JEDEC Updates DDR5 SDRAM Standard

ARLINGTON, VA – JEDEC in April published the JESD79-5C DDR5 SDRAM standard, which includes features designed to improve reliability and security and enhance performance in applications from high-performance servers to emerging technologies such as AI and machine learning.

JESD79-5C introduces a method to improve DRAM data integrity called Per-Row Activation Counting (PRAC). PRAC precisely counts DRAM activations on a wordline granularity. When PRAC-enabled DRAM detects an excessive number of activations, it alerts the system to pause traffic and to designate time for mitigative measures. These interrelated actions underpin PRAC’s ability to provide a fundamentally accurate and predictable approach for addressing data integrity challenges through close coordination between the DRAM and system.

JESD79-5C DDR5 also:

• Expands timing parameters definition from 6800Mbps to 8800Mbps
• Includes DRAM core timings and Tx/Rx AC timings extended up to 8800Mbps, compared to the previous version which supported only up to 6400 timing parameters and partial pieces up to 7200 DRAM core timings

TTM Opens PCB Fabrication Plant in Penang

PENANG – TTM Technologies officially opened a $200 million, state-of-the-art printed circuit board manufacturing plant here, its first in Penang. TTM anticipates that the new plant will generate annual revenue of about $180 million (approximately RM855 million) by 2025.

Built on 27 acres in Penang Science Park, the printed circuit board fabricator’s state-of-the-art automated facility is customized to support mass production for various commercial end-markets, including networking, data center computing, medical, industrial, and instrumentation.

The new facility is configured to minimize energy and water consumption and will reduce the carbon footprint by 60% compared to a traditional PCB plant while still meeting rigorous environmental operational standards.

Arlon EMD Announces CA Expansion

RANCHO CUCAMONGA, CA – Arlon EMD has announced an expansion of its factory here, which will include the addition of two prepreg treaters and a press line.

The expansion will permit a larger portfolio of products to be manufactured in North America, improving responsiveness to the regional market and mitigating risk and capacity surges, the company said.

Arlon EMD, which was acquired by Elite Materials Company in 2020, has provided high-performance thermoset substrates for mission-critical printed circuit boards manufactured for high endurance and long-life programs for 45 years.

Thales Expands PCB Production Capabilities in Germany

ARNSTADT, GERMANY – Thales Group has expanded its circuit board production capabilities at its Industrial Competence Center here, citing an increased demand among Germany and Europe’s rail systems.

The company said circuit boards are critical components for the railway industry to make the rail infrastructure in Germany and Europe fit for the future, and global supply bottlenecks can threaten that goal.

To prevent supply issues, Thales said it has made its circuit board production more efficient.

Orbic to Reshore PC Manufacturing in NY

HAUPPAUGE, NY – Orbic Electronics has purchased a 27,000 sq. ft. building and three acres of land here for $6.6 million as part of its plan to move manufacturing from China to the US.

Orbic, which manufactures phones, laptops and other electronic devices, announced its Project Patriot plan in January, which will see it bring as many 1,000 jobs to Long Island in the next five years. The company previously received an incentive from the Suffolk County Industrial Development Agency to lease and renovate a 70,000 sq. ft. building in Hauppauge as part of a $30.8 million investment.

“This initiative is a stride forward in our vision of a sustainable, job-creating future,” said Mike Narula, president and CEO, Orbic. “Project Patriot is set to be a very exciting time in our company’s history, and Suffolk County is the perfect location for the bulk of our work to advance the production of American-Made products and grow American manufacturing jobs. Having our products read ‘Made in America’ is a tremendous point of pride for us, and it will also allow our company to bolster the local economy, helping other vendors in Suffolk County succeed alongside us.”

IPC Releases ‘J’ Revisions to 2 Electronic Assembly Standards

BANNOCKBURN, IL – IPC has announced the release of “J” revisions for two standards often used together for the manufacture of electronic assemblies.

IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies, is the industry-consensus standard for soldering processes and materials and IPC-A-610J, Acceptability of Electronic Assemblies, is a post-assembly acceptance  visual standard.

Revisions to these standards are completed every three years, with significant changes made to each one. Committee leaders addressed more than 1,350 comments for revision “J.”

Ibase Breaks Ground on Vietnam Manufacturing Facility

VINH PHUC, VIETNAM – Ibase Technology has broken ground on a new manufacturing facility here, with plans to begin operations in early 2025.

The new factory will include six assembly lines for SMT and DIP, along with 10 system assembly lines, and will increase Ibase’s monthly PCBA capacity by 60,000 and its monthly system assembly capacity by 30,000 for board and system-level embedded and networking products, the company said.

