilities at a record pace, according to IPC, some 2.3 times the 2019 (pre-Covid) levels. Much of this is likely attributable to the Chips Act, which has spurred billions in capital investment over the past 24 months.

Speaking in an open webinar in November, IPC’s Shawn DuBravac added that electronics manufacturing is “nearly 55% of the manufacturing construction spend.” (more)

Collaborating Across the Industry

The High Density Packaging User Group drives innovation through active partnerships.
by Tyler Hanes

For more than 30 years, the High Density Packaging User Group has facilitated innovations in the electronics industry supply chain, encouraging collaboration to solve some of the industry’s critical problems.

We sat down with HDP project facilitator Karl Sauter during PCB West 2024 to learn more about the group and some of its ongoing and completed projects.

Sauter said the group’s primary focus is to permit companies to collaborate on large joint research projects that would otherwise be too costly or require too many resources for a single company to conduct independently.

How to Run a Design of Experiments

A review of the six fundamental steps behind scientific process development.
by Patrick Valentine

Design of experiments (DoE) is an efficient method for planning experimental tests so the data obtained can be analyzed to produce valid and objective conclusions. Designed experiments are commonly used for product and process design, development and improvement. Here we review the history of designed experiments, experimental design, common design of experiments and experimental steps.

Aristotle (384-322 BC) laid the foundation for the scientific method. At the beginning of the 19^th century, science was established as an independent and respected field of study, and the scientific method was embraced worldwide. The scientific method is a five-step process. These five steps are 1) make observations, 2) propose a hypothesis, 3) design and conduct an experiment, 4) analyze the data, 5) accept or reject the hypothesis, and, if necessary, propose and test a new hypothesis. Early experiments were one-factor-at-a-time (OFAT). These designs would vary only one factor or variable at a time while keeping the others fixed. But in 1922, things changed.

In 1922-23, RA Fisher (Figure 1) published essential papers on designed experiments and their application to the agricultural sciences. Fisher is revered as the godfather of modern experimentation. Then, in 1932-33, the British textile and woolen and German chemical industries began using designed experiments for product and process development. In 1951, Box and Wilson started publishing fundamental work using designed experiments and response surface methodology (RSM) for process optimization. Their focus was on the chemical industry. The applications of designed experiments in the chemical industry began to increase. From 1975 through 1978, books on designed experiments geared toward engineers and scientists began to appear. In the 1980s, various organizations adopted experimental design methods, including electronics, aerospace, semiconductor and the automotive industries. Taguchi’s methods of designed experiments first appeared in the United States. In 1986, statisticians and engineers visiting Japan saw firsthand the extensive use of designed experiments and other statistical methods. During the early 1970s through the late 1980s, proprietary design of experiment software began to emerge (Minitab, JMP and Design Expert). In 2011, Jones and Nachtsheim introduced the definitive screening design of experiments.^1,2

American Standard Circuits’ Push for
UHDI is On

After new technology investments, the flagship operation of the Chicago-based fab is primed for growth.
by Mike Buetow

As the US electronics manufacturing industry braces for the next wave of technological advancements, American Standard Circuits is positioning itself as a key player in the ultra-high-density interconnect (UHDI) space. Yet, the looming question remains: Could UHDI follow the same path as HDI, where slow domestic investment permitted Asia to dominate?

Years ago, HDI production was overtaken by Asian manufacturers, as the US didn’t invest fast enough. UHDI could follow a similar trajectory, especially as the demand signal for the technology remains unclear, particularly in defense. As circuit board investment ramps in India, Thailand and Vietnam, it adds pressure on North America’s ability to compete for next-generation products. ASC, however, recognizes that PCB manufacturing should be viewed as critical infrastructure, akin to roads and buildings – integral to defense, medical, automotive and communications sectors.

Earlier this year, PCD&F/CIRCUITS ASSEMBLY profiled ASC’s operations in the Pacific Northwest, the former Sunstone Circuits. Its editors followed that up in the summer by visiting the company’s flagship plant in West Chicago, IL.

