Nippon Denkai to Close Last Remaining US Copper Foil Plant

AUGUSTA, GA – Nippon Denkai has decided to close and liquidate its copper foil manufacturing plant here, the last such factory in the United States.

Denkai America Inc., the US-based subsidiary of the Japanese company, will close just two years after its parent company heralded the site as the future of foil production, with tens of millions of dollars in investments planned and hundreds of new jobs expected.

The company cited financial problems stemming from semiconductor shortages, decreased exports of domestically manufactured batteries, lower demand for smartphones, and other factors for the decision. The continued losses, coupled with loan payments coming due and dried-up sources of new capital, have rendered the company insolvent.

EU Set to Approve Synopsys-Ansys Deal; UK Watchdog Raises Concerns

BRUSSELS – Synopsys’ $35 billion acquisition of Ansys is reportedly set to win conditional EU antitrust approval after the company pledged to address competition concerns, while the UK debates permitting the deal to go through.

Reuters reported that the European Commission, which acts as the EU’s antitrust enforcer, is set to approve the deal after Synopsys offered to sell its optical design tool maker Optical Solutions Group and Ansys PowerArtist.

The company is expected to offer the same remedies to the UK’s Competition and Markets Authority, which also raised concerns about the potential for reduced competition in the semiconductor chip design and light simulation markets, Reuters reported.

DBG Technology to Acquire All Circuits

MEUNG-SUR-LOIRE, FRANCE – All Circuits, one of France’s largest EMS providers, is set to be acquired by China’s DBG Technology at the beginning of 2025.

With the acquisition, All Circuits will add China to its manufacturing footprint, as well as India and Vietnam, which, alongside Mexico, are seen as winners in the move to reduce dependency on China as the factory of the world, the company said.

DBG, which also has a facility in Bangladesh, will gain additional capacity in France, Tunisia and Mexico.

AI-Based Design Startup Raises $6.8M in Seed Funding

MONTREAL – Cadstrom, an AI startup that aims to allow electronic design with minimal respins, announced that it has raised $6.8 million in seed funding.

Founded in 2023 by Margot Blouin and Scott Bright, Cadstrom builds AI tools enabling electrical engineers to create devices that work correctly on their first attempt. Its proprietary Sigma Engine uses a first-principles understanding of physics, electronics and generative AI to identify mistakes while automatically validating complex designs – cutting development costs, accelerating GTM timeline and shortening design cycles up to 66% by eliminating respins, the company said.

“We founded Cadstrom to address the reality that most electronics designs require several time-consuming revisions, and the problem is getting worse as electronics, AI, and connectivity becomes increasingly ubiquitous. Our vision is one where every engineer can achieve robust designs on their first build and get to market faster,” said Blouin. “This funding represents a critical milestone for our team, and we’re excited to put the capital to work to further develop our automated verification tools that detect and address the most common issues that electrical engineers face.”

Cofactr Raises $17M in Series A Funding

NEW YORK – Cofactr, a provider of a supply chain and logistics management platform for hardware manufacturers, has raised $17.2 million in a series A investment round.

Bain Capital led the Series A round, with existing investors Y Combinator, Floating Point Ventures, Broom Technologies and DNX Ventures also participating. The company said it will use the funding to grow its go-to-market efforts and its suite of supply-chain risk management and process tools. It also plans to introduce additional product categories, with multiple applications slated to launch each year.

Cofactr’s platform integrates procurement automation, supply chain data intelligence and logistics infrastructure to streamline the manufacturing process for hardware teams, allowing them to source, quote, procure, manage, kit and ship electronic components through the same platform.

GreenSource Plans UHDI PCB Facility in NH

CHARLESTOWN, NH – GreenSource Fabrication has received additional funding for its planned 98,000 sq. ft. UHDI PCB manufacturing facility here.

The New Hampshire Business Finance Authority (NHBFA) board unanimously approved a bond of up to $50 million to support the project, with the approval also involving the US Department of Defense as a funding partner, the New Hampshire Business Review reported.

GreenSource, a subsidiary of Whelen Engineering, launched in 2019 and previously received a $46.2 million grant from the DoD to enhance its capabilities in defense-sector UHDI PCB manufacturing.

