Altair ECAD Integrates Ultra Librarian Parts Library

TROY, MI – Ultra Librarian’s CAD model library is now available to Altair users in several Altair ECAD verification and multiphysics solutions, including Altair PollEx, Altair SimLab, and Altair One UDE.

Ultra Librarian gives users instant access to more than 16 million symbols, footprints, and 3-D models and provides a comprehensive, cloud-based library that eliminates the need for manual building and maintenance.

“Integrating Ultra Librarian into Altair tools is a massive step for our ECAD verification and multiphysics solutions, which will give users more power than ever before,” said Sam Mahalingam, chief technology officer, Altair. “Now, users have access to verified Ultra Librarian CAD models directly from within Altair desktop applications and cloud-based systems. This makes workflows far more accurate and efficient – saving time, effort, and costs.”

Kinwong Joins PCB Fabs with Thai Site Plans

SHENZHEN – Kinwong Electronic plans to invest CNY700 million ($96 million) in a new printed circuit board production site in Thailand, joining a host of other board fabricators migrating to or expanding in Southeast Asia to mitigate the potential impacts of trade wars between the US and China.

The site, to be located in Prachinburi province, will be built in phases depending on market needs and the company’s finances, the firm said.

Kinwong joins Shenzhen Jove PCB, Huizhou China Eagle Electronic Technology, Aohong Electronics, ASKPCB, Yahao, Shengyi and several other PCB fabricators and suppliers among those that have announced plans to expand in Thailand.

Kinwong was the world’s 15th-largest PCB supplier by revenue in 2022, with sales of more than $1.56 billion, according to the latest NTI-100 list, published this month by PCD&F/CIRCUITS ASSEMBLY.

nScrypt Receives Patent for Modular Mobile Direct Digital Manufacturing System

ORLANDO, FL – Florida-based microdispensing specialist nScrypt has received a patent for a shipping container-based modular system tailored for direct digital manufacturing.

The Modular Mobile Direct Digital Manufacturing System features exceptional adaptability in managing a vast spectrum of materials, spanning from high and low-temperature thermoplastics to formidable substances such as metals and ceramics, the company said.

“This shipping-containerized direct digital manufacturing system fulfills the promise of regional, local, and distributed manufacturing,” said nScrypt CEO Ken Church. “It can respond in real time to changing demands, even autonomously if necessary. With a system covered by this patent, anyone can 3-D manufacture almost anything, anywhere, anytime.”

Icape Expands German PCB Presence with Princitec Acquisition

FONTENAY-AUX-ROSES, FRANCE – Icape Group has strengthened its presence in Germany with the acquisition of Princitec, a Düsseldorf-based PCB supplier.

Since 2004, Princitec has been providing the full range of technical, sourcing and quality services associated with the distribution of printed circuit boards, and backed by a network of 11 distributors in Asia and Europe, the company benefits from the commercial capacity to meet the needs of a wide variety of industries within very tight deadlines, thanks in particular to its wide range of products, Icape Group said in announcing the acquisition.

With a base of 35 active customers, mainly located in Germany, Princitec generated revenue of €6.5 million ($7 million) in 2022, with a gross margin of around 25.5%.

With this transaction, Icape said it is unlocking a significant synergy potential while continuing to diversify its sourcing. Following the acquisition of HLT announced at the end of May 2023, the acquisition also strengthens Icape’s position in Germany, Europe’s leading PCB market.

DuPont to Collaborate with YMT To Enhance Korean Service

SEOUL – DuPont announced a collaboration with Korean PCB manufacturer YMT to better address local customer needs.

Under the collaboration, DuPont’s circuit imaging material expertise will be combined with YMT’s local network. YMT has also invested in establishing a dry-film slitting facility in Ansan, Korea, and expects operations to begin in October.

“We are excited by growing our relationship with DuPont,” said Peter Baek, chief business officer and vice president, YMT. “By aligning more fully with DuPont, we can leverage our strength in technical service and logistics to meet the varied needs of our customers as the industry continues to grow. We are confident that our collaboration will create long-term value for our customers.”

