Siemens’ EDA Group Acquires DownStream Technologies

MARLBOROUGH, MA – Siemens Digital Industries Software announced in April the acquisition of DownStream Technologies, a provider of manufacturing data preparation solutions for printed circuit board (PCB) design. Financial and other terms were not disclosed.

This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market, Siemens said in a press release.

“The acquisition is a significant step for Siemens EDA in the mid-sized PCB market, offering DownStream’s customers improved time to market, quality and cost efficiency,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “Integrating DownStream Technologies enables Siemens EDA to provide the most comprehensive and advanced manufacturing data preparation solution, helping to ensure a smooth transition from design to production within a fully digitalized and scalable electronic systems design process.”

Victory Declares New Fab in Vietnam

BAC NINH PROVINCE, VIETNAM – Victory Giant Technology broke ground in late March on a new $520 million campus at the Bac Ninh Provincial Industrial Park in northern Vietnam.

The project, which will be implemented in two phases out roughly equal investments, received an investment license by local authorities last November.

VGT forecasts factory capacity of 4 million sq. m of high-end PCBs and an annual output value of about $900 million.

Alternatives Growing for Greener PCB Materials, Processes

CAMBRIDGE, ENGLAND – Conventional printed circuit board manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.

That’s according to a new report from technical research firm IDTechEx. During research interviews for the report “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts,” IDTechEx found that recent research and testing developments have resulted in many of these materials approaching full-scale commercial readiness, whilst cost and performance remain a barrier for many others.

SVI, CCTC Partner on PCB Fabrication JV in Thailand

BANG KADI, PATHUM THANI, THAILAND – SVI Public Co. and China Circuit Technology (Shantou) have agreed to a joint venture here where the two companies will build printed circuit boards.

The JV, which is 75% owned by SVI, will produce multilayer and high-density interconnect PCBs.

The firms are investing a combined 1.60 billion baht (about $48 million) in the JV, called Advanced Interconnection Technology Company Ltd.

Foxconn Plans Major North India Expansion with New Manufacturing Site

NOIDA, INDIA – Foxconn is exploring a 300-acre land parcel in Greater Noida for a large-scale manufacturing facility, according to April reports.

If approved, the site would mark its first in North India and could become one of the company’s largest globally.

The facility may rival Foxconn’s upcoming plant in Bengaluru, though the exact products to be manufactured have not been finalized. Talks are ongoing with the Uttar Pradesh government.

Cicor to Acquire Mercury Mission Systems’ Manufacturing Ops

PLAN-LES-OUATES SWITZERLAND – Cicor will acquire a manufacturing operation as part of a strategic supply agreement with Mercury Mission Systems.

The move supports Mercury’s plan to refocus on core engineering and systems integration by outsourcing part of its European electronics production. Cicor will absorb 34 employees and transition manufacturing to its facilities in Newport, UK, and Bronschhofen within 18 months.

Mercury committed to five years of product purchases from Cicor valued in the high double-digit million CHF range. Cicor said the deal strengthens its pan-European platform for mission-critical aerospace and defense electronics and follows its planned acquisition of MADES S.A.U. in Spain.

K&S to Dissolve Electronics Assembly Equipment Unit

SINGAPORE – Kulicke & Soffa will wind down its electronics assembly equipment business and take charges of up to $100 million as part of a revamp of its strategic plan, the company’s board announced in a stock filing.

The company expects to complete the majority of the wind-down activities related to the EA equipment business in the first half of fiscal 2026.

The OEM expects pretax charges, including impairments, in the range of $86 million and $100 million related to the wind down of the EA business.

PCB Design Software Sales Rose 16% YoY in Q4

MILPITAS, CA – Quarterly sales of printed circuit board and multichip module design software jumped 15.9% in the December period to $476 million, the ESD Alliance, a SEMI Technology Community, announced in April.

The four-quarter moving average for PCB and MCM, which compares the most recent four quarters to the prior four, rose 8.3%.

Overall electronic system design (ESD) revenue increased 11% to $4.93 billion in the quarter. The fourth quarter moving average rose 12.8%. (more)

Are You Using Too Many Vias?

Conventional wisdom regarding via count is wrong. Here’s the proof.
by Douglas Brooks

Conventional wisdom has suggested:

The cross-sectional area of a via should have at least the same cross-sectional area as the conductor or be larger than the conductor coming into it. If the via has less cross-sectional area than the conductor, then multiple vias can be used to maintain the same cross-sectional area as the conductor. (IPC-2152, page 26, Note 1)

In other words, if the conducting cross-sectional area of the trace (width * thickness) is n times greater than the conducting cross-sectional area of the via, then we need n vias. Almost the entire industry believed this, including those of us at UltraCAD, until Johannes Adam and I began publishing our research results (Note 2).

In a recent article (Note 3), Adam and I introduced simulation results that showed it is actually a square root relationship. That is, if the cross-sectional areas have a relationship of n, then we only need the square root of n, n^1/2, vias. Herein we provide a proof of that result.

For Design Tools, Another Record. Can It Last?

If a recession is indeed ahead, Wally Rhines thinks the PCB design software industry is a “great place to hide.”
by Mike Buetow

The figure tells the story: sales of printed circuit board design software set yet another record in the fourth quarter. The data, tracked by the ESD Alliance (part of Semiconductor Equipment and Materials International), tell a remarkable tale of growth. The industry has experienced just three year-over-year down quarters over the past decade. 