Ventec Chooses Thailand for PCB Material Manufacturing Facility

SUZHOU, CHINA – Ventec has selected Thailand as the location for a $17 million PCB material manufacturing facility.

The company said the new facility will be built on 8.4 acres in the Hi-Tech Industrial Estate north of Bangkok in Ayutthaya Province, reinforcing its commitment to global supply chain resiliency by expanding its manufacturing footprint beyond China and Taiwan, as well as customer proximity in the developing Southeast Asia PCB manufacturing hub.

Ventec announced in June 2023 that it would establish a manufacturing base in Southeast Asia to diversify geographical risk and enhance support for growing customer demand. Construction is scheduled to commence in the second quarter of 2025, and full production will start in the first quarter of 2026. The facility will offer cutting-edge production capabilities across two phases, achieving a capacity of 150,000 sheets per month in the first phase, the company said.

OKI Improves Heat Dissipation with Stepped Copper Coin Insertion

TOKYO – OKI Circuit Technology has developed multilayer PCB technology with stepped copper coin insertion, which reportedly achieves 55 times better heat dissipation than conventional PCBs.

The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB, and OKI said it is working to develop mass-production technologies with the aim of PCBs with the new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.

In 2015, OKI developed proprietary design and mass production technologies for multilayer PCBs based on copper coin insertion. This innovation embeds cylindrical copper coins with high thermal conductivity into PCB through-holes and bonds them to heat-generating electronic components to dissipate heat to the substrate’s underside.

Meiko Plans $300M PCB Fab Expansion in Hanoi

HANOI – Meiko Electronics reportedly plans to invest $300 million to build a new PCB fabrication facility here.

The new investment by Meiko will build its fourth PCB plant in the city and will raise its total investment in the area to $800 million, The Investor reported.

The new construction is scheduled to be completed in March 2027, with operation beginning the following month. The project, located in Thach That-Quoc Oai Industrial Park, now employs 3,770 people and is set to increase the workforce to 4,170 with the expansion.

Icape Group Acquires UK PCB Distributor, Minority Stake in Green PCB Developer

FONTENAY-AUX-ROSES, FRANCE – Icape Group has announced the acquisition of 100% of the capital of ALR Services, a British PCB distributor.

With the acquisition, Icape expands its business in the UK while integrating a local structure renowned for its expertise and commitment to continuous improvement, the company said, while ALR Services now has access to a greater range of services and the full purchasing power of Icape.

“We are delighted to integrate ALR Services, which gives us a footprint in the United Kingdom, a highly competitive market for PCB distribution players,” said Icape Group CEO Yann Duigou. “As with all Icape Group acquisitions, we identified strong synergies and concrete cross-selling opportunities between our two organizations, which should translate into increased post-integration revenue. In addition, ALR Services’ local teams serve a portfolio of 300 active customers, not addressed by the Icape Group, to whom they will now be able to offer the full range of services offered by our global platform.”

Gentex Announces Acquisition of Voxx International

ZEELAND, MI – Automotive electronics manufacturer Gentex has announced the acquisition of all remaining shares of Voxx International for around $120 million.

Gentex previously held around 30% of Voxx’s shares and agreed to acquire the rest of the company’s shares at $7.50 per share in an all-cash transaction. The acquisition of Voxx will result in an increase in annual revenue of $350 million to $400 million, Gentex said in a release.

Voxx produces automotive and consumer electronics, supplying in-vehicle entertainment and security systems to the automotive industry and consumer audio systems under the Klipsch, Onkyo and Integra brands.

Sero Acquires European EMS EPSa

ROHRBACH, GERMANY – Sero EMS has announced the acquisition of EPSa-Elektronik & Präzisionsbau Saalfeld, a German EMS provider, and EPSa Děčín, its Czech subsidiary. Financial terms were not disclosed.

With the addition of EPSa’s facilities and personnel in Germany and Czechia, Sero strengthens its development capabilities, enhancing its expertise in software and hardware development, mechanical engineering, rapid prototyping and high-mix, low-volume production, the company said in a release. EPSa’s specialized skill set will enhance Sero’s ability to better serve complex customer needs and offer tailored solutions with a focus on MedTech equipment and high-end industrial applications.