TNO Presents Roadmap to Sustainable Printed Electronics

EINDHOVEN, NETHERLANDS – An estimated 1.2 metric tons of printed circuit boards annually end up as e-waste, but only a third is recycled in environmentally sound facilities. This means that around 800 million kilograms may be traded, recycled in a noncompliant and polluting manner, or end up in a landfill.

To help lower that number and develop a more ecofriendly alternative to PCBs, TNO at Holst Centre has developed a roadmap to sustainable printed electronics that promotes the development of hybrid and printed electronics (HPE). This technology is a big step forward compared to PCBs, according to TNO, but much more is needed to achieve circular production of next-generation electronics.

Transitioning from PCBs to HPE (Hybrid and Printed Electronics) provides immediate opportunities to achieve ecological benefits: reduced device thickness, lower weight, printed sensors, and additive instead of deductive manufacturing of the circuitry.

BYD to Buy Jabil’s Mobility Unit for $2.2B

SHENZHEN – Chinese automaker BYD’s electronics unit has agreed to purchase Jabil’s mobile electronics manufacturing business in China for 15.8 billion yuan ($2.2 billion).

The deal will expand BYD Electronic’s customer base, product portfolio and its smartphone components business as it looks to capture Jabil’s potential growth in the sector, the company said.

“The acquisition will also ensure long-term sustainable development while creating value for customers and shareholders,” said Wang Nianqiang, CEO, BYD Electronic.

Kaynes to Build OSAT, PCB Fab Facilities in India

KARNATAKA, INDIA – Kaynes Technology has signed an agreement with the Indian state of Karnataka in which the state government will invest Rs 3,750 crore ($435.9 million) for two Kaynes subsidiaries to set up a PCB manufacturing plant and a semiconductor assembly and testing (OSAT) facility.

In a BSE stock exchange filing, Kaynes said Kaynes Semicon Private Limited will lead the setup of the OSAT facility and Kaynes Circuits India Private Limited will spearhead the establishment of a PCB manufacturing plant for producing complex multi-layered boards.

The investment agreement is meant to help in creating 3,200 jobs in Karnataka by harnessing collective expertise, meeting pressing demands, and making Karnataka a hub for cutting-edge semiconductor manufacturing.

Vexos Expands Operations with ControlTek Acquisition

NEW YORK – Vexos has acquired Vancouver, WA-based ControlTek, expanding the EMS provider’s footprint to the US’ West Coast to help meet growing customer demands. Financial terms of the deal between the two privately held companies were not disclosed.

The new facility features three SMT lines, specializes in low-to-mid volume, high mix production, and serves the medical, industrial, and aviation, space, and defense markets. The acquisition adds to Vexos’ existing locations in LaGrange, OH; Markham, Ontario, Canada; Ho Chi Minh City, Vietnam; Dongguan, China; and Hong Kong.

ControlTek has significant accreditations and certifications to support these markets including ISO 9001:2015, ISO 13485:2016, AS9100D:2016, ITAR, IPC, ANSI, AS5553, and is FDA registered, and its in- house electronic design engineering capabilities, and strong new product introduction skills make it a perfect fit for Vexos, the company said in a release.

Dixon Technologies to Build Smartphone Factory in New Delhi

NEW DELHI – Dixon Technologies is planning a 300,000 sq. ft. factory here to produce Xiaomi smartphones, as India pushes Chinese tech firms to use local assembly partners.

Dixon will invest more than 4 billion rupees ($48.2 million) over three years in the factory, which is set to be inaugurated by a government official toward the end of September.

Beijing-based Xiaomi has been compelled to partner with Dixon for smartphone assembly because India is pressing Chinese companies to localize everything from manufacturing to distribution of devices. In a similar move earlier this year, Xiaomi contracted with India’s Optiemus Electronics to make its Bluetooth neckband earphones, a product it previously imported from China.