Wally Rhines, retired chief executive of Mentor Graphics, joins PCEA on the PCB Chat podcast each quarter to share the latest electronic design automation data. The latest podcast was recorded in mid-April and remarks here are edited for length and clarity.

Component Land Patterns: A Primer

A manufacturer’s perspective on determining parts layout.
by Akber Roy

A land pattern refers to the footprint or layout of surface-mount components on a printed circuit board (PCB). It includes the arrangement of pads, or lands, to which component leads or terminals will be soldered. An accurate land pattern is crucial for ensuring reliable solder joints, proper alignment of components and optimal electrical performance of the circuit. Most electronic component manufacturers provide detailed specifications and guidelines for creating land patterns specific to each component, which should be followed closely during PCB design.

Key aspects of a component land pattern include the following:

1. Pad layout: The shape, size and spacing of pads where the component leads will be soldered.
2. Dimensions: Exact dimensions of each pad, including width, length and pitch (distance between pads).
3. Keep-out areas: Areas on the PCB where no traces or components should be placed to avoid interference or damage.
4. Solder mask: The solder mask defines where solder should and should not adhere, ensuring proper connections and preventing solder bridges.
5. Silkscreen: Markings on the PCB indicating component placement, orientation and other important information.

Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization

Catching the stray solder paste.
by Timothy O’Neill

Manufacturing defects in surface mount technology (SMT) assembly can prove persistent and challenging to diagnose without a structured troubleshooting approach. When a contract assembler encountered recurring solder balling on a single capacitor, initial efforts to correct the issue through reflow profile adjustments proved ineffective. This case study demonstrates how a systematic troubleshooting framework can effectively identify and resolve assembly defects.

Identifying the Issue: Initial Observations

Solder balling can result from a range of process variables, including stencil printing errors, placement inconsistencies, reflow conditions and contamination. In this case, the defect affected a specific component, occurring inconsistently but repeatedly. Additional issues, including occasional blowholes, further complicated the diagnosis.

The troubleshooting process began with standard diagnostic questions:

• Was the solder paste fresh and properly handled?
• Did defects consistently occur on the same component and location?
• Were boards misprinted, cleaned or rebaked before use?
• Did adjusting the reflow profile impact defect occurrence?

Elevating ‘Value-Add’ in EMS Engineering through TFT Module Development

The art of designing TFT modules in America is trending downward. It doesn’t have to.
by Joe Fama

In today’s rapidly evolving tech landscape, engineers may not be as well-informed on TFT module optimization as counterparts in Asia. (TFT modules are a type of liquid crystal display panel.) The knowledge gap can be attributed to various factors, leading to American-based EMS providers to operate with a less comprehensive understanding of the latest TFT technology. To the American EMS, it is worth considering the discrepancies in knowledge and areas to focus on.

Over the past decade, the expertise surrounding TFT module design in the US appears to have diminished, largely due to increasing operational costs. Asian TFT manufacturers, feeling the pressure of rising operations and travel costs, have cut back on sending engineers and application specialists to the US for direct technical transfer. American engineers have also scaled back travel to Asia, further limiting face-to-face collaboration and knowledge exchanges.

Due to the lack of physical interaction between US EMS providers and Asian manufacturers, a loss of technical exchanges and visual performance comparatives have occurred. This condition has downgraded the performance of TFT Modules as well as the visual “shelf appeal” of TFT Modules designed for the US market. As a result, American-based engineers are designing box-build products with TFT modules out-of-line with specifications, leading to a loss of opportunity to optimize the TFT module. This raises the question: How can American EMS providers bridge the gap and better integrate cutting-edge display technologies into their designs?

Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency

Nonstop production, no matter the volume.
by Rob Sierra

In the fast-paced world of surface-mount technology (SMT), every second matters. As demand rises for quickturn prototypes, smaller lot sizes and just-in-time manufacturing, businesses face increasing pressure to reduce downtime and minimize waste. In this environment, reel splicing kits have evolved from a niche accessory into an essential tool for optimizing SMT operations.

Whether running high-mix, low-volume builds or driving 24/7 production on high-volume lines, reel splicing kits remain one of the most cost-effective solutions to enhance feeder setup, streamline changeover and improve inventory efficiency.

The hidden cost of setup waste. SMT feeders operate on the same basic principle: components arrive in a carrier tape sealed with cover tape, precisely indexed for pick-and-place machines. But setting up a reel, even with today’s semiautomated feeder loaders, inevitably results in scrap. The first 12″ to 18″ of peeled cover tape usually means scrapped components, especially if they can’t be reintroduced into the feeder. For high-value or limited-supply parts, this isn’t just inconvenient – it’s expensive.

PCB Fabrication

“Next-Generation Printed Circuit Boards Manufacturing: An Innovative Numerical Investigation Using Electroforming Process”

Authors: Ilhem Boutana, et al. 

Abstract: Electroforming emerges as a pivotal and cost-efficient technology, transforming products not only by enhancing their resistance to corrosion but also by elevating their aesthetic appeal. This process applies a precisely controlled metal layer onto a substrate through electrodeposition, yielding a robust, visually striking finish. In this paper, the authors unveil a cutting-edge modeling approach for simulating the electrodeposition process in printed circuit board (PCB) manufacturing, leveraging the capabilities of COMSOL Multiphysics: Electrodeposition Module. The innovative methodology involves a thorough investigation of how varying process parameters influence the deposition’s weight and thickness, thereby ensuring the precision and reliability of numerical simulations. (Advanced Manufacturing Technologies, April 2025)