Renesas to Buy Altium for $5.9B

TOKYO – Renesas Electronics will acquire Altium for A$9.1 billion (US$5.9 billion) in cash, subject to a number of conditions, the companies announced in mid-February. The deal has an enterprise value of A$8.8 billion ($5.7 billion).

The transaction has been unanimously approved by the boards of directors of both companies and is expected to close in the second half of 2024. Completion of the transaction is subject to approval by Altium shareholders, Australian court approval as well as regulatory approvals and other customary closing conditions.

Renesas plans to finance the transaction with bank loans and cash on hand and the transaction is not subject to any financing conditions. Altium will continue to be led by its CEO, Aram Mirkazemi, as a wholly owned subsidiary of Renesas.

Tata Gets Green Light for Wistron iPhone Unit Acquisition

MUMBAI, INDIA – Tata Group received approval from India’s Competition Commission to acquire Wistron’s Indian iPhone production unit, paving the way for Tata to become India’s first homegrown iPhone maker.

Tata and Wistron agreed to the $125 million sale of Wistron’s iPhone factory near Bengaluru in October after Wistron sought to diversify its business beyond iPhone manufacturing into areas such as servers. The company also sold its iPhone production business in China to a competitor in 2020.

Tata was in talks for more than a year to take over the plant as it seeks to forge closer ties with Apple. The deal also advances India’s efforts to create local contenders to challenge China’s dominance in electronics.

EOS/ESD Association Releases Technology Roadmap

ROME, NY – The EOS/ESD Association released its Technology Roadmap, which presents estimated threshold changes in electrostatic discharge (ESD) and the potential impact on ESD control practices through 2030.

In an effort to keep abreast of the evolving electronics industry, the document is updated annually by EOS/ESD Association.

The first section of the roadmap provides estimates of future electrostatic discharge (ESD) thresholds of semiconductor devices and the potential impact on ESD control practices. These levels are strongly technology- and design-dependent and need to be periodically revised in the context of advances in the electronics industry. The second section contains information on device testing trends and characterization from the ESDA and ESDA/Joint Electron Device Engineering Council (Jedec) teams working on these methods. The roadmap also includes an outlook on important trends in the semiconductor industry looking toward 2030 and closes with a section on electronic design, an important contributor to reliable and robust ESD and latch-up design.

UK-Based EC Electronics Acquires Liad Electronics

BASINGSTOKE, UK – EC Electronics has acquired Dutch EMS provider Liad Electronics, growing EC’s presence in mainland Europe and expanding its manufacturing capacity.

Liad Electronics Breda specializes in printed circuit board assemblies, and the company’s operations in the Netherlands will continue to be overseen by Rick Meesters, who will be reinvesting in the group and joining the board, said EC Electronics.

“We are very excited about Liad Electronics joining the EC Group and working with the incredibly experienced team there,” said Phil Simmonds, CEO, EC Electronics. “Liad will now be the foundation for the next stage of our growth plans in mainland Europe and a key part of the future success of the group.”

“The additional services offered by EC will allow us to significantly improve our position and provide extra support to existing relationships,” said Meesters.

Lean Stream, Fuji, Koh Young Unite for Collaborative Workspace

ATLANTA – Lean Stream, Fuji America and Koh Young America have partnered to launch a collaborative workspace in Fremont, CA.

Recognizing the importance of skilled professionals in driving industry progress, the workspace will host comprehensive training programs to empower individuals with the knowledge and skills needed to navigate the evolving landscape of electronics manufacturing. Attendees will explore interconnected systems, artificial intelligence and data analytics that enhance decision-making and streamline production. The goal is to empower manufacturers to embrace Industry 4.0 standards, fostering a new era of efficiency and competitiveness.

“The grand opening event was not just a ribbon-cutting ceremony; it was celebration of collaboration, technology, and progress,” said Joel Scutchfield, general manager of SMT operations, Koh Young. “As we unite our expertise, this innovative hub promises to be a game-changer, showcasing live demonstrations, immersive training sessions, and cutting-edge smart factory solutions for advancements in electronics manufacturing.”