EW Healthcare Partners Invests in Enercon Technologies

NEW YORK – EW Healthcare Partners has announced an investment in Enercon Technologies to become a majority shareholder in the business.

Enercon was founded in 1980 by Walter Hebold and Ronald Marcotte and performs contract design, engineering, and manufacturing. It services customers in the medical device, life sciences, and industrial/defense end-markets. Enercon’s revenues have more than doubled since 2019, when the company’s new facility came online following $26 million of investment by the founders to significantly expand capacity to about 100,000 sq. ft. in support of robust demand from customers.

PCEA Training Announces Final 2023 Classes

PEACHTREE CITY, GA – PCEA Training’s final five-day training class this year is set for Dec. 4-8. The program is designed for printed circuit engineers, layout professionals, and other individuals currently serving in the design engineering industry or seeking to get into it.

These instructor-led classes cover the gamut of printed circuit design engineering, from layout, place and route to specifications and materials to manufacturing methods. Schematic capture, signal integrity and EMI/EMC are also part of the comprehensive program.

There are no prerequisite requirements to enroll. Upcoming classes will be held online. All courses are led by experienced instructors.

Rick Hartley Receives 2023 PCEA Leadership Award

SANTA CLARA, CA – PCEA announced Rick Hartley as recipient of the annual PCEA Leadership Award, for his lifetime service in the pursuit of educating and training PCB design engineers.

The announcement was made at the PCEA annual meeting in conjunction with the PCB West conference and exhibition.

Bob McCreight Named 2023 PCEA Membership Award Recipient

SANTA CLARA, CA – Silicon Valley chapter president Bob McCreight has been named the second annual PCEA Membership Award recipient. The announcement was made at the PCEA annual meeting in conjunction with the PCB West conference and exhibition.

McCreight has been the president of the Silicon Valley chapter of PCEA since its inception. He currently works for Tesla as a printed circuit board assembly (PCBA) designer and has been active in the printed circuit industry for more than 30 years.

PCB East 2024 Conference Task Group Named

PEACHTREE CITY, GA – A new slate of engineers has been named to the PCB East 2024 Conference Task Group. Troy Hopkins, senior hardware design engineer at Connect Tech Inc., will be leading the group as the chairman alongside nine other printed circuit industry veterans.

Other industry experts in the task group include Stephen Chavez, Tomas Chester, Rick Hartley, James Jackson, Matt Leary, Matthew McBride, Dale Parker, Carl Schattke and Susy Webb.

PCEA Issues Call for Abstracts for PCB East 2024

PEACHTREE CITY, GA – The PCEA Conferences Task Group seeks abstracts for the upcoming PCB East technical conference, coming to the Boston suburbs next spring. The conference will focus on training and best practices for printed circuit board design engineers, electronics design engineers, fabricators and assemblers.

The four-day technical conference will take place Jun. 4-7, 2024, in Boxborough, MA. The event includes a one-day exhibition on Jun. 5.

PCB West 2023 Show Registration Grew 5%

PEACHTREE CITY, GA – Nearly 2,000 industry professionals, representing 36 countries and 46 states, registered for the PCB West conference and exhibition held last month. Overall attendance was up 5% year-over-year, and the show floor was completely sold out for the exhibition.

The annual conference took place Sept. 19-22, including a one-day exhibition on Sept. 20, at the Santa Clara (CA) Convention Center. It attracted engineers and other professionals from a range of printed circuit and electronics design, fabrication, assembly and advanced packaging companies.

Rio Grande Valley. The chapter is planning its October meeting. Doug Brooks will speak on PCB trace temperature myths (vias get hot, current density matters, and thermal vias work). 