“EPSa is a fantastic addition to the Sero EMS family,” said Jan-Frederik Kalee, CEO, Sero EMS Group. “Their technical capabilities and commitment to quality align perfectly with our strategic goals. Together, we are positioned to offer enhanced, end-to-end solutions that meet the growing complexity of customer demands across industries.”

Eagle Electronics Building OH Manufacturing Facility

SOLON, OH – Eagle Electronics has raised $14 million to build a new manufacturing facility here in partnership with CO-AX Technology.

The EMS provider and producer of cellular modules said it plans to use the funding, led by the OHIO Fund with participation from Asymmetric Capital Partners, to build an advanced electronics manufacturing plant, leveraging cutting-edge surface-mount technology manufacturing equipment.

“This is a major moment for Eagle and our vision of onshoring and securing America’s critical technologies,” said TJ Dembinski, co-founder and CEO of Eagle Electronics. “Our goal is to set a new standard for electronics manufacturing in the US, combining the most advanced automated manufacturing and testing technology with rigorous hardware and software cybersecurity testing throughout the supply chain. This offering will allow Eagle to onshore critical knowledge and essential technologies, all while continuing to cement the United States’ leadership in the chip industry.”

SEMI Publishes Recommendations for EU Semiconductor Policies

BRUSSELS, BELGIUM – SEMI has published recommendations for the European Union to bolster its semiconductor ecosystem, urging new commissioners to implement legislation to advance the semiconductor sector given its role as a key driver of technological advancement, economic growth and ensuring Europe’s future competitiveness on the global stage.

“In light of multiple technological disruptions such as AI and autonomous vehicles poised to drive industry growth over the years ahead, SEMI Europe presents its recommendations for a successful long-term strategy for the European semiconductor industry,” said Laith Altimime, president of SEMI Europe. “The European Chips Act has generated strong momentum, and our recommendations highlight urgent actions to continue the progress made. Policymakers must build on this momentum by strengthening the legislative framework and advancing toward a ‘Chips Act 2.0.’”

SEMI Europe’s key recommendations for policymakers to consider include:

• Strengthening the semiconductor ecosystem by optimizing funding across the EU, member states, and private sectors to achieve the EU’s goal of a 20% global market share by 2030, advancing toward a comprehensive “European Chips Act 2.0”

Wistron Set to Open Vietnam Manufacturing Plant

HA NAM PROVINCE, VIETNAM – Wistron reportedly plans to begin operations in January at its new $24.5 million manufacturing plant here.

The manufacturer’s Victory II facility, which was scheduled to have equipment installed by the end of December, will employ 530 staff once completed, and will have an annual production capacity of 3 million LCD panels, 5.9 million notebooks, 375,000 desktop computers, 1.2 million VoIP phones, 300,000 motherboards and additional products, The Investor reported.

The company previously invested $363.9 million in its Victory I facility, also located in Ha Nam Province, with operations beginning in December 2021 to manufacture notebooks, motherboards, desktop computers, and camera modules.

Delta, Cal-Comp Sign MoU to Advance EMS Automation

BANGKOK – Delta Electronics and Cal-Comp Electronics are partnering to advance the EMS industry by combining Delta’s automation expertise with Cal-Comp’s manufacturing capabilities.

The memorandum of understanding between the companies reflects a shared commitment to advancing efficiency, innovation, and sustainability in the EMS industry, while formalizing previous successful projects between Delta and Cal-Comp, the companies said in a release.

The partnership will permit the combination of Cal-Comp’s CCET 4.0+ platform, AI solutions, and data center run-through manufacturing process with Delta’s DIAEAP-IMM solution, which will bolster parameter consistency, optimize mold flow and significantly reduce production errors.

Taiwanese PCB Industry Enters ‘Wait-and-See’ Mode

TAOYUAN, TAIWAN – The Taiwanese PCB industry grew 9.6% year-over-year in the third quarter, reaching NT227 billion ($7 billion), the Taiwan Printed Circuit Association reported in December.

The association said the quarter was mainly driven by the peak season effect, the mild recovery of mainstream terminal products, as well as the specification upgrades of AI infrastructure (such as servers and network communication equipment) and the boost from the low-orbit satellite market.