Celestica Adding Capacity in Asia to Meet Higher Demand Needs

TORONTO – Celestica is expanding at electronics manufacturing sites in Thailand and Malaysia in anticipation of greater demand for hyperscale computing applications, the company said on a conference call in January.

Celestica is raising its capital expenditure budget from 1.6% of revenue – $125 million – to 1.75% to 2.25% of anticipated 2024 revenues, said Mandeep Chawla, CFO. The EMS firm expects to front-load the capex spend as it expands capacity in support of its customers’ AI/ML compute and HPS programs.

In Thailand, Celestica is adding more than 100,000 sq. ft. of capacity over multiple phases. Phase one will come online in the current quarter and phase two is expected to be completed in the first half of 2025. The expansion, Chawla said, is “partially funded by a co-investment with one of our hyperscale customers to facilitate demand for highly specialized data center products.”

The Malaysia operations are seeing a slightly smaller expansion, where some 80,000 square feet of capacity is being added for customers in its connective and cloud solutions (CCS) segment. That expansion is expected to come online in the first half of this year, Chawla said.

Tata, Pegatron in Talks for iPhone Assembly Partnership

BENGALURU, INDIA – Tata and Pegatron are reportedly in talks to form a partnership to run an iPhone assembly plant in the Indian state of Tamil Nadu.

Tata is building the plant – its second in India – in Hosur, and is in talks to partner with Pegatron to speed up its plans to start manufacturing, two sources told Reuters.

Pegatron would provide technical and engineering support at the plant, which is expected to have 20 iPhone assembly lines, the sources said, while Tata would hold a majority stake in the venture.

Tata’s other iPhone assembly plant is in the state of Karnataka, which it took over from Wistron last year, and Pegatron operates another assembly plant in Tamil Nadu.

EMA, Hawk Ridge Systems Enter ECAD/MCAD Partnership

ROCHESTER, NY – EMA Design Automation and Hawk Ridge Systems have entered a strategic partnership to offer a full ECAD/MCAD design experience.

Through the partnership, Hawk Ridge Systems will now sell and distribute Cadence and EMA ECAD design solutions to their customers, including Cadence OrCAD X and Allegro X.

“As the ECAD and MCAD domains continue to converge, there is a great need to help customers manage the realities and requirements of a fully integrated design environment across the electrical and mechanical product development process,” said Manny Marcano, President of EMA Design Automation. “Partnering with Hawk Ridge Systems brings two companies together with unmatched expertise in electrical and mechanical design to help customers confidently deliver successfully electromechanical products on the first pass.”

Epoch Expands EMS Operations, Moves to New HQ

SAN JOSE, CA – EMS company Epoch International announced the relocation of its US headquarters to a new larger facility here.

The move will permit its manufacturing subsidiary, Epoch Technologies, to double its production capacity augmented by its UL508 and ISO certification, and underscores its commitment to meeting growing demands with superior design, engineering, and manufacturing services in the North American market, the company said in a release.

The new facility’s Foreign Trade Zone (FTZ) designation and its proximity to the San Jose International Airport also make it logistically convenient and accessible to its international supply chain, Epoch said.

NationGate Acquires Hesechan Industries

KUALA LUMPUR – Malaysian EMS company NationGate Holdings announced the acquisition of Pengang-based Hesechan Industries for RM25 million ($5.2 million).

The acquisition, which includes four factories and an office block, comes as NationGate seeks to acquire additional manufacturing space to facilitate its business expansion, the company said.

“The acquisition represents a strategic investment for expansion, and is undertaken in line with NationGate and its subsidiaries’ long-term plan to grow its business,” NationGate said. “As the group intends to continue expanding its business, it envisages the requirements of additional manufacturing space to facilitate the expansion.”