“We have achieved a significant milestone in our company’s endeavor to expand our manufacturing capabilities in Vietnam. This marks our first plant outside Taiwan and is an integral part of our long-term manufacturing roadmap aimed at providing our customers with the capacity they need for years to come and to meet their demands for greater flexibility, efficiency and quality,” said C. S. Lin, chairman, Ibase Technology. “The AI revolution is underway, with the adoption of AIoT devices and the power of edge computing coming together to unlock the potential of edge AI. With over 20 years of experience in the IPC field, Ibase has the expertise to design and manufacture edge AI computing platforms essential for today’s AI era. The new plant in Vietnam will be instrumental in the success of our edge AI initiatives.”

NCAB Group Acquires Belgian PCB Supplier

STOCKHOLM – NCAB Group has expanded into Belgium with the acquisition of PCB supplier Cumatrix BV.

Cumatrix’s net sales amounted to SEK7 million ($652,000) in 2023 with an EBITA margin of about 7%. The company has two employees, and the majority of its sales are for the industrial sector with sourcing from manufacturing partners in China.

NCAB said the acquisition is expected to be earnings accretive in 2024, and synergies are expected in the areas of suppliers, payment terms and logistics.

Colorado EMS to Expand, Add 100 Jobs

COLORADO SPRINGS, CO – Spectrum Advanced Manufacturing Technologies has received $1.3 million in tax credits from the Colorado Economic Development Commission to expand its operations here and add up to 101 new jobs.

The planned expansion will include two new building at its existing campus, including a 12,500 sq. ft. manufacturing center which will house ISO 8 Class cleanrooms for the production of AR/XR headsets and 3-D monitors, plus a 3,000 sq. ft. segregated cleanroom facility reserved for wiring and harnessing.

“This expansion signifies a strategic response to the growing demand for Spectrum AMT’s expertise in high-reliability electronics manufacturing and assembly,” said Jeff Gilbert, COO, Spectrum AMT. “We are deeply appreciative of our partnership with 5Star Bank and remain firmly committed to not only supporting critical industries like aerospace and defense but also contributing meaningfully to the advancement of technologies that shape the future, from space exploration and scientific discovery to addressing global medical challenges. We are proud to be part of a Colorado ecosystem that fosters innovation and economic growth, and we are excited to continue playing a vital role in Colorado Springs. This community has been instrumental in our beginning and continued success.”

Zetwerk Plans Expansion of EMS Capacity

NEW DELHI – Zetwerk has announced a Rs1,000 crore ($119.6 million) investment to ramp up its electronics manufacturing capacity.

The company currently produces one device per second from its Noida factory in India’s Uttar Pradesh, and plans to expand to 60 assembly lines from its current 16 lines across six manufacturing facilities. The expansion will enable Zetwerk to cater to major multinational corporations and OEMs in the computer devices segment through its Bangalore facility, the company said.

The company will manufacture motherboards, desktop PC power supplies and other electronic components, and said it aims to become a leading original design manufacturer and electronics manufacturing services provider.

Fineline Acquires German PCB Maker

HAZOREA, ISRAEL – Fineline Global has announced the acquisition of German PCB supplier IBR Leiterplatten.

IBR will continue to operate independently and will now strengthen its position in the market, benefiting from additional production capacities, resources and infrastructure from the strong Fineline network, Fineline said in a release announcing the acquisition.

Existing projects and day-to-day operations will remain unchanged for IBR customers, the company said.

KLA to Exit FPD Business

MILPITAS, CA – KLA announced in April that it is exiting the flat panel display (FPD) business by the end of the year, but will continue to provide services to the customer base for its discontinued products.

The company said the decision is based on multiple factors, including the cancellation of a new technology product by a major customer – reportedly Apple’s recent scrapping of its microLED watch project – and it is investigating alternatives to the FPD business. FPD revenues accounted for 1.4% of the company’s total revenue in 2023.

Apple’s decision to cancel the microLED watch has affected other companies, as Ams-Osram also announced that it is considering its options after a canceled project and estimates its loss at $650 million to $900 million, while Kulicke & Soffa said it will also see losses of $110 million to $130 million after it had an Apple project canceled.

iNEMI Publishes First Wave of Online Roadmaps

MORRISVILLE, NC – The International Electronics Manufacturing Initiative (iNEMI) has published the first roadmap topics in its new format, with printed circuit boards, sustainable electronics, smart manufacturing and mmWave materials and test now available online.

“The in-depth content on these topics is intended to help companies align technology progress with their respective commercial interests and to support high-volume manufacturing,” said Francis Mullany, iNEMI director of roadmapping. “The new format provides a more structured, accessible view of the roadmap that is easily updated based on market movements and technology innovations. And, of course, the roadmap continues to chart the future evolution of electronics manufacturing in terms of application drivers, technical needs, gaps, and technical solutions over a 10-year horizon to help guide R&D investment decisions by industry as well as public research programs and government agencies.”

The initial wave of roadmap topics focuses on key technologies and cross-cutting topics critical to complex integrated systems (CIS), as discussed in a recent iNEMI/IPC whitepaper “Complex Integrated Systems: The Future of Electronics Manufacturing.” The scope of each topic area now available is described below:

New Kaga Factory to Receive METI Subsidy

SAN LUIS POTOSÍ, MEXICO – Kaga Electronics’ factory construction project here will receive a 100 million yen ($660,000) boost from Japan’s Ministry of Economy, Trade and Industry as part of its Indo-Pacific and Central-South America Regional Supply Chain Involvement Support Project.