Looking ahead to the fourth quarter, lower-than-expected sales of Apple phones and the uncertainty of global markets are driving a strong wait-and-see sentiment, TPCA said. Terminal and downstream enterprises remain conservative in stocking, and the overall growth momentum is restricted. (more)

Clearance and Creepage in PCB Design

An overview of standards and guidelines for high-voltage applications.
by Andrew Gonzales

PCB line spacing is relevant to both safety and function when it comes to traces. Comprised of copper, fuses and insulation, a trace is a conductive connection between different components on a PCB. Numerous factors determine the effectiveness of tracing, including PCB trace widths.

By connecting various signals, the trace is an important connection with its own benefits and avoidable drawbacks.

Traces permit signals to travel between different components. They are necessary but prone to issues, as they are susceptible to potential errors that could lead to a malfunction.

Maximizing Yields with Minimal Iterations

DfM practices for preventing common fab and assembly defects.
by Akber Roy

Printed circuit board (PCB) design is an area of engineering that blends art and science, and a significant portion of the science side falls into manufacturing. Formally, designers know this as design for manufacturing, or DfM, where alignment is achieved between the circuit board’s features and the capabilities of the manufacturing process.

While leveraging the manufacturer’s knowledge to identify design problems that could lead to defects is commonplace, this can drive unnecessary design iterations. Before transitioning a product to manufacturing, certain design practices can help prevent common fabrication and assembly defects.

This is not just about PCB prototyping. The designer’s goal should be to implement practices that help scale a product to volume production at high assembly yield. Some of these design practices start as early as library creation, while others can be applied after a preproduction review by CAM. Let’s dig in and see what can be done to maximize assembly yield.

Comparing Coated vs. Uncoated Stencils

While cheaper to use, uncoated stencils can have a detrimental effect on printing performance.
by Timothy O’Neill

In a recent study focused on optimizing solder paste transfer efficiency, the initial phase used factory-applied coated stencils to isolate and understand the effects of solder alloy powder size on print performance. This approach ensured precise data by minimizing stencil-induced variations.

Our follow-up study explores the implications of using uncoated stencils, which are used in many manufacturing settings.

Factory-applied nanocoated stencils are designed to enhance the release of solder paste, while uncoated stencils are still widely used due to their cost-effectiveness. The choice between these stencils can play a significant role in determining the quality and efficiency of solder paste application.

‘It’s Got to Work’

STI Electronics prides itself on reliability and training the next generation of workers.
by Tyler Hanes

With its home just a few miles from a major military and aerospace testing center, STI Electronics has built a reputation for providing electronics that continue to work through the toughest conditions.

Now in its 43^rd year of operation, STI moved to Madison, AL, from California in 1993. The company settled into its current location – just down the road from Redstone Arsenal, a US Army base that houses NASA’s Marshall Space Flight Center and more than 75 federal agencies – in 2008.

In Case You Missed It

Electromigration

“Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints”

Authors: Prabjit Singh, et. al.

Abstract: Electromigration monitoring of bottom terminated component (BTC) solder joints is limited to electrical resistance measurements of the solder balls. Tracking the microstructural evolution such as bismuth segregation in tin-bismuth solder balls is typically performed via metallurgical cross-sectioning, a destructive technique. Once cross-sectioned, the solder ball is not available for further electromigration current stressing. A novel planar solder geometry has been invented and developed that allows real-time, nondestructive monitoring of solder microstructure, while the progress of electromigration can be concurrently tracked via electrical resistance means. Planar solder joints are easy to fabricate in a typical metallurgical laboratory. If the electromigration behavior of the planar and the BTC solder joints happen to be similar, the planar solder joint approach could greatly aid in the quick development of solder alloys by comparing rates of electromigration and metallurgical changes in planar solders of various compositions. In this work, the electromigration rates and behavior of eutectic SnBi alloy in planar and in BTC solder joints were compared and shown to be similar. This important finding opens the use of planar solder joints for the quick and low-cost development of low-temperature solder alloys. (Journal of Surface Mount Technology, November 2024, https://doi.org/10.37665/aha4dx58)