Kerafol, X2F Strike Thermal Solutions Partnership

LOVELAND, CO – Kerafol and X2F are partnering to develop thermal management solutions for electronic devices using Kerafol’s thermally conductive materials and X2F’s controlled-viscosity molding technologies.

The partnership aims to provide advanced thermal management solutions that meet the ever-increasing high-performance demands of the electronics industry, the companies said in a release.

Combining Kerafol’s high-performance thermoplastic elastomeric materials with X2F’s controlled- viscosity molding (CVM) technology delivers a higher-performance alternative to conformal coating, potting, and sealing of electronics, achieving superior environmental protection and heat dissipation while reducing processing times and manufacturing costs, the companies said.

Icape Makes 2 Italian Acquisitions

FONTENAY-AUX-ROSES, FRANCE – Icape Group in February announced the acquisition of the operating assets of Italian PCB distributor PCS and design company Studio E2.

A PCB producer for more than 30 years, PCS switched to printed circuit board distribution in 2015, and has a portfolio of around 80 customers from the Lombardy industrial area, from all sectors. In 2022, PCS generated an annual net revenue of more than €700,000 ($754,000).

Studio E2 has more than 40 years of experience in project management applied to all sectors of civil and industrial electronics. The company, which consists of three engineers, provides more than 70 customers with a full range of services, from printed circuit design to mechanical and electronic engineering, as well as producing the documentation required at every stage of the product’s life. Studio E2 recorded net annual revenue of more than €275,000 in 2022 ($296,000).

MacDermid Enthone Opens PCB Chemistry Lab in Japan

NAGOYA, JAPAN – MacDermid Enthone Industrial Solutions celebrated the opening of its new lab here on Feb. 1 with a ribbon cutting ceremony and customer event.

The event commenced with a ceremonial ribbon-cutting for the laboratory, hosted by local MacDermid Enthone representatives and global leaders. Matthew Cenzer, principal officer, US Consulate in Nagoya, was in attendance along with automotive customers from across Japan.

“The opening of our laboratory facility in Nagoya is an exciting new chapter for MacDermid Enthone and our partners,” said Hui Hui Kiw, vice president of Asia, MacDermid Enthone. “Our local presence enables us to deliver superior customer support while bringing global capabilities to customers in Japan.”

CIRCUITS ASSEMBLY Opens 2024 Service Excellence Awards

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY has opened registration for its annual Service Excellence Awards (SEAs) for EMS providers and electronics assembly equipment, material, service, and software suppliers.

Now in its 32nd year, the SEAs honor companies for excelling in the critical area of customer service, permitting participants to benchmark customer service against their peers. It is the only industry awards program that uses direct customer feedback to determine best-in-class.

Customers are surveyed to determine their satisfaction with a participating company in various categories, including dependability/timely delivery; manufacturing quality; responsiveness to requests and changes; technology; value for the price; and flexibility/ease of doing business. For each EMS category, the overall best-in-show winner is selected.

USCAR Announces Publication of ‘Roadmap for Automotive Smart Manufacturing’

SOUTHFIELD, MI – The United States Council for Automotive Research LLC (USCAR) in February announced the publication of its “Roadmap for Automotive Smart Manufacturing” for standards-based openness and interoperability of platforms and applications to enable a more productive, competitive and resilient automotive manufacturing environment in the US.

The roadmap was developed by a working group of USCAR, whose members are Ford, GM and Stellantis, in collaboration with CESMII – The Smart Manufacturing Institute. The roadmap’s scope includes strategies to improve interoperability of manufacturing systems and to break down digital silos of legacy platforms.

Smart manufacturing requires a high degree of automation and integration of systems on the shop floor to deliver optimal performance. These systems have evolved over decades in a highly proprietary, closed manner. The resulting landscape of incompatible machine communication creates costly delays and complexity in product launches for automotive companies. Interoperability and extensibility of these machines is imperative to ensure cost-efficient operation and viability.