CCL Demand Took Hit in 2022, Says Prismark Study

COLD SPRING HARBOR, NY – Compared to 2021, 2022 was a tough year for the copper-clad laminate (CCL) market. Some main reasons include inventory adjustments by end market customers, declines in material ASPs, and exchange rate fluctuations. Lower demand for PCs, TVs, and consumer electronics applications impacted the conventional materials market. All these factors resulted in a sharp decline in both revenues and profits for CCL materials suppliers throughout 2022. (more)

Will IC Package Substrate Makers be Next to Rule?

Massive investment suggests the segment could occupy a major portion of the largest fabricators’ production.
by DR. HAYAO NAKAHARA

The heartbreak of the pandemic of 2020-21 is receding, but printed circuit fabricators continued to feel the supply-chain reverberations throughout the past year. The rollercoaster gyrated from a sharp dip to an intense high, with demand for consumer electronics, autos and other electronics resulting in tight inventories and long lead times. Then came the inevitable slowdown. Regionalization, currency swings and price cuts played havoc with manufacturers’ order books and financials.

That’s the picture drawn by this, the 26th NTI-100 report. As in the past several years, a rough conclusion is “big gets bigger and faster.” Due to exchange rates that were favorable to the US dollar in 2022, the author thought there would be changes in the rankings, but they remained approximately the same as in 2021. Japanese fabricators were a surprise. Despite a 20% loss in value against the US dollar, their world ranking remained almost the same as in 2021. Domestic customers wanted to get PCBs from within the country because of supply-chain disruptions in China, resulting in good order intake.

As in the past, the author would like to thank various trade organizations and many firms and friends who provided vital information that enabled the compiling of this report. Any errors in this report are the responsibility of the author.

‘A Seamless Solution’

With new leadership at the helm, Freedom CAD is looking to the future while maintaining its standards.
by TYLER HANES

Freedom CAD has been offering electronic product development and PCB design services since its inception in 2003, but the core team behind the company has been together since the early ’90s.

That leadership has built the company into one of the largest design service bureaus in the US, offering design and engineering services for more than 150 customers per year – many of whom have been customers since the early days.

“We have a long history, and with that, we have a long history with our customers,” said COO Scott Miller.

Advanced Substrates for Power-Dense Applications

Enhanced insulated metal substrates are effective for wide-bandgap semiconductor power modules.
by STEVE TAYLOR

Step on the pedal of a modern electric vehicle (EV) and you will feel quick, smooth acceleration. This smooth acceleration is due to improvements in converting DC battery energy into three-phase AC power that controls torque and speed. Although most headlines focus on advancements in EV battery design, it is improvements in power switching in the traction inverter that has led to better performance and power management in the vehicle’s propulsion system.

The demand for advanced high-performance power systems is far-reaching. Many industries are searching for innovative materials and technologies that will meet the needs of next generation power electronics. Trends in the marketplace are toward more compact power devices that can operate under extreme conditions. Higher temperatures, higher switching frequencies and higher blocking voltages are in demand, while efficiency and reliability issues are obstacles that need to be overcome.

Adhesives

“Sustainably Sourced Components to Generate High-Strength Adhesives”

Authors: Clayton R. Westerman, et al.

Abstract: Nearly all adhesives are derived from petroleum, create permanent bonds, frustrate materials separation for recycling, and prevent degradation in landfills. When trying to shift from petroleum feedstocks to a sustainable materials ecosystem, available options suffer from low performance, high cost or lack of availability at the required scales. Here the authors present a sustainably sourced adhesive system, made from epoxidized soy oil, malic acid and tannic acid, with performance comparable to that of current industrial products. Joints can be cured under conditions ranging from use of a hair dryer for 5 min. to an oven at 180 °C for 24 hr. Adhesion between metal substrates up to around 18MPa is achieved, and, in the best cases, performance exceeds that of a classic epoxy, the strongest modern adhesive. All components are biomass derived, low cost and already available in large quantities. Manufacturing at scale can be a simple matter of mixing and heating, suggesting that this new adhesive may contribute towards the sustainable bonding of materials. (Nature, Sept. 13, 2023, https://www.nature.com/articles/s41586-023-06335-7)