The Indo-Pacific and Central-South America Regional Supply Chain Involvement Support Project is a subsidy scheme implemented by METI to encourage business initiatives that contribute to increasing the resilience of supply chains between Japan and the Indo-Pacific and Central-South America regions.

Kaga announced the Mexico factory in August, and through its subsidiary, Taxan Mexico, aims to strengthen and expand its production base to meet the increasing demand for EMS in Mexico. In addition to meeting an increase in orders from existing customers, the new factory is also designed to attract new customers through the assembly of circuit boards used in air-conditioning equipment for the US market, the company said.

Flex, IC Substrates Demand Give Cheer to Japan PCB Market

TOKYO – Printed circuit board production in Japan in February fell 9.3% from a year ago, falling to 757,000 sq. m. It was the 25th straight month of decline.

Sales fell 11.4% to 44.3 billion yen ($286 million), down the 16th month in a row. The year-over-year drop has reached double digits in 12 straight months.

The data include production of rigid and multilayer boards, flexible circuits and IC substrates, and are tabulated by the Japan Electronics Packaging Circuits Association (JPCA). (more)

How the PCB Stackup Helps Control EMI

Power and signal placed on outer layers minimize radiated emissions.
by Akber Roy

The PCB stackup is like a building’s foundation; a product not built on a strong base will fall apart. When electromagnetic compatibility (EMC) testing is considered, the PCB stackup is a major determinant of radiated EMI, and to some extent, conducted EMI. A PCB stackup design that enables low EMI also aids signal integrity and power integrity, as all these areas are linked and must be considered in totality.

So, to ensure a PCB design passes EMC testing, understand the stackup’s role in generating emissions and determining EMI susceptibility. Simple changes in materials, layer assignments, and routing strategies can make the difference between passing and failing EMC tests. All these decisions originate in the PCB stackup.

Key Elements in PCB Stackup Design

For experienced designers, stackup design isn’t terribly complex, even for designs that require high-speed routing or RF interconnects. From an EMC perspective, effectively managing EMI and reducing susceptibility hinges on a few key parameters:

Performance Comparison of Contemporary Stencil Coatings and Underwipe Solvents on 0.4mm BGA Packages

Should chemistry formulation and drying time factor into solvent selection?
by Chrys Shea, Debbie Carboni and John Hanerhoff

The practice of periodically wiping excess solder paste off the side of the stencil that contacts the PCB during the printing process can take many different forms and frequencies. The objective of wiping is to remove unwanted solder paste from the contact side of the stencil.

How does solder paste find its way to the contact side of the stencil? By nature, solder paste sticks to both the PCB pad and the stencil. It does not fully release from the aperture upon separation, depending on the area ratio (AR) of the aperture. Very often, transfer efficiency (TE), or the amount of solder paste removed from the aperture, is less than 100%. The remaining paste often forms “strings” that snap back to the stencil’s contact side (Figure 1).

Investigating Intermittent Soldering Defects

Resolving solder issues requires an examination of the entire process.
by Timothy O’Neill

The PCB assembly process creates millions of solder joints with great precision, which is why intermittent soldering defects can be particularly frustrating. It is common to assume that soldering materials, such as solder paste and flux, are the primary cause of these issues. But is solder always to blame? 

In this article, we explore a real case study and shed light on the importance of accurate diagnosis and vendor collaboration.

A common misconception is that if there is a solder defect, the soldering materials are at fault. Fortunately, solder paste is not an intelligent entity capable of selectively causing defects. Solder paste is, in essence, a passive material that follows the instructions given to it during the assembly process.

In Case You Missed It

AOI

“PCB Defect Detection Algorithm Based on CDI-YOLO”

Authors: Gaoshang Xiao, et. al.

Abstract: Existing deep learning-based PCB defect detection methods are difficult to simultaneously achieve the goals of high detection accuracy, fast detection speed, and small number of parameters. Therefore, the authors propose a PCB defect detection algorithm based on CDI-YOLO. First, the coordinate attention mechanism (CA) is introduced to improve the backbone and neck network of YOLOv7-tiny, enhance the feature extraction capability of the model, and thus improve the accuracy of model detection. Second, DSConv is used to replace part of the common convolution in YOLOv7-tiny to achieve lower computing costs and faster detection speed. Finally, Inner-CIoU is used as the bounding box regression loss function of CDI-YOLO to speed up the bounding box regression process. The experimental results show that the method achieves 98.3%mAP on the PCB defect dataset, the detection speed is 128 frames per second (FPS), the parameters are 5.8M, and the giga floating-point operations per second (GFLOPs) is 12.6G. Compared with the existing methods, the comprehensive performance of this method has advantages. (Nature, March 2024, https://doi.org/10.1038/s41598-024-57491-3)