TTM Expanding VA Operations

STERLING, VA – TTM Technologies in February announced a $13.4 million expansion of its manufacturing plant in Virginia. The expansion involves the purchase of new equipment and a renovation of its plant, which will add 43 jobs to the 200 already located in Sterling, VA.

Loudoun County awarded TTM a Commercial Business Incentive Fund grant for the expansion project, and the company received a Virginia Jobs Investment Program grant from the Virginia Economic Development Partnership.

“TTM Technologies’ decision to go all in with Loudoun is a testament to the strength of our local economy and the quality of our workforce,” said Koran Saines, supervisor, Loudon County. “This expansion will provide valuable job opportunities for Loudoun’s skilled workers and further solidify the county’s position as a leader in advanced manufacturing.”

TT Electronics Opens Mexico Facility

MEXICALI, MEXICO – TT Electronics has expanded its North American operations with a new manufacturing facility here. The 75,000 sq. ft. facility is equipped with the latest technology and manufacturing capabilities to meet the increasing demand for electronics manufacturing solutions in the North America region, the company said.

The plant has capacity for 250 workers and is equipped with up to six automated SMT lines.

“We are thrilled to inaugurate our new manufacturing facility in Mexico, a testament to our dedication to meeting the evolving needs of our customers and expanding our global footprint,” said Michael Leahan, chief operating officer, TT Electronics. “This strategic investment reinforces our commitment to deliver increased value, a world-class service and the capacity to enable our customer’s growth.”

Global Semiconductor Manufacturing Industry Poised for 2024 Recovery, SEMI Reports

MILPITAS, CA – The global semiconductor manufacturing industry recovery is taking hold with electronics and IC sales increasing in the final quarter of 2023 and more growth projected for 2024, SEMI announced in its fourth quarter 2023 publication of the Semiconductor Manufacturing Monitor (SMM) report.

In Q4 2023, electronics sales edged up 1% year-over-year (YoY), marking the first annual rise since the second half of 2022, and growth is projected to continue this quarter with a 3% YoY increase. At the same time, IC sales returned to growth with a 10% YoY jump in Q4 2023 as demand improved and inventories started to normalize. IC sales are forecast to strengthen in Q1 2024 with 18% YoY growth.

Capital expenditures and fab utilization rates are expected to see a mild recovery starting in Q1 2024 after significant declines in the second half of 2023. (more)

Creating the Ultra Library

Building and maintaining what’s said to be the world’s largest CAD database requires strong relationships.
by Tyler Hanes

Keeping up with the increasing demand for new and specialized components is no easy task, but Ultra Librarian’s team has proven up to the task – to the tune of more than 16 million components in its library and a quarter of a million unique downloads per month.

When we visited Ultra Librarian’s office in Huntsville, AL, in early December, EMA Design Automation had just announced the library service’s spinoff into a new ECAD-oriented company, Accelerated Designs, which was the original name of the company under its founder, Frank Frank, before it was acquired by EMA in 2016.

Frank is still with the company today as chief architect, and oversees a team that specializes in the different aspects of maintaining its CAD library.

Optimized Materials to Deliver Ruggedized Electronics

A showcase of testing methods used in the development of robust materials.
by Lenora Clark, Martin Bunce, Paul Salerno and Saskia Hogan

Ruggedization means “to strengthen (something, such as a machine) for better resistance to wear, stress, and abuse.¹” Automotive systems are built for aggressive environments and are categorized as ruggedized electronics. One usually thinks of an all-terrain vehicle navigating an uneven landscape in an extreme hot or extreme cold environment. The systems require more robust electronic hardware due to their unusual working conditions and environmental exposure.

Today’s automotive electronics, specifically those for advanced safety features, require ruggedization against traditional as well as additional self-inflicted abuse. The high level of processing required to execute “sense” and “respond” of multiple safety systems working in concert creates increased heat and increased mechanical strain leading to shorter characteristic life. Advanced IC substrate packages create challenges for the system as well. The need to combat these additional challenges requires specific ruggedization. This work will discuss material choices that were designed to combat temperature, vibration, heat, and various aggressive environments to offer extended system life.