The CIRCUITS ASSEMBLY 2024 Service Excellence Award Winners

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY in October announced the winners of its 32nd annual Service Excellence Awards (SEAs) for electronics manufacturing services (EMS) providers and electronics assembly equipment, materials and software suppliers.

CIRCUITS ASSEMBLY recognized companies that received the highest customer service ratings, as judged by their own customers, during a ceremony at the SMTA International trade show in Chicago.

In the EMS category, the overall winners were Creation Technologies (sales over $500 million), Mack Technologies (sales of $100 million to $500 million), Silicon Forest Electronics (sales of $20 million to $100 million), and XLR8 Services (sales under $20 million).

Filling the Gap: Underfill Materials Dispensing for Electronics

The benefits of capillary flow underfills on solder joint reliability.
by Nathan Preslan

In electronics manufacturing, underfill refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, ball grid arrays (BGA), or chip-scale packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3-D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.

Underfill materials are essential in modern electronics manufacturing and are used extensively to enhance the reliability, performance and longevity of electronic assemblies. These materials improve mechanical strength by enhancing the physical bond between the chip and substrate, reducing the risk of solder joint failure due to mechanical stress.

In applications where it is important for the assembly to withstand thermal cycling, underfills improve thermal cycling performance by reducing the risk of failures due to thermal expansion and contraction. Another key benefit of underfills is the protective barrier the provide against moisture, contaminants, and other environmental factors.

Ensuring Optimal Performance of Solder Paste in Challenging Environments

Heat and cold can prematurely degrade incorrectly handled materials.
by Gayle Towell

Solder paste is an elaborate mixture of metal powders, acids, thixotropes, solvents and a variety of other chemicals. When combined, the reactions and interactions can be extremely varied and complex. When designing solder paste chemistry, key considerations include not only its in-process performance but also how to maintain the stability of that performance against the rigors of time, temperature fluctuations and usage.

Stencil printing is a pivotal process on the assembly line, foundational to the entire assembly. A quality print can significantly reduce the need for rework, whereas a poor print almost certainly necessitates it. Print quality, and the PCB assembly process in general, are susceptible to various external influences like environmental conditions, setup alterations and operator variability, emphasizing the need for consistent solder paste performance to minimize manufacturing discrepancies.

Controlling the Conditions

The first link in the chain is the solder paste’s manufacturing process and its constituent materials. Powder is manufactured and stored under extremely tightly controlled conditions. Flux medium raw materials require controlled storage, and the flux medium is also produced under tightly controlled conditions, with an abundance of quality control measures. The slightest anomaly in flux production can generate unacceptable results on the SMT assembly line.

In Case You Missed It

Defect Detection

“MDD-DETR: Lightweight Detection Algorithm for Printed Circuit Board Minor Defects”

Authors: Jinmin Peng, et. al.

Abstract: PCBs (printed circuit boards) are the core components of modern electronic devices, and inspecting them for defects will have a direct impact on the performance, reliability and cost of the product. However, the performance of current detection algorithms in identifying minor PCB defects (e.g., mouse bites and spurs) requires improvement. This work presents the MDD-DETR algorithm for detecting minor defects in PCBs. The backbone network, MDDNet, is used to efficiently extract features while significantly reducing the number of parameters. Simultaneously, the HiLo attention mechanism captures both high- and low-frequency features, transmitting a broader range of gradient information to the neck. Additionally, the proposed SOEP neck network effectively fuses scale features, particularly those rich in small targets, while INM-IoU loss function optimization enables more effective distinction between defects and background, further improving detection accuracy. Experimental results on the PCB_DATASET show that MDD-DETR achieves a 99.3% mAP, outperforming RT-DETR by 2% and reducing parameters by 32.3%, thus effectively addressing the challenges of detecting minor PCB defects. (Electronics, October 2024, https://doi.org/10.3390/electronics13224453)