The authors’ purpose is to showcase test methods used in the development of robust materials. The work will bring attention to automotive specifications such as IPC-6012DA² but will focus on the value of material specific testing to inform us on properties and enhancements on the path to system-level testing. Predicting the needs of many different safety systems across the industry for a wide range of design criteria is impossible. The development work brings insight to the steps taken to create materials with wide operating windows that address a range of needs in the automotive space.

Low-Temperature Solder: Challenges, Opportunities and Considerations

An exploration of the factors affecting the development and growth of low-temperature soldering.
by Timothy O’Neill

Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success. 

Herein we explore current challenges and opportunities in low-temperature soldering, including the limited availability of low-temperature alloys, the disadvantages of high-bismuth alloys, the impact of additive elements on alloy properties, the need for new flux systems and the importance of seeking guidance from solder suppliers.

What is Low-Temperature Soldering?

No formal definition exists for “low-temperature” solder, but it generally refers to alloys with peak reflow temperatures lower than those of traditional SAC 305 and its variants. Whereas SAC 305 has a peak reflow temperature window of 230° to 255°C, these alloys typically have peak reflow requirements of 190°C or lower, with SnBi-based materials having peak reflow requirements of 170° to 190°C. 

Can Artificial Intelligence Solve Manufacturing Problems?

Why Andrew Scheuermann thinks AI will be the assistant every engineer has needed.
by Mike Buetow

We in electronics design and manufacturing know automation is part and parcel of what we do, but while the landscape has changed, be it the transition from mechanical drawings to CAD tools with their autorouters or from manual and semiautomatic printers and placement machines to lights-out factories where cobots have replaced operators, the industry still has a long, long way to go.

To help with perspective on this emerging technology, we interviewed Andrew Scheuermann in February. Scheuermann, along with his business partner, Tim Burke, is cofounder and CEO of Arch Systems, a Silicon Valley-based developer of software tools that collect raw machine data and use predictive and analytics to calculate manufacturing key performance indicators or KPIs.

Scheuermann has published numerous scientific papers in the areas of semiconductors, electronics manufacturing, and renewable energy. He has a Ph.D. in materials science from Stanford and is also part of StartX, a startup accelerator for company founders who are affiliated with Stanford and that has invested over $200 million in various crump companies including 13 that are now valued at over $1 billion.

EMI

“Advanced Characterization of a Hybrid Shielding Solution for Reducing Electromagnetic Interferences at Board Level”

Authors: Jorge Victoria, et. al.

Abstract: The development of new advanced functionalities, miniaturization, and the aim of obtaining optimized performance in electronic devices significantly impacts their electromagnetic compatibility (EMC). As electronic components become more densely packed on a printed circuit board (PCB), unintended coupling between components can cause electromagnetic interference (EMI). These requirements result in design restrictions that make using a board-level shield (BLS) essential in reducing intra-system EMI in PCB designs. This contribution focuses on studying and characterizing a BLS solution based on combining a noise suppression sheet (NSS) with an aluminum layer to reduce intra-system EMI coupling. This hybrid solution has the advantage of providing a shielding option that does not require any electronic redesign. It does not need a footprint or a ground connection as it can be affixed over the EMI source. The solution is expected to provide higher attenuation levels than using only an NSS by combining the absorbing properties of the magnetic material and the loss mechanism of the metal. To verify the effectiveness of the hybrid BLS proposed solution, the magnetic near-field emissions of an EMI source are analyzed in this study. The experimental measurements and simulated results demonstrate a significant increase (51.6dB at 1GHz) in the shielding effectiveness (SE) provided by the proposed solution compared to a conventional NSS. (Electronics, January 2024, https://doi.org/10.3390/electronics